• Title/Summary/Keyword: High aspect ratio micro patterns

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Fabrication of Large Area Stamp with High Aspect Ratio Micro Intaglio Features (고세장비 마이크로 음각 형상을 갖는 대면적 스탬프의 제작)

  • Lee, Byung-Soo;Han, Jeong-Won;Han, Jung-Jin;Lim, Ji-Seok;Yoo, Yeong-Eun;Je, Tae-Jin;Kang, Shin-Ill
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2009.05a
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    • pp.84-87
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    • 2009
  • This paper describes a novel method for fabricating large area metallic stamp with high aspect ratio micro intaglio features. Micro machined brass master with pillar and larger width groove patterns were electroformed to form inverse structures on the large area metallic stamp. This enabled large area metallic stamp with fine micro high aspect ratio micro intaglio features which were small width groove patterns and quadrilateral hole patterns that cannot be fabricated by direct micro machining process. Fabricated large area metallic stamp with high aspect ratio micro intaglio features was measured and analyzed.

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Investigation into direct fabrication of nano-patterns using nano-stereolithography (NSL) process (나노 스테레오리소그래피 공정을 이용한 무(無)마스크 나노 패턴제작에 관한 연구)

  • Park Sang Hu;Lim Tae-Woo;Yang Dong-Yol
    • Journal of the Korean Society for Precision Engineering
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    • v.23 no.3 s.180
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    • pp.156-162
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    • 2006
  • Direct fabrication of nano patterns has been studied employing a nano-stereolithography (NSL) process. The needs of nano patterning techniques have been intensively increased for diverse applications for nano/micro-devices; micro-fluidic channels, micro-molds. and other novel micro-objects. For fabrication of high-aspect-ratio (HAR) patterns, a thick spin coating of SU-8 process is generally used in the conventional photolithography, however, additional processes such as pre- and post-baking processes and expansive precise photomasks are inevitably required. In this work, direct fabrication of HAR patterns with a high spatial resolution is tried employing two-photon polymerization in the NSL process. The precision and aspect ratio of patterns can be controlled using process parameters of laser power, exposure time, and numerical aperture of objective lens. It is also feasible to control the aspect ratio of patterns by truncation amounts of patterns, and a layer-by-layer piling up technique is attempted to achieve HAR patterns. Through the fabrication of several patterns using the NSL process, the possibility of effective patterning technique fer various N/MEMS applications has been demonstrated.

Experimental Investigation on Machining Feasibility of Micro Patterns using a Single Crystal Diamond Tool (단결정 다이아몬드 공구를 이용한 미세 패턴 가공성에 대한 실험적 분석)

  • Kim, Hyun-Chul
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.11 no.5
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    • pp.76-81
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    • 2012
  • The continuing demand for increasingly slimmer and brighter liquid crystal display(LCD) panels has led to an increased focus on the role of the light guide panels(LGPs) or optical films that are used to obtain diffuse, uniform light from the backlight unit(BLU). And the most basic process in the production of such BLU components is the micromachining. LCD BLUs comprise various optical elements such as a LGP, diffuser sheet, prism sheet, and protector sheet with micro patterns. High aspect ratio patterns are required to reduce the number of sheets and enhance light efficiency, but there is a limit to the aspect ratio achievable for a given material and cutting tool. Therefore, this study comprised a series of experimental evaluations conducted to determine the machining feasibility in microcutting various aspect ratio patterns on electroless nickel plated die materials when using single-crystal diamond tools. Cutting performance was evaluated at various cutting speeds and depths of cut using different machining methods and machine tools.

Trends of Flat Mold Machining Technology with Micro Pattern (미세패턴 평판 금형가공 기술동향)

  • Je, Tae-Jin;Choi, Doo-Sun;Jeon, Eun-Chae;Park, Eun-Suk;Choi, Hwan-Jin
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.11 no.2
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    • pp.1-6
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    • 2012
  • Recent ultra-precision machining systems have nano-scale resolution, and can machine various shapes of complex structures using five-axis driven modules. These systems are also multi-functional, which can perform various processes such as planing, milling, turning et al. in one system. Micro machining technology using these systems is being developed for machining fine patterns, hybrid patterns and high aspect-ratio patterns on large-area molds with high productivity. These technology is and will be applied continuously to the fields of optics, display, energy, bio, communications and et al. Domestic and foreign trends of micro machining technologies for flat molds were investigated in this study. Especially, we focused on the types and the characteristics of ultra-precision machining systems and application fields of micro patterns machined by the machining system.

Development of µ-PIM standard mold with exchangable insert core in order to manufacture micro pattern (마이크로 패턴 성형을 위한 인서트 코어 적용 µ-PIM 표준금형 개발에 관한 연구)

  • Park, Chi Yoel;Seo, Chan-Yoel;Kim, Yongdae
    • Design & Manufacturing
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    • v.11 no.3
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    • pp.29-34
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    • 2017
  • Increased demand for parts with micro-pattern structure made of metals, ceramics, and composites in various fields such as medical ultrasonic sensors, CT collimators, and ultra-small actuator parts. Micro powder injection molding (PIM) is a technology for manufacturing micro size, high volume, complex, precision, net-shape components from either metal or ceramic powder. In the present study, a standard mold with a variable insert core capable of producing various micro patterns was investigated. An injection molding test was performed on a standard mold using a line type micro-pattern core having an aspect ratio of 2, a slenderness ratio of 70, a pattern size of $200{\mu}m$, and a pattern spacing of $150{\mu}m$. During the filling process, the deformation of the mold with large aspect ratio and slenderness ratio was analyzed by the experiment and the numerical simulation according to the position of the gate. We proposed a mold structure that minimizes mold deformation by gate modification and enables uniform pattern filling behavior.

Fabrication of Micro/nanoscale Cutting Tool Geometry of Single Crystal Diamond Tool by Focused Ion Beam (집속이온빔(Focused Ion Beam)에 의한 단결정 다이아몬드 공구의 마이크로/나노스케일 절삭공구 형상 제작)

  • Baek, Seung Yub;Jang, Sung Min
    • Journal of the Korean Society for Precision Engineering
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    • v.31 no.3
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    • pp.207-213
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    • 2014
  • A study was carried out to fabricate the cutting tool geometry with micro/nanoscale on the single crystal diamond tool by using the FIB. The FIB technique is an ideal tool for TEM sample preparation that allows for the fabrication of electron-transparent foils. The FIB is appropriate techniques to sample and subsequently define the chemical composition and the structural state of mineral inclusion on the micro/nanoscale. The combination of FIB with a SEM allows for 3D information to be obtained from samples including 3D imaging. Cutting strategies were demonstrated to improve the performance of cutting tool geometry and to generate high aspect ratio micro cutting tool. A finely focused beam of 30keV Ga+ ions was used to mill cutting tool shapes for various micro patterns. Therefore FIB sputtering is used to shape a variety of cutting tools with dimensions in the $1-5{\mu}m$ range and cutting edge radii of curvature of under 50nm.

Characteristics of Graphene Quantum Dot-Based Oxide Substrate for InGaN/GaN Micro-LED Structure (InGaN/GaN Micro-LED구조를 위한 그래핀 양자점 기반의 산화막 기판 특성)

  • Hwang, Sung Won
    • Journal of the Semiconductor & Display Technology
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    • v.20 no.3
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    • pp.167-171
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    • 2021
  • The core-shell InGaN/GaN Multi Quantum Well-Nanowires (MQW-NWs) that were selectively grown on oxide templates with perfectly circular hole patterns were highly crystalline and were shaped as high-aspect-ratio pyramids with semi-polar facets, indicating hexagonal symmetry. The formation of the InGaN active layer was characterized at its various locations for two types of the substrates, one containing defect-free MQW-NWs with GQDs and the other containing MQW-NWs with defects by using HRTEM. The TEM of the defect-free NW showed a typical diode behavior, much larger than that of the NW with defects, resulting in stronger EL from the former device, which holds promise for the realization of high-performance nonpolar core-shell InGaN/GaN MQW-NW substrates. These results suggest that well-defined nonpolar InGaN/GaN MQW-NWs can be utilized for the realization of high-performance LEDs.