• Proceedings of the IEEK Conference
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• 2002.06b
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• pp.101-104
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• 2002

This paper propose that is algorithm of power dissipation reduction in the high level synthesis design for DSP(Digital Signal Processor), as the portable terminal system recently demand high power dissipation. This paper obtain effect of power dissipation reduction and switching activity that increase correlation of operands as input data of function unit. The algorithm search loop or repeatedly data to the input operands of function unit. That can be reduce the power dissipation using the new low power high level synthesis algorithm. In this Paper, scheduling operation search same nodes from input DFG(Data Flow Graph) with correlation coefficient of first input node and among nodes. Function units consist a multiplier, an adder and a register. The power estimation method is added switching activity for each bits of nodes. The power estimation have good efficient using proposed algorithm. This paper result obtain more Power reduction of fifty percents after using a new low power algorithm in a function unit as multiplier.

• Transactions of Materials Processing
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• v.7 no.5
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• pp.450-458
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• 1998

The high temperature deformation behavior of Al 5083 alloy has been studied in the temperature range of 350 to 520 ${\circ}C$ and strain rate range of 0.2 to 3.0/sec by torsion test. The strain rate sensitivity(m) of the material was evaluated and used for estabilishing power dissipation maps following the dynamic material model. These maps show the variation of efficiency of power dissipation(${\eta}$=2m/(2m+1)) with temperature and strain rate. Hot restoration of dynamic recrystallization (DRX) was analyzed from the flow curve, deformed microstructure, and processing maps during hot deformation. Also, the effect of deformation strain on the efficiency of power dissipation of the alloy was analysed using the processing maps. Moreover relationship between the hot-ductility and efficiency of power dissipation of the alloy depending on thmperature and strain rate was studied using the Zener-Hollomon parameter(Z=${\varepsilon}$exp(Q/RT) It is found that the maximum efficiency of power dissipation for DRX in Al 5083 alloy is about 74.6 pct at the strain of 0.2. The strain rate and temperature at which the efficiency peak occurred in the DRX domain is found to be ∼0.1/sec and ∼450${\circ}C$ respectively.

• Journal of IKEEE
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• v.8 no.2 s.15
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• pp.181-185
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• 2004

This paper reduces power dissipation with the minimum switching activity of functional units that have many operators. Therefore, it has more effects of power dissipation that operator dissipation to reduce power dissipation of whole circuit preferentially. This paper proposes an algorithm that minimize power dissipation in functional units operations that affect much as power dissipation in VLSI circuit. The algorithm has scheduled operands using power library that has information of all operands. The power library upgrades information of input data in each control step about all inputs of functional units and the information is used at scheduling process. Therefore, the power dissipation is minimized by functional units inputs in optimized data. This paper has applied algorithm that proposed for minimizing power dissipation to functional unit in high level synthesis. The result of experiment has effect of maximum 9.4 % for minimizing power dissipation.

• ETRI Journal
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• v.44 no.3
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• pp.491-503
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• 2022

Metal-oxide-semiconductor field-effect transistors (MOSFETs) are continuously scaling down in the nanoscale region to improve the functionality of integrated circuits. The scaling down of MOSFET devices causes short-channel effects in the nanoscale region. In nanoscale region, leakage current components are increasing, resulting in substantial power dissipation. Very large-scale integration designers are constantly exploring different effective methods of mitigating the power dissipation. In this study, a transistor-level input-controlled stacking (ICS) approach is proposed for minimizing significant power dissipation. A low-power ICS approach is extensively discussed to verify its importance in low-power applications. Circuit reliability is monitored for process and voltage and temperature variations. The ICS approach is designed and simulated using Cadence's tools and compared with existing low-power and high-speed techniques at a 22-nm technology node. The ICS approach decreases power dissipation by 84.95% at a cost of 5.89 times increase in propagation delay, and improves energy dissipation reliability by 82.54% compared with conventional circuit for a ring oscillator comprising 5-inverters.

