• 제목/요약/키워드: Heat dissipation materials

검색결과 114건 처리시간 0.029초

전자파차폐 및 방열 기능을 가지는 하이브리드시트 성능측정 (Performance Measurement of The Hybrid Sheet with Dual Function of Electromagnetic-Shielding and Heat-Dissipating)

  • 안성수
    • 한국산학기술학회논문지
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    • 제22권5호
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    • pp.530-536
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    • 2021
  • 본 논문에서는 전자기기 등에서 전자파 차폐 및 방열소재로 많이 채택되는 동 메쉬 시트와 천연그라파이트 시트를 감압 접착제없이 합지시켜 개발된 차폐 및 방열의 기능을 동시에 가지는 하이브리드시트의 성능 측정결과를 제시하였다. 객관적인 방열 성능을 확인하기 위해 2개의 다른 제품들과 수직 및 수평 열전도도를 각각 측정하여 결과를 비교하였으며, 전자파 차폐 성능은 CISPR 11규격에 따른 복사방출시험을 3m 전자파 무향실에서 진행하여 확인하였다. 수직 열전도도의 경우 제안된 하이브리드 시트가 방열코팅이 된 알루미늄 시트 대비 약 8.63배, 감압 접착제로 인조 그라파이트를 합지시킨 구리 시트에 비해 18.7배 높은 수준이였으며, 수평 열전도도는 인조 그라파이트를 합지시킨 구리 시트에 비해 약 0.64배, 방열 코팅된 알루미늄 시트에 대해서는 약 1.76배로 나타났다. 동일한 열원에서 각 시트들을 적용 후 측정한 결과에서는 제안된 하이브리드 시트가 열방출 기능이 가장 우수하였고 복사방출시험에서는 방사노이즈들이 상당 부분 제거되는 결과를 얻었다.

Power Semiconductor SMD Package Embedded in Multilayered Ceramic for Low Switching Loss

  • Jung, Dong Yun;Jang, Hyun Gyu;Kim, Minki;Jun, Chi-Hoon;Park, Junbo;Lee, Hyun-Soo;Park, Jong Moon;Ko, Sang Choon
    • ETRI Journal
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    • 제39권6호
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    • pp.866-873
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    • 2017
  • We propose a multilayered-substrate-based power semiconductor discrete device package for a low switching loss and high heat dissipation. To verify the proposed package, cost-effective, low-temperature co-fired ceramic, multilayered substrates are used. A bare die is attached to an embedded cavity of the multilayered substrate. Because the height of the pad on the top plane of the die and the signal line on the substrate are the same, the length of the bond wires can be shortened. A large number of thermal vias with a high thermal conductivity are embedded in the multilayered substrate to increase the heat dissipation rate of the package. The packaged silicon carbide Schottky barrier diode satisfies the reliability testing of a high-temperature storage life and temperature humidity bias. At $175^{\circ}C$, the forward current is 7 A at a forward voltage of 1.13 V, and the reverse leakage current is below 100 lA up to a reverse voltage of 980 V. The measured maximum reverse current ($I_{RM}$), reverse recovery time ($T_{rr}$), and reverse recovery charge ($Q_{rr}$) are 2.4 A, 16.6 ns, and 19.92 nC, respectively, at a reverse voltage of 300 V and di/dt equal to $300A/{\mu}s$.

하절기 실험을 통한 건물녹화용 피복재료의 복사수지 해석 (An Experimental Study of Surface Materials for Planting of Building Surface by the Radiant Heat Balance Analysis in the Summer)

  • 최동호;이부용
    • 한국태양에너지학회 논문집
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    • 제30권3호
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    • pp.71-80
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    • 2010
  • This study carried out to understand the thermal characteristics of various surface material which compose the city through the observation in the summer. To examine passive cooling effect of planting of building, it is arranged four different materials that is natural grass, grass block, concrete slab and artificial grass. The results of this study are as follows; (1) Natural grass and grass block show the lower surface temperature because of the structures of leaf can do more thermal dissipation effectively. (2) There is little surface temperature between artificial grass and concrete. But there is little high surface temperature difference between natural grass and concrete because of latent heat effect. (3) The concrete can play a role of the tropical nights phenomenon as high heat capacity of concrete compare with other materials. (4) It is nearly same color in artificial grass and natural grass but there is large difference between natural grass and artificial grass at albedo. There is different albedo in near infrared ray range. (5) A short wave radiation gives more effect at the globe temperature than long wave radiation. (6) The artificial turf protected the slab surface temperature increase in spite of thin and low albedo materials.

노면상태를 고려한 전차 궤도 고무의 열발생에 관한 연구 (Study on the Heat Generation of Tank Track Rubbers under the Consideration of the Road Conditions)

  • 김병탁;김광희;윤문철
    • 한국자동차공학회논문집
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    • 제10권3호
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    • pp.166-175
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    • 2002
  • Tank track rubbers, which undergo dynamic stresses and strains under various road conditions, leads to a result of considerable internal temperature rise due to the heat generation. Since rubber materials are not fully elastic, a part of the mechanical energy is converted into heat because of the hysteresis loss. Heat generation without adequate heat dissipation leads to heat build-up, i.e. internal temperature rise which, if excessive, exerts a bad influence upon the performance and the life of the tank track rubbers. The purpose of this paper is to predict temperature distributions of the rubber components off tank track subjected to complex dynamic loads under various read conditions. In steady state analysis temperature fields are displayed in contour shapes, and in unsteady analysis the temperature variations of some important nodes are represented graphically with respect to the running time of the tank.

Mechanical Properties of Cement Material for Energy-Foundation (EF) Structures

  • Park, Yong-Boo;Choi, Hang-Seok;Sohn, Jeong-Rak;Sim, Young-Jong;Lee, Chul-Ho
    • 토지주택연구
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    • 제3권1호
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    • pp.83-88
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    • 2012
  • In this study, physical characteristics of cement and/or concrete materials that are typically used for energy-foundation (EF) structures have been studied. The thermal conductivity and structural integrity of the cement-based materials were examined, which are commonly encountered in backfilling a vertical ground heat exchangers, cast-in-place concrete piles and concrete lining in tunnel. For this purpose the thermal conductivity and unconfined compression strength of cement-based materials with various curing conditions were experimentally estimated and compared. Hydration heat generated from massive concrete in the cast-in-place concrete energy pile was observed for 4 weeks to estimate its dissipation time in the underground. The hydration heat may mask the in-situ thermal response test (TRT) result performed in the cast-in-place concrete energy pile. It is concluded that at least two weeks are needed to dissipate the hydration heat in this case. In addition, a series of numerical analysis was performed to compare the effect of thermal property of the concrete material on the cast-in-place pile.

금속판으로 봉인된 유-무기 보호 박막을 갖는 OLED 봉지 방법 (Encapsulation Method of OLED with Organic-Inorganic Protective Thin Films Sealed with Metal Sheet)

  • 임수용;서정현;주성후
    • 한국전기전자재료학회논문지
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    • 제26권7호
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    • pp.539-544
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    • 2013
  • To study the encapsulation method for heat dissipation of high brightness organic light emitting diode (OLED), red emitting OLED of ITO (150 nm) / 2-TNATA (50 nm) / NPB (30 nm) / $Alq_3$ : 1 vol.% Rubrene (30 nm) / $Alq_3$ (30 nm) / LiF (0.7 nm) / Al (200 nm) structure was fabricated, which on $Alq_3$ (150 nm) / LiF (150 nm) as buffer layer and Al as protective layer was deposited to protect the damage of OLED, and subsequently it was encapsulated using attaching film and metal sheet. The current density, luminance and power efficiency was improved according to thickness of Al protective layer. The emission spectrum and the Commission International de L'Eclairage (CIE) coordinate did not have any effects on encapsulation process using attaching film and metal sheet The lifetime of encapsulated OLED using attaching film and metal sheet was 307 hours in 1,200 nm Al thickness, which was increased according to thickness of Al protective layer, and was improved 7% compared with 287 hours, lifetime of encapsulated OLED using attaching film and flat glass. As a result, it showed the improved current density, luminance, power efficiency and the long lifetime, because the encapsulation method using attaching film and metal sheet could radiate the heat on OLED effectively.

