Thermal Emission Effect of Electronic Parts Using Carbon Materials |
Eom, Woon-Yong
(School of Advanced Materials and Systems Engineering, Kumoh National Institute of Technology)
Roh, Jae-Seung (School of Advanced Materials and Systems Engineering, Kumoh National Institute of Technology) Seo, Seung-Kuk (School of Advanced Materials and Systems Engineering, Kumoh National Institute of Technology) Ahn, Jai-Sang (School of Advanced Materials and Systems Engineering, Kumoh National Institute of Technology) Kang, Dong-Su (School of Advanced Materials and Systems Engineering, Kumoh National Institute of Technology) Kim, Suk-Hwan (School of Advanced Materials and Systems Engineering, Kumoh National Institute of Technology) |
1 | I. -G. Lee, S. -W. Lee, K. -M. Kang and S. -Y. Chang, Kor. J. Mater. Res., 14, 870 (2004). DOI ScienceOn |
2 | S. C. Lim, M. H. Lee and K. M. Kang, Kor. J. Mater. Res., 15, 829 (2005) (in Korean). DOI ScienceOn |
3 | C. T. Lynch, Practical Handbook of Materials Science, p.393, CRC press, Florida (1989). |
4 | B. W. Gonser, Modern Materials, p.165, Academic Press, New York (1970). |
5 | C. Y. Zhao, T. J. Lu and H. P. Hodson, Int. J. Heat Mass Tran., 47, 2927(2004). DOI ScienceOn |
6 | J. Zueco and F. Alhama, J. Quant. Spec. Rad. Tran.,101, 73 (2006). DOI ScienceOn |
7 | M. Ball, H. Pinkerton and A. J. L. Harris, J. Volcanol. Geoth. Res., 173, 148 (2008). DOI ScienceOn |
8 | L. Gardner and K. T. Ng, Fire Saf. J., 41, 185 (2006). DOI ScienceOn |
9 | D. J. David, Thermochim. Acta, 4(1), 41 (1972). DOI ScienceOn |
10 | J. Yi, X. He, Y. Sun and Y. Li, Appl. Surf. Sci., 253,4361 (2007). DOI ScienceOn |
11 | S. Bellayer, J. W. Gilman, S. S. Rahatekar, S. Bourbigot,X. Flambard, L. M. Hanssen, H. Guo and S. Kumar,Carbon, 45, 2417 (2007). DOI ScienceOn |
12 | M. Wissler, J. Power Sources, 156, 142 (2006). DOI ScienceOn |
13 | H. Yu, G. Xu, X. Shen, X. Yan, C. Shao and C. Hu, Progr. Org. Coating., 66, 161 (2009). DOI ScienceOn |
14 | J. -S. Roh, J. -S. Ahn, B. -J. Kim, H. -Y. Jeon, S. -K. Seo,S. H. Kim and S. -W. Lee, J. Kor. Inst. Surf. Eng, 42, 95(2009). DOI ScienceOn |
15 | G. W. Autio and E. Scala, Carbon, 6, 41 (1968). DOI ScienceOn |
16 | D. A, Jaworske, Thin Solid Films, 290, 278 (1996). DOI ScienceOn |
17 | A. Castellazzia, M. Honsberg-Riedlb, G. Wachutka,Microelectron. J., 37, 145 (2006). DOI ScienceOn |
18 | X. J. Hu, M. A. Panzer and K. E. Goodson, J. Heat Transfer, 129, 91 (2007). DOI ScienceOn |
19 | S. P. Rawal, D. M. Barnett and D. E. Martin, Adv. Packag., 22, 379 (1999). DOI |