• Journal of Electrical Engineering and Technology
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• v.9 no.5
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• pp.1471-1481
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• 2014

This paper presents the new power dissipation model of individual switching device in a high-level modular multilevel converter (MMC), which can be mostly used in voltage sourced converter (VSC) based high-voltage direct current (HVDC) system and flexible AC transmission system (FACTS). Also, the voltage balancing method based on sorting algorithm is newly proposed to advance the MMC functionalities by effectively adjusting switching variations of the sub-module (SM). The proposed power dissipation model does not fully calculate the average power dissipation for numerous switching devices in an arm module. Instead, it estimates the power dissipation of every switching element based on the inherent operational principle of SM in MMC. In other words, the power dissipation is computed in every single switching event by using the polynomial curve fitting model with minimum computational efforts and high accuracy, which are required to manage the large number of SMs. After estimating the value of power dissipation, the thermal condition of every switching element is considered in the case of external disturbance. Then, the arm modeling for high-level MMC and its control scheme is implemented with the electromagnetic transient simulation program. Finally, the case study for applying to the MMC based HVDC system is carried out to select the appropriate insulated-gate bipolar transistor (IGBT) module in a steady-state, as well as to estimate the proper thermal condition of every switching element in a transient state.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.349-350
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• 2007

Polyethylene is widely used as the insulator for power cable. To investigate the conduction mechanism for power cable insulation under ac high field, it is very important to acquire the dissipation current under actual running field. Recently, we have developed the unique system, which make possible to observe the nonlinear dissipation current waveform. In this system, to observe the nonlinear properties with high accuracy, capacitive current component is canceled by using inverse capacitive current signal instead of using the bridge circuit for canceling it. As the results of these estimations, it was found that the dissipation current will depend on not only the instantaneous value of electric field but also the time differential of applied electric field due to taking a balance between applied field and internal field. Furthermore, two large peaks of dissipation current for each half cycle were observed under certain condition. In this paper, to clarify the reason why it shows two peaks for each half cycle, the film thickness dependences of dissipation current waveforms were observed by using the three different thickness LDPE films.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.18 no.4
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• pp.169-175
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• 2018

Recently, power dissipation issue is very significant not only in high-end modern processors but also in embedded systems and mobile devices. Based on the power dissipation, hardware and software designers can correctly find the power/performance tradeoffs. Most power analysis tools calculate power dissipation when chip layout or floor planning are finished. In this paper, a trace-driven simulator that can interact with power analysis tool for an embedded microprocessor has been developed. Using MiBench embedded benchmarks as input, the trace-driven simulation has been performed to estimate the average power dissipation which is faster than the conventional tools.

• Journal of Electrical Engineering and Technology
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• v.3 no.1
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• pp.130-134
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• 2008

The increasing size of very large scale integration (VLSI) circuits, high transistor density, and popularity of low-power circuit and system design are making the minimization of power dissipation an important issue in VLSI design. Test Power dissipation is exceedingly high in scan based environments wherein scan chain transitions during the shift of test data further reflect into significant levels of circuit switching unnecessarily. Scan chain or cell modification lead to reduced dissipations of power. The ETC algorithm of previous work has weak points. Taking all of this into account, we therefore propose a new algorithm. Its name is RE_ETC. The proposed modifications in the scan chain consist of Exclusive-OR gate insertion and scan cell reordering, leading to significant power reductions with absolutely no area or performance penalty whatsoever. Experimental results confirm the considerable reductions in scan chain transitions. We show that modified scan cell has the improvement of test efficiency and power dissipations.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.16 no.5
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• pp.191-196
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• 2016

Recently, power dissipation is a very significant issue not only in embedded systems and mobile devices but also in high-end modern processors. Especially, by the prevalent use of smart phones and tablet PCs, low power consumption of microprocessors is requisite. In this paper, a fast power measurement tool for a high performance microprocessor based on the trace-driven simulator has been developed. The power model of the microprocessor consists of complex combinational circuits, array structures, and CAM structures. Using SPEC 2000 benchmarks as input, the trace-driven simulation has been performed to estimate the average power dissipation of each program.

• ETRI Journal
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• v.33 no.1
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• pp.140-143
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• 2011

Recent test data compression techniques raise concerns regarding power dissipation and compression efficiency. This letter proposes a new test data compression scheme, twin symbol encoding, that supports block division skills that can reduce hardware overhead. Our experimental results show that the proposed technique achieves both a high compression ratio and low-power dissipation. Therefore, the proposed scheme is an attractive solution for efficient test data compression.