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http://dx.doi.org/10.5370/KIEE.2017.66.11.1600

A Study on the Thermal and Electrical Properties of Fabricated Mo-Cu Alloy by Spark Plasma Sintering Method  

Lee, Han-Chan (Heat Treatment R&D Group, Korea Institute of Industrial Technology, Research Institute of Advanced Manufacturing Technology)
Lee, Boong-Joo (Dept. of Electronic Engineering, Namseoul University)
Publication Information
The Transactions of The Korean Institute of Electrical Engineers / v.66, no.11, 2017 , pp. 1600-1604 More about this Journal
Abstract
Mo-Cu alloys have been widely used for heat sink materials, vacuum technology, automobile and many other applications due to their excellent physical and electronic properties. Especially, Mo-Cu composites with 5~20 wt% copper are widely used for the heavy duty service contacts due to their excellent properties like low coefficient of thermal expansion, wear resistance, high temperature strength and prominent electrical and thermal conductivity. In most of the applications, high dense Mo-Cu materials with homogeneous microstructure are required for high performance, which has led in turn to attempts to prepare ultra-fine and well-dispersed Mo-Cu powders in different ways, such as spray drying and reduction process, electroless plating technique, mechanical alloying process and gelatification-reduction process. However, most of these methods were accomplished at high temperature (typically degree), resulting in undesirable growth of large Cu phases; furthermore, these methods usually require complicated experimental facilities and procedure. In this study, Mo-Cu alloying were prepared by planetary ball milling (PBM) and spark plasma sintering (SPS) and the effect of Cu with contents of 5~20 wt% on the microstructure and properties of Mo-Cu alloy has been investigated.
Keywords
Mo-Cu alloy; Spark plasma sintering; Electrical properties;
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