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http://dx.doi.org/10.6117/kmeps.2020.27.2.053

A Study on Technology Trend of Power Semiconductor Packaging using Topic model  

Park, Keunseo (Graduate School of Technology of Innovation Management, Hanyang University)
Choi, Gyunghyun (Graduate School of Technology of Innovation Management, Hanyang University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.27, no.2, 2020 , pp. 53-58 More about this Journal
Abstract
Analysis of electric semiconductor packaging technology for electric vehicles was performed. Topic modeling using LDA technique was performed by collecting valid patents by deriving valid patents. It was classified into 20 topics, and the definition of technology was defined through extracted words for each topic. In order to analyze the trend of each topic, the trend of power semiconductor packaging technology was analyzed by deriving hot and cold topics by topic through regression analysis on frequency by year. The package structure technology according to the withstand voltage, the input/output-related control technology and the heat dissipation technology were derived as the hot topic technology, and the inductance reduction technology was derived as the cold topic technology.
Keywords
Topic Model; Power Module; Package; Technology Trend; Patent;
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Times Cited By KSCI : 5  (Citation Analysis)
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