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Thermal Stress Analysis for the Printed Circuit Board of Electronic Packages  

Kwon Y. J. (홍익대학교 기계정보공학과)
Kim J. A. (홍익대학교 대학원 기계정보공학과)
Publication Information
Korean Journal of Computational Design and Engineering / v.9, no.4, 2004 , pp. 416-424 More about this Journal
Abstract
In this paper, the heat transfer analysis and thermal stress analysis of the PCB(Printed Circuit Board) equipped in electronic Packages are carried out for various may types of chips on the PCB. And two structural PCB models are used in the analyses. The electronic chips on the PCB usually emit heat and this heat generates the thermal stress around the chip. The thermal load due to the heat generation of chips on the PCB may cause the malfunction of the electronic packages such as a monitor. a computer etc. Hence, the PCB should be designed to withstand these thermal loads. In this paper, the heat transfer analysis and thermal stress analysis are executed for the PCB model with pins and the analysis results are compared with the results for the PCB model without pins. The analysis results show that the PCB model without pins is not good for the thermal stress analysis of PCB, even though these two models have similar heat transfer characteristics. The analysis results also show that the highest thermal stress occurs in the pin especially attached to the highest temperature chip, and the PCB constrained to the electronic package on the long side is structurally more stable than other cases. The analyses of the PCB are executed using the finite element analysis code, NISA.
Keywords
Thermal Stress Analysis; Heat Transfer Analysis; PCB(Printed Circuit Board); Electronic Packages; Electronic Chip; Pin;
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