반도체 패키지 EMC의 열물성 연구 (Thermophysical Properties of Epoxy Molding Compound for Microelectronic Packaging)

  • 이상현;도중광;송현훈
    • 반도체디스플레이기술학회지
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    • 제3권4호
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    • pp.33-37
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    • 2004
  • As the high speed and high integration of semiconductor devices and the generation of heat increases resulted in the effective heat dissipation influences on the performance and lifetime of semiconductor devices. The heat resistance or heat spread function of EMC(epoxy molding compound) which protects these devices became one of very important factors in the evaluation of semiconductor chips. Recently, silica, alumina, AlN(aluminum nitride) powders are widely used as the fillers of EMC. The filler loading in encapsulants was high up to about 80 vol%. A high loading of filler was improved low water absorption, low stress, high strength, better flowability and high thermal conductivity. In this study, the thermal properties were investigated through thermal, mechanical and microstructure. Thermophysical properties were investigated by laser flash and differential scanning calorimeter(DSC). For detailed inspection of materials, the samples were examined by SEM.

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Graphene, Cu와 Ag 나노 파우더를 이용한 열전도재의 방열 특성에 관한 연구 (A study on the heat dissipation characteristic of thermal interface materials with Graphene, Cu and Ag nano powders)

  • 박상혁;임성훈;김현지;노정필;허선철
    • 한국산업융합학회 논문집
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    • 제22권6호
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    • pp.767-773
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    • 2019
  • The thermal diffusion performance of the electronic device is a factor for evaluating the stability of the electronic device. Therefore, many of research have been conducted to improve the thermal characteristics of thermal interface materials, which are materials for thermal diffusion of electronic products. In this study, nano thermal grease was prepared by blending graphene, silver and copper nano powders into a thermal grease, a type of thermal interface materials, and the heat transfer rate was measured and compared for the purpose of investigating the improved thermal properties. As a result, the thermal properties were good in the order of graphene, silver and copper, which is thought to be due to the different thermal properties of the nano powder itself.

탄소물질을 이용한 전자부품의 열 방출효과 (Thermal Emission Effect of Electronic Parts Using Carbon Materials)

  • 엄운용;노재승;안재상;강동수;서승국;김석환
    • 한국재료학회지
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    • 제20권4호
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    • pp.204-209
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    • 2010
  • Recent high efficiency electronic devices have been found to have heat emission problems. As for LEDs, an excessive increase in the device temperature causes a drop of the luminous efficiency and circuit lifetime. Therefore, heat release in the limited space of such electronic parts is very important. This is a study of the possibility of using a coating of carbon materials as a solution for the thermal emission problem of electronic devices. Powdered carbon materials, cokes, carbon blacks, amorphous graphite, and natural flakes were coated with an organic binder on an aluminum sheet and the subsequent thermal emissivity was measured with an FT-IR spectrometer and was found to be in the range of $5{\sim}20\;{\mu}m$ at $50^{\circ}C$. The emissivity of the carbon materials coated on the aluminum sheet was shown to be over 0.8 and varied according to carbon type. The maximum thermal emissivity on the carbon black coated-aluminum surface was shown to be 0.877. The emissivity of the anodized aluminum sheets that were used as heat releasing materials of the electronic parts was reported to be in the range of 0.7~0.8. Therefore, the use of a coating of carbon material can be a potential solution that facillitates heat dissipation for electronic parts.

SOLUTION OF THE SUPER BESSEL WAVE EQUATION WITH INTEGRAL PARAMETER m

  • Lee, Nae-Ja;Liu, Chang-Keng
    • 대한수학회보
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    • 제20권2호
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    • pp.99-103
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    • 1983
  • Internal heat generation is one of the insidious conditions affecting the quality of an industrial product after it is cast, coated, molded, forged or laminated. Frequently, the product is pressed into service before the exothermic chemical reactions in the generic material has been completed. The heat liberated from this continuing chemical reaction or the residual deformation from the rheological activities in the materials must be adequately removed or prevented, or the product may be discolored, warped, weakened or even "ignited" spontaneously. Numerous instances of premature structural failures, product-recalls, and/or system-malfunctions have been recorded in recent history. The Coulee Dam was poured with pre-chilled concrete just to negate this freakish encore. It is well-known that concrete (a non-isotropic conducting medium), for instance, takes 28 days to develop its full strength. During this period of curing it is conceivable that the processes of internal heat generation, heat conduction and heat dissipation take place simultaneously inside the medium.he medium.

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