• 수산해양교육연구
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• 제20권3호
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• pp.410-415
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• 2008

To evaluate the performance of nucleate boiling heat transfer between a plain and micro-fin surfaces, the experimental tests have been carried out under various conditions with fluorinert liquid FC-72, which is chemically and electrically stable. Two kinds of micro fins with the dimensions of $200{{\mu}m}{\times}20{{\mu}m}$ and $100{{\mu}m}{\times}10{{\mu}m}$ (width x height) were fabricated on the surface of a silicon chip. The experiments were performed on the liquid subcooling of 5, 10 and 20K under the atmospheric condition. The presented data showed a similar trend in the comparison with result of Rainey & You. Due to its expanded surface areas, the heat flux properties has been significantly enhanced on micro-fin surface comparing to the plain surface.

• 열처리공학회지
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• 제18권6호
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• pp.362-368
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• 2005

Formation and thermal stability of a quasicrystalline phases in Al-Fe-Mo alloys were investigated by means of melt-spinning process and subsequent heat treatment test. Thermal decomposition and phase transformation process of the as-spun alloys were studied using X-ray diffraction and electron microscopy. The melt-spun Al-Fe-Mo alloys contained an icosahedral quasicrystalline phase with a quasilattice constant of 0.457 nm. Icosahedral phase formed at a composition of $Al_{82.5}Fe_{14}Mo_{3.5}$ as a metastable phase during rapid solidification was transformed into the stable crystalline phases, cubic 1/0 approximant and monoclinic ${\lambda}$-phase, upon heating. A metastable icosahedral and cubic(a = 0.93 nm) phases in as-spun $Al_{65}Fe_{20}Mo_{15}$ alloy were decomposed into two cubic(a = 0.62, 0.31 nm) phases by heat treatment.

• Transactions on Electrical and Electronic Materials
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• 제3권4호
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• pp.27-31
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• 2002

Thin film diode with reliable interfacial structure was fabricated by using multi-step anodic oxidation. The thickness of the oxide layer was preciously controlled with anodic voltage. Also, interfacial structure between oxide layer and top electrode was improved by applying post heat-treatment. The thin film diode showed symmetric and stable I-V characteristics after the post heat-treatment.

• 한국전산유체공학회지
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• 제14권2호
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• pp.77-83
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• 2009

Operating medium or large scale industrial boilers in partial load condition, the burner should undergo the off-design points resulting in poor exhaust gas characteristics. To obtain the stable turn down performance, two or more burners can be used for the industrial boiler. In case multiple burners are adopted, the heat transfer can be enhanced by arranging the burners properly. In the present study, numerical simulations have been conducted for the combustion chamber of a 2 t/h class industrial boiler in order to clarify the heat transfer characteristics at the combustion chamber.

• Mycobiology
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• 제43권3호
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• pp.272-279
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• 2015

To screen molecular chaperones similar to small heat shock proteins (sHsps), but without ${\alpha}$-crystalline domain, heat-stable proteins from Schizosaccharomyces pombe were analyzed by 2-dimensional electrophoresis and matrix assisted laser desorption/ionization time-of-flight mass spectrometry. Sixteen proteins were identified, and four recombinant proteins, including cofilin, NTF2, pyridoxin biosynthesis protein (Snz1) and Wos2 that has an ${\alpha}$-crystalline domain, were purified. Among these proteins, only Snz1 showed the anti-aggregation activity against thermal denaturation of citrate synthase. However, pre-heating of NTF2 and Wos2 at $70^{\circ}C$ for 30 min, efficiently prevented thermal aggregation of citrate synthase. These results indicate that Snz1 and NTF2 possess molecular chaperone activity similar to sHsps, even though there is no ${\alpha}$-crystalline domain in their sequences.

• 대한수학회지
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• 제56권1호
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• pp.91-111
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• 2019

We give a direct proof of the sharp two-sided estimates, recently established in [4, 9], for the Dirichlet heat kernel of the fractional Laplacian with gradient perturbation in $C^{1,1}$ open sets by using Duhamel's formula. We also obtain a gradient estimate for the Dirichlet heat kernel. Our assumption on the open set is slightly weaker in that we only require D to be $C^{1,{\theta}}$ for some ${\theta}{\in}({\alpha}/2,1]$.

• 열처리공학회지
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• 제35권5호
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• pp.239-245
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• 2022

The purpose of this study is to evaluate the degree of microstructural change of materials using ultrasonic nonlinear parameters. For microstructure change, isothermal heat-treated ferritic 2.25Cr steel and low-cycle fatigue-damage copper alloy were prepared. The variation in ultrasonic nonlinearity was analyzed and evaluated through changes in hardness, ductile-brittle transition temperature, electron microscopy, and X-ray diffraction tests. Ultrasonic nonlinearity of 2.25Cr steel increased rapidly during the first 1,000 hours of deterioration and then gradually increased thereafter. The variation in non-linear parameters was shown to be coarsening of carbides and an increase in the volume fraction of stable M6C carbides during heat treatment. Due to the low-cycle fatigue deformation of oxygen-free copper, the dislocation that causes lattice deformation developed in the material, distorting the propagating ultrasonic waves, and causing an increase in the ultrasonic nonlinear parameters.

• 한국CDE학회논문집
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• 제9권4호
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• pp.416-424
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• 2004

In this paper, the heat transfer analysis and thermal stress analysis of the PCB(Printed Circuit Board) equipped in electronic Packages are carried out for various may types of chips on the PCB. And two structural PCB models are used in the analyses. The electronic chips on the PCB usually emit heat and this heat generates the thermal stress around the chip. The thermal load due to the heat generation of chips on the PCB may cause the malfunction of the electronic packages such as a monitor. a computer etc. Hence, the PCB should be designed to withstand these thermal loads. In this paper, the heat transfer analysis and thermal stress analysis are executed for the PCB model with pins and the analysis results are compared with the results for the PCB model without pins. The analysis results show that the PCB model without pins is not good for the thermal stress analysis of PCB, even though these two models have similar heat transfer characteristics. The analysis results also show that the highest thermal stress occurs in the pin especially attached to the highest temperature chip, and the PCB constrained to the electronic package on the long side is structurally more stable than other cases. The analyses of the PCB are executed using the finite element analysis code, NISA.

• Journal of Dairy Science and Biotechnology
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• 제35권1호
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• pp.55-72
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• 2017

The second article of 'Effects of heat treatment on the nutritional quality of milk,' titled 'Destruction of microorganisms in milk by heat treatment' and authored by Dr. Seong Kwan Cha, who worked at the Korea Food Research Institute, covers the heat-stable microorganisms that exist in milk after pasteurization. The article focusses on the microbiological quality of raw milk and market milk following heat treatment, and is divided into four sub-topics: microbiological quality of raw milk, survey and measurement of microorganisms killed in raw milk, effect on psychrophilic and mesophilic microorganisms, and effect of heat treatment methods on thermoduric microorganisms. Bacillus spp. and Clostridium spp. are sporeforming gram-positive organisms commonly found in soil, vegetables, grains, and raw and pasteurized milk that can survive most food processing methods. Since spores cannot be inactivated by LTLT (low temperature long time) or HTST (high temperature short time) milk pasteurization methods, they are often responsible for food poisoning. However, UHT (ultra high temperature) processing completely kills the spores in raw milk by heating it to temperatures above $130^{\circ}C$ for a few seconds, and thus, the UHT method is popularly used for milk processing worldwide.

• 동력기계공학회지
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• 제20권4호
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• pp.12-18
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• 2016

Typical boiler system consists of combustion chamber and heat exchanger in one housing, therefore the size of boiler system is large and the heat exchanging efficiency becomes low. At these boiler systems, because the combustible mixture fires as free flame in the combustion chamber, consequently the combusted hot gas heats the heat exchanger only as conductive and convective heat transfer. The present Porous Ceramic Burner concept is that combustion process is occurred at the gaps of the porous ceramic materials, and the heat exchanger is placed in the same porous materials. Therefore we can reduce the boiler size, and we can also use radiative heat transfer from ceramic material with conductive and convective heat transfer from combusted gas throwing the porous materials. The purpose of this study is to search the flame stability ranges at different fuel flow rate and excess air ratio burning in the $Al_2O_3$ ceramic balls. We found out the stable excess air ratio range on given combustion intensity. And we can get clean porous ceramic combustion results compared with free flame.