• Transactions of the Korean Society of Mechanical Engineers B
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• v.28 no.2
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• pp.167-173
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• 2004

Fouling of heat exchangers is generated by water-borne deposits, commonly known as foulants including particulate matter from the air, migrated corrosion produces; silt, clays, and sand suspended in water; organic contaminants; and boron based deposits in plants. The fouling is known to interfere with normal flow characteristics and reduce thermal efficiencies of heat exchangers. This paper describes the fouling analysis technique developed in this study which can analyze the thermal performance for heat exchangers and estimate the future fouling variations. To develop the fouling analysis technique fur heat exchangers, fouling factor was introduced based on the ASME O&M codes and TEMA standards. For the purpose or verifying the fouling analysis technique, the routing analyses were performed for four heat exchangers in several nuclear power plants; two residual heat removal heat exchangers of the residual heat removal system and two component cooling water heat exchangers of the component cooling water system.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.25 no.11
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• pp.600-605
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• 2013

Ground source heat pump systems (GSHP) can achieve higher performance of the system, by supplying more efficient heat source to the heat pump, than the conventional air-source heat pump system. But building clients and designers have hesitated to use GSHP systems, due to expensive initial cost, and uncertain economic feasibility. In order to reduce the initial cost, many researches have focused on the energy-pile system, using the structure of the building as a heat exchanger. Even though several experimental studies for the energy-pile system have been conducted, there was not enough data of quantitative evaluation with economic analysis and comprehensive analysis for the energy-pile. In this study, a prediction method has been developed for the energy pile system with barrette pile, using the ground heat transfer model and ground heat exchanger model. Moreover, a feasibility study for the energy pile system with barrette pile was conducted, by performance analysis and LCC assessment. As a result, it was found that the heat exchange rate of a barrette pile was 2.55 kW, and the payback period using LCC analysis was 8.8 years.

• Land and Housing Review
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• v.9 no.4
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• pp.25-32
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• 2018

Application of geothermal energy in buildings has been gaining popularity as it provides the benefits of both heating and cooling a building. Among the various types of geothermal energy systems, ground-coupled heat pump system is the most commonly applied one in South Korea. A ground heat exchanger plays an important role as a heat source in winter and a heat sink in summer. For the stable operation of a ground-coupled heat pump system, a ground heat exchanger should be sized so that it provides sufficient heating and cooling energy. Heating and cooling energies generated in ground heat exchangers mainly depend on the temperature difference between the heating medium in ground heat exchangers and the surrounding ground. In addition, the performance of ground heat exchangers influences the change in ground temperature. Therefore, it is necessary to consider this interrelation between the change in the ground temperature and the performance of ground heat exchanger for an accurate estimation of its performance. However, previous thermal analysis models for ground heat exchangers are not competent enough to allow a complete understanding of this interrelation. Therefore, this study proposes a three-dimensional equivalent, transient ground heat exchanger analysis model. First, a previous thermal analysis model for ground heat exchangers, including an analytical model, a g-function, and a numerical model are analyzed. Next, to overcome the limitations of the previous models, a three-dimensional equivalent, transient ground heat exchanger model is proposed. Finally, this study validated the proposed model with the measurement data of the thermal response test, sandbox test, and TRNSYS DST model. All validation results showed a good agreement. These findings helped us to investigate the thermal performance of ground heat exchangers more accurately than the analytical models, and faster than the numerical models. Furthermore, the proposed model contributes to the design of ground heat exchangers by considering the different operation conditions of buildings.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.11 no.6
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• pp.799-807
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• 1999

Exergy analysis is widely used in energy system analysis for more efficient energy use. Pinch technology has focused on chemical plants, such as pure heat exchanger networks. In this study, the objective is to seek more effective means with integrating above two methods. In order to demonstrate effective result and to prove possibility for pinch analysis, the steam turbine is adopted to make heat recovery in the heat exchanger network. Three cases are introduced using the integration of exergy and pinch analysis. The standard steam turbine utility is the base case, and adding the heat pump to this system is the second case. The third case is the system with the heat pump and minimum utilities. The results show that the output power of steam turbine in the case(2) and case(3) are increased up to 42% and 46%, respectively, compared with that of base case.

• Proceedings of the KSME Conference
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• 2001.11b
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• pp.191-198
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• 2001

A numerical analysis of the heat and mass transfer and pressure drop characteristics in modular shell and tube bundle heat exchanger was carried out. Finite Concept Method based on FVM and $k-\varepsilon$ turbulent model were used for this analysis. Condensation heat transfer enhanced total heat transfer rate $4\sim8%$ higher than that of dry heat exchanger. With increasing humid air inlet velocity, temperature and relative humidity, and with decreasing heat exchanger aspect ratio and cooling water velocity, total heat and mass transfer rate could be increased. Cooling water inlet velocity had little effect on total heat transfer.

• Journal of Welding and Joining
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• v.19 no.1
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• pp.104-111
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• 2001

This study presents an analysis method for heat flow and deformation of sheet metal laser welding. A heat source model for 2-dimensional heat flow analysis of laser welding process was suggested in this paper. To investigate the availability of the heat source model, the analysis results were compared and estimated with the results of previous researches. We could get a good agreement between the results of numerical analysis and experiments in the temperature distribution of weldment. Due to the characteristics of welding process, some kinds of deformations are usually generated in a welded structure. Generally, the degree of deformation is dependent on the welding sequence constraints as well as input power Therefore, in this paper we evaluate the deformation of gas pressure vessel according to the welding sequence and input power. In the analysis of weld deformation, 2-dimensional thermo-elasto-plastic analysis was performed for the gas pressure vessel by using a commercial FE program package.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.17 no.12
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• pp.1177-1184
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• 2005

A numerical analysis was carried out on the heat and mass transfer, and pressure drop characteristics of the modular tube bundle heat exchanger. The finite volume method with a $k-\varepsilon$ turbulence model was used for the analysis. Due to condensation, the total heat transfer rate is observed about $4\~8\%$ higher than that on dry surfaces. Total heat transfer rate increases with increase in the velocity, temperature and relative humidity of incoming air. It also increases with decreasing the aspect ratio of heat exchanger tube. The inlet velocity of cooling water has little effect on the total heat transfer when the other conditions are fixed.

• Proceedings of the SAREK Conference
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• 2006.06a
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• pp.651-656
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• 2006

A performance analysis model has been developed for fin-tube type heat exchanger for $CO_2$ heat pump. The model uses the tube-by-tube method Because air-side thermal resistance has a great portion among total thermal resistances, it is important to understand air-side heat transfer characteristics. The air-side heat transfer correlation has been proposed from experiments using water. The developed model was confirmed by experimental results and can be used for the performance analysis of heat exchanger.

• Journal of Korea Planning Association
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• v.53 no.7
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• pp.87-107
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• 2018

With more than 10 million inhabitants, in particular, Seoul, the capital of Korea, has already experienced a number of severe heat wave. To alleviate the potential impacts of heat wave and the vulnerability to heat wave, policy-makers have generally considered the option of heat wave strategies containing adaptation elements. From the perspective of sustainable planning for adaptation to heat wave, the objective of this study is to identify the elements of vulnerability and assess heat wave-vulnerability at the dong level. This study also performs an exploratory investigation of the spatial pattern of vulnerable areas in Seoul to heat wave by applying exploratory spatial data analysis. Then this study attempts to select areas with the relatively highest and lowest level of adaptive capacity to heat wave based on an framework of climate change vulnerability assessment. In our analysis, the adaptive capacity is the relatively highest for Seongsan-2-dong in Mapo and the relatively lowest for Changsin-3-dong in Jongno. This study sheds additional light on the spatial patterns of heat wave-vulnerability and the relationship between adaptive capacity and heat wave.

• Korean Journal of Computational Design and Engineering
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• v.9 no.4
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• pp.416-424
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• 2004

In this paper, the heat transfer analysis and thermal stress analysis of the PCB(Printed Circuit Board) equipped in electronic Packages are carried out for various may types of chips on the PCB. And two structural PCB models are used in the analyses. The electronic chips on the PCB usually emit heat and this heat generates the thermal stress around the chip. The thermal load due to the heat generation of chips on the PCB may cause the malfunction of the electronic packages such as a monitor. a computer etc. Hence, the PCB should be designed to withstand these thermal loads. In this paper, the heat transfer analysis and thermal stress analysis are executed for the PCB model with pins and the analysis results are compared with the results for the PCB model without pins. The analysis results show that the PCB model without pins is not good for the thermal stress analysis of PCB, even though these two models have similar heat transfer characteristics. The analysis results also show that the highest thermal stress occurs in the pin especially attached to the highest temperature chip, and the PCB constrained to the electronic package on the long side is structurally more stable than other cases. The analyses of the PCB are executed using the finite element analysis code, NISA.