• Proceedings of the Korean Society of Computer Information Conference
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• 2016.01a
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• pp.57-58
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• 2016

ICT의 보급, 확대는 데이터 센터의 중요성을 높이고 보다 성능이 좋으며 체적 당 소비전력이 큰 서버를 수용할 수 있는 데이터 센터의 수요를 창출하고 있다. 현재 데이터 센터는 데이터 센터 활용 시에 구성요소들에 대한 상당한 대역폭을 필요로 하나 현 데이터센터에 적용된 토폴로지는 고성능 IP 스위치/라우터를 사용하더라도 네트워크 엣지 계층에서는 기본 활용도의 50%의 bandwidth밖에 지원하지 못한다. 따라서 이러한 문제를 해결하기 위해 OMNeT++을 이용하여 데이터 센터 토폴로지 중 하나인 Fat-tree를 모델링하고 데이터 센터 제반 환경을 구축, latency, power consumption, heat dissipation 등의 기준지표를 성능평가 하였다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.10
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• pp.826-831
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• 2009

In this paper, a high power RF amplifier module using AlN substrate of high thermal conductivity has been proposed. This RF amplifier module has the advantage of compact size and effective heat dissipation for the packaging of high power chip. To fabricate the thru-hole and scribing line on AlN substrate, the key parameters of $CO_2$ laser were experimented. And then, microstrip lines and spiral planar inductors were fabricated on an AlN substrate using the thin-film process. The fabricated microstrip lines on the AlN substrate has an attenuation value of 0.1 dB/mm up to 10 GHz. The fabricated spiral planar inductor has a high quality factor, a maximum of about 62 at 1 GHz for a 5.65 nH inductor. Packaging of a RF power amplifier was implemented on an AlN substrate with thru-hole. From the measured results, the gain is 24 dB from 13 to 15 GHz and the output power is 33.65 dBm(2.3 W).

• Journal of computational fluids engineering
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• v.13 no.2
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• pp.48-54
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• 2008

COMS (Communication, Ocean and Meteorological Satellite) is a geostationary satellite and has been developing by KARI for communication, ocean and meteorological observations. It will be launched by ARIANE 5. Ka-band components are installed on South panel, where single solar array wing is mounted. Radiators, embedded heat pipes, external heat pipe, insulation blankets and heaters are utilized for the thermal control of the satellite. The Ka-band payload section is divided several areas based on unit operating temperature in order to optimize radiator area and maximize heat rejection capability. Other equipment for sensors and bus are installed on North panel. The ocean and meteorological sensors are installed on optical benches on the top floor to decouple thermally from the satellite. During the transfer orbit operation, satellite will be under severe thermal environments due to low dissipation of components, satellite attitudes and LAE(Liquid Apogee Engine) firing. This paper presents temperature and heater power prediction and validation of thermal control design during transfer orbit operation.

• 한국전산유체공학회:학술대회논문집
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• 2007.10a
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• pp.227-231
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• 2007

COMS (Communication, Ocean and Meteorological Satellite) is a geostationary satellite and has been developing by KARI for communication and ocean and meteorological observations. It will be launched by ARIANE 5. Ka-band components are installed on South panel, where single solar array wing is mounted. Radiators, embedded heat pipes, external heat pipe, insulation blankets and heaters are utilized for the thermal control of the satellite. The Ka-band payload section is divided several areas based on unit operating temperature in order to optimize radiator area and maximize heat rejection capability. Other equipment for sensors and bus are installed on North panel. The ocean and meteorological sensors are installed on optical benches on the top floor to decouple thermally from the satellite. During the transfer orbit operation, satellite will be under severe thermal environments due to low dissipation of components, satellite attitudes and LAE(Liquid Apogee Engine) firing. This paper presents temperature and heater power prediction and validation of thermal control design during transfer orbit operation.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.39 no.10
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• pp.1011-1019
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• 2015

Insulated-gate bipolar transistors (IGBTs) are the predominantly used power semiconductors for high-current applications, and are used in trains, airplanes, electrical, and hybrid vehicles. IGBT power modules generate a considerable amount of heat from the dissipation of electric power. This heat generation causes several reliability problems and deteriorates the performances of the IGBT devices. Therefore, thermal management is critical for IGBT modules. In particular, realizing a proper thermal design for which the device temperature does not exceed a specified limit has been a key factor in developing IGBT modules. In this study, we investigate the thermal behavior of the 1200 A, 3.3 kV IGBT module package using finite-element numerical simulation. In order to minimize the temperature of IGBT devices, we analyze the effects of various packaging materials and different thickness values on the thermal characteristics of IGBT modules, and we also perform a design-of-experiment (DOE) optimization

• Journal of the Microelectronics and Packaging Society
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• v.23 no.2
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• pp.73-78
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• 2016

An increase in the transistor density of integrated circuit devices leads to a very high increase in heat dissipation density, which causes a long-term reliability and various thermal problems in microelectronics. In this study, liquid cooling method was investigated using straight microchannels with various metal bumps. Microchannels were fabricated on Si wafer using deep reactive ion etching (DRIE), and Ag, Cu, or Cr/Au/Cu metal bumps were placed on Si wafer by a screen printing method. The surface temperature of liquid cooling structures with various metal bumps was measured by infrared (IR) microscopy. For liquid cooling with Cr/Au/Cu bumps, the surface temperature difference before and after liquid cooling was $45.2^{\circ}C$ and the power density drop was $2.8W/cm^2$ at $200^{\circ}C$ heating temperature.

• Journal of Electrical Engineering and Technology
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• v.13 no.6
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• pp.2402-2411
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• 2018

Fluoronitriles-$CO_2$ gas mixtures are promising alternatives to $SF_6$ in environmentally-friendly gas-insulated transmission lines (GILs). Insulating gas heat transfer characteristics are of major significance for the current-carrying capacity design and operational state monitoring of GILs. In this paper, a three-dimensional calculation model was established for a GIL using the thermal-fluid coupled finite element method. The calculated results showed close agreement with experimentally measured data. The temperature distribution of a GIL filled with the Fluoronitriles-$CO_2$ mixture was obtained and compared with those of GILs filled with $CO_2$ and $SF_6$. Furthermore, the effects of the mixture ratio of the component gases and the gas pressure on the temperature rise and current-carrying capacity of the GIL were analyzed. Results indicated that the heat transfer performance of the Fluoronitriles-$CO_2$ gas mixture was better than that of $CO_2$ but worse than that of $SF_6$. When compared with $SF_6$, use of the Fluoronitriles-$CO_2$ gas mixture caused a reduction in the GIL's current-carrying capacity. In addition, increasing the Fluoronitriles gas component ratio or increasing the pressure of the insulating gas mixture could improve the heat dissipation and current-carrying capacity of the GIL. These research results can be used to design environmentally-friendly GILs containing Fluoronitriles-$CO_2$ gas mixtures.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.14 no.2
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• pp.592-597
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• 2013

The heat generated at the motor and inverter inside the electric compressor of inverter built-in type is mainly cooled by refrigerant and generally, there is not a thermal problem. However, the close relation of heat transfer from the motor and inverter parts to the compression part affects on compressor efficiency. Also, according to the surrounding environment and system operation condition, the increased temperature of the motor and inverter can affect the power density of the motor system, and especially, the inverter may be prevented to operate by the temperature limits. In this study, we performed thermo-flow analysis of electric compressor motor system, and investigated the heat dissipation enhancement of the motor and inverter. The motor part in the operation region of the electric compressor was generally maintained at low temperature and the inverter part at high compressor speed was lower temperature than the temperature limit of $85^{\circ}C$. However, the case of the inverter at low speed harsh condition was in excess of $10^{\circ}C$. Therefore, in order to solve the thermal problem, the heat reduction technology of the motor and inverter is essential as well as the improvement of flow path in the compressor.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.2
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• pp.53-58
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• 2020

Analysis of electric semiconductor packaging technology for electric vehicles was performed. Topic modeling using LDA technique was performed by collecting valid patents by deriving valid patents. It was classified into 20 topics, and the definition of technology was defined through extracted words for each topic. In order to analyze the trend of each topic, the trend of power semiconductor packaging technology was analyzed by deriving hot and cold topics by topic through regression analysis on frequency by year. The package structure technology according to the withstand voltage, the input/output-related control technology and the heat dissipation technology were derived as the hot topic technology, and the inductance reduction technology was derived as the cold topic technology.

• Advances in aircraft and spacecraft science
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• v.2 no.2
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• pp.169-182
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• 2015

Aeronautics engine cooling is one of the biggest problems that engineers have tried to solve since the beginning of human flight. Systems like radiators should solve this purpose and they have been studied extensively and various solutions have been found to aid the heat dissipation in the engine zone. Special interest has been given to air coolers in order to guide the air flow on engine and lower the high temperatures achieved by the engine in flow conditions. The aircraft companies need faster and faster tools to design their solutions so the development of tools that allow to quickly assess the effectiveness of an cooling system is appreciated. This paper tries to develop a methodology capable of providing such support to companies by means of some application examples. In this work the development of a new methodology for the analysis and the design of oil cooling systems for aerospace applications is presented. The aim is to speed up the simulation of the oil cooling devices in different operative conditions in order to establish the effectiveness and the critical aspects of these devices. Steady turbulent flow simulations are carried out considering the air as ideal-gas with a constant-averaged specific heat. The heat exchanger is simulated using porous media models. The numerical model is first tested on Piaggio P180 considering the pressure losses and temperature increases within the heat exchanger in the several operative data available for this device. In particular, thermal power transferred to cooling air is assumed equal to that nominal of real heat exchanger and the pressure losses are reproduced setting the viscous and internal resistance coefficients of the porous media numerical model. To account for turbulence, the k-${\omega}$ SST model is considered with Low- Re correction enabled. Some applications are then shown for this methodology while final results are shown in terms of pressure, temperature contours and streamlines.