• Tribology and Lubricants
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• v.36 no.2
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• pp.88-95
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• 2020

In this study, we investigate the mechanical properties of high manganese steel, and the friction and wear characteristics of brake friction material containing this steel, for passenger car application, with the aim of replacing copper and copper alloys whose usage is expected to be restricted in the future. These steels are prepared using a vacuum induction melting furnace to produce binary and ternary alloys. The hardness and tensile strength of the high manganese steel decrease and the elongation increases with increase in manganese content. This material exhibits high values of hardness, tensile strength, and elongation; these properties are similar to those of 7-3 brass used in conventional friction materials. We fabricate high manganese steel fibers to prepare test pad specimens, and evaluate the friction and wear characteristics by simulating various braking conditions using a 1/5 scale dynamometer. The brake pad material is found to have excellent friction stability in comparison with conventional friction materials that use 7-3 brass fibers; particularly, the friction stability at high temperature is significantly improved. Additionally, we evaluate the wear using a wear test method that simulates the braking conditions in Europe. It is found that the amount of wear of the brake pad is the same as that in the case of the conventional friction material, and that the amount of wear of the cast iron disc is reduced by approximately 10. The high manganese steel is expected to be useful in the development of eco-friendly, copper-free friction material.

• Korean Journal of Materials Research
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• v.29 no.6
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• pp.343-348
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• 2019

Structural and mechanical effects of the dynamical precipitation in two copper-base alloys have been investigated over a wide range of deformation temperatures. Basing upon the information gained during the experiment, also some general conclusion may be formulated. A one concerns the nature of dynamic precipitation(DP). Under this term it is commonly understood decomposition of a supersaturated solid solution during plastic straining. The process may, however, proceed in two different ways. It may be a homogeneous one from the point of view of distribution and morphological aspect of particles or it may lead to substantial difference in shape, size and particles distribution. The effect is controlled by the mode of deformation. Hence it seems to be reasonable to distinguish DP during homogeneous deformation from that which takes place in heterogeneously deformed alloy. In the first case the process can be analyzed solely in terms of particle-dislocation-particle interrelation. Much more complex problem we are facing in heterogeneously deforming alloy. Deformation bands and specific arrangement of dislocations in form of pile-ups at grain boundaries generate additional driving force and additional nucleation sites for precipitation. Along with heterogeneous precipitation, there is a homogeneous precipitation in areas between bands of coarse slip which also deform but at much smaller rate. This form of decomposition is responsible for a specially high hardening rate during high temperature straining and for thermally stable product of the decomposition of alloy.

• Applied Microscopy
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• v.36 no.2
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• pp.47-55
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• 2006

In this paper a transmission electron microscope (TEM) observation of fine Cu precipitates distributed randomly in Al-2.5Cu-1.5Mg wt.% alloy is first reported. This new observation happened to occur when an ion milling was peformed to remove oxides on the specimen, particularly, aged 100 hours at $150^{\circ}C$. Meanwhile the oxides were identified to be $Cu_2O$ particles. For this work involved with analysis of diffraction rings, the formulation of the electron diffraction rings pattern for powder particles was made. Finally the significance of this unexpected ion milling effort on the alloy was discussed

• Journal of Welding and Joining
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• v.30 no.3
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• pp.32-37
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• 2012

Lead frame which has a high thermal conductivity and high mechanical strength is one of core technology for ultra-thin electronics such as LED lead frames, memory devices of semiconductors, smart phone, PDA, tablet PC, notebook PC etc. In this paper, we fabricated a Cu/STS/Cu 3-layered clad metal for lead frame packaging materials and characterized the mechanical properties and thermal conductive properties of the clad metal lead frame material. The clad metal lead frame material has a comparable thermal conductivity to typical copper alloy lead frame materials and has a reinforced mechanical tensile strength by 1.6 times to typical pure copper lead frame materials. The thermal conductivity and mechanical tensile strength of the Cu/STS/Cu clad metal are 284.35 W/m K and $52.78kg/mm^2$, respectively.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.28 no.4
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• pp.175-178
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• 2018

Copper is a well know material for use as heat sink or heat exchanger. However, copper has a considerable low tensile strength and temperature limit. A material that has a good thermal conductivity, low cost, but also excellent mechanical properties are desired. In order to identify the mechanism for the material properties of cast Cu-Fe alloys, $Cu_{50}-Fe_{50}$ (wt.%) alloy was produced by using a high-frequency induction furnace, a typical metal casting process. The Cu-Fe alloy consists of Cu, ${\alpha}$-Fe, ${\gamma}$-Fe with dendrite structures. The crystal structure and microstructure of the prepared $Cu_{50}-Fe_{50}$ alloy were systematically examined using XRD, FE-SEM, EDS and XRF for electrical devices.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.66 no.11
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• pp.1600-1604
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• 2017

Mo-Cu alloys have been widely used for heat sink materials, vacuum technology, automobile and many other applications due to their excellent physical and electronic properties. Especially, Mo-Cu composites with 5~20 wt% copper are widely used for the heavy duty service contacts due to their excellent properties like low coefficient of thermal expansion, wear resistance, high temperature strength and prominent electrical and thermal conductivity. In most of the applications, high dense Mo-Cu materials with homogeneous microstructure are required for high performance, which has led in turn to attempts to prepare ultra-fine and well-dispersed Mo-Cu powders in different ways, such as spray drying and reduction process, electroless plating technique, mechanical alloying process and gelatification-reduction process. However, most of these methods were accomplished at high temperature (typically degree), resulting in undesirable growth of large Cu phases; furthermore, these methods usually require complicated experimental facilities and procedure. In this study, Mo-Cu alloying were prepared by planetary ball milling (PBM) and spark plasma sintering (SPS) and the effect of Cu with contents of 5~20 wt% on the microstructure and properties of Mo-Cu alloy has been investigated.

• Transactions of the Korean Society of Mechanical Engineers
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• v.12 no.5
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• pp.1083-1091
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• 1988

Vacuum brazing is the most modern brazing process and is at present, far from being completely understood. By brazing under high vacuum, in an atmosphere free of oxidizing gases, a superior product with greater strength, ductility and uniformity can be obtained. In this study, the influence of brazing parameters such as base metal characteristics, joint clearance and brazing time were described in relation to the metallurgical phenomena and shear strength of vacuum-brazed joints between carbon steels and 304 stainless steel (SUS 304) brazed by copper filler metal. In copper brazing of SUS 304 to a medium carbon steel(M.C.S) the columnar Fe-Cr-Ni-Cu-C alloy structure was formed and grew from the M.C.S side and at the same time, the surface of M.C.S. was decarbonized. The driving force for the formation and growth of columnar structure was the difference of carbon content between base metals. As the joint clearance is narrower and brazing time is longer, the formation and growth of columnar phase and decarburization of carbon steels were more noticeable. Because of decarburization of carbon steels, the shear strength of brazed joints were reduced as the formation of columnar structure was increased.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2003.10a
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• pp.46-49
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• 2003

Cu have been widely used as signal transmission materials for electrical electronic components owing to its high electrical conductivity. However, it's size have been limited to small ones due to its poor mechanical properties, Until now, strengthening of the copper at toy was obtained either by the solid solution and precipitation hardening by adding alloy elements or the work hardening by deformation process. Adding the at toy elements lead to reduction of electrical conductivity. In this aspect, if carbon nanofiber is used as reinforcement which have outstanding mechanical strength and electric conductivity, it is possible to develope Cu matrix nanocomposite having almost no loss of electric conductivity. It is expected to be innovative in electric conduct ing material market. The unidirectional alignment of carbon nanofiber is the most challenging task developing the copper matrix composites of high strength and electric conductivity In this study, the unidirectional alignment of carbon nanofibers which is used reinforced material are controlled by drawing process in order to manufacture the intermediary materials for the carbon nanofiber reinforced Cu matrix nanocomposite and align mechanism as well as optimized drawing process parameters are verified via experiments and numerical analysis. The materials used in this study were pure copper and the nanofibers of 150nm in diameter and of $10~20\mu\textrm{m}$ In length. The materials have been tested and the tensile strength was 75MPa with the elongation of 44% for the copper it is assumed that carbon nanofiber behave like porous elasto-plastic materials. Compaction test was conducted to obtain constitutive properties of carbon nanofiber. Optimal parameter for drawing process was obtained by experiments and numerical analysis considering the various drawing angles, reduction areas, friction coefficient, etc Lower reduction areas provides the less rupture of cu tube is not iced during the drawing process. Optimal die angle was between 5 degree and 12 degree. Relative density of carbon nanofiber embedded in the copper tube is higher as drawing diameter decrease and compressive residual stress is occurred in the copper tube. Carbon nanofibers are moved to the reverse drawing direct ion via shear force caused by deformation of the copper tube and alined to the drawing direction.

• Korean Journal of Materials Research
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• v.25 no.4
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• pp.202-208
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• 2015

Alumina dispersion strengthening copper(ADSC) alloy has great potential for use in many industrial applications such as contact supports, frictional break parts, electrode materials for lead wires, and spot welding with relatively high strength and good conductivity. In this study, we investigated the oxidation behavior of ADSC alloys. These alloys were fabricated in forms of plate and round type samples by surface oxidation reaction using Cu-0.8Al, Cu-0.4Al-0.4Ti, and Cu-0.6Al-0.4Ti(wt%) alloys. The alloys were oxidized at $980^{\circ}C$ for 1 h, 2 h, and 4 h in ambient atmosphere. The microstructure was observed with an optical microscope(OM) and a scanning electron microscope(SEM) equipped with energy-dispersive X-ray spectroscopy(EDS). Characterization of alumina was carried out using a 200 kV field-emission transmission electron microscope(TEM). As a result, various oxides including Ti were formed in the oxidation layer, in addition to ${\gamma}$-alumina. The thickness of the oxidation layer increased with Ti addition to the Cu-Al alloy and with the oxidation time. The corrected diffusion equation for the plate and round type samples showed different oxidation layer thickness under the same conditions. Diffusion length of the round type specimen had a value higher than that of its plate counterpart because the oxygen concentration per unit area of the round type specimen was higher than that of the plate type specimen at the same diffusion depth.

• Journal of Welding and Joining
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• v.31 no.5
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• pp.77-81
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• 2013

We have investigated thermal stability of the mechanical and thermal conductive properties of Cu/STS/Cu 3 layered clad metal lead frame material for a LED device package at different temperatures ranging from RT to $200^{\circ}C$. The fabricated Cu/STS/Cu clad metal has a good thermal stability for the mechanical tensile strength and thermal conductivity of the over 50 $Kg/mm^2$ to the $150^{\circ}C$ and 270 $W/m{\cdot}K$ to the $200^{\circ}C$, respectively. This clad metal lead frame material at a high temperature of $150^{\circ}C$ shows a reinforced mechanical tensile strength by 1.5 times to conventional pure copper lead frame materials and also a comparable thermal conductivity to typical copper alloy lead frame materials.