• Journal of the Microelectronics and Packaging Society
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• v.21 no.3
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• pp.7-17
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• 2014

Power electronics modules are semiconductor components that are widely used in airplanes, trains, automobiles, and energy generation and conversion facilities. In particular, insulated gate bipolar transistors(IGBT) have been widely utilized in high power and fast switching applications for power management including power supplies, uninterruptible power systems, and AC/DC converters. In these days, IGBT are the predominant power semiconductors for high current applications in electrical and hybrid vehicles application. In these application environments, the physical conditions are often severe with strong electric currents, high voltage, high temperature, high humidity, and vibrations. Therefore, IGBT module packages involves a number of challenges for the design engineer in terms of reliability. Thermal and thermal-mechanical management are critical for power electronics modules. The failure mechanisms that limit the number of power cycles are caused by the coefficient of thermal expansion mismatch between the materials used in the IGBT modules. All interfaces in the module could be locations for potential failures. Therefore, a proper thermal design where the temperature does not exceed an allowable limit of the devices has been a key factor in developing IGBT modules. In this paper, we discussed the effects of various package materials on heat dissipation and thermal management, as well as recent technology of the new package materials.

• Proceedings of the KSME Conference
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• 2005.11a
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• pp.12.2-12.2
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• 2005

• ETRI Journal
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• v.27 no.3
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• pp.337-340
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• 2005

A spot-size converted Fabry-Perot laser diode (LD) was flip-chip bonded to a silica-terraced planar lightwave circuit(PLC) platform to examine the effect of the silica terrace on the heat dissipation of the LD module. From the measurement of the light-current characteristics, it was discovered that the silica terrace itself is not a strong thermal barrier, but the encapsulation of the integrated LD with an index-matching polymer resin more or less deteriorates the heat dissipation.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.21 no.5
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• pp.746-755
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• 1997

This paper addresses the systematic procedure using sequential approach for the analysis of the coupled thermo-mechanical behavior of a steady rolling tire. Not only the knowledge of mechanical stresses but also of the temperature loading in a rolling tire are very important because material damage and material properties are significantly affected by the temperature. In general, the thermo-mechanical behavior of a pneumatic tire is highly complex transient phenomenon that requires the solution of a dynamic nonlinear coupled themoviscoelasticity problem with heat source resulting from internal dissipation and friction. In this paper, a sequential approach, with effective calculation schemes, to modeling this system is presented in order to predict the temperature distribution with reasonable sccuracies in a steady state rolling tire. This approach has the three major analysis modules-deformation, dissipation, and thermal modules. In the dissipation module, an analytic method for the calculation of the heat source in a rolling tire is established using viscoelastic theory. For the verification of the calculated temperature profiles and rolling resistance at different velocities, they were compared with the measured ones.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07a
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• pp.522-524
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• 2005

The LED light source has many excellent advantages for the application of LCD backlight module. As we know, the operational temperature can significantly influence the characteristics of LEDs. Heat can damage the LED 's quality, and decrease its lifetime and output light intensity. In this paper, we perform computer software, Flomerics CFD (Computational Fluid Dynamics), to simulate heat distribution of the 20.1" LED backlight module we designing, and realize how the different heat sinks can solve the serious heat problem in practice.

• Journal of Advanced Marine Engineering and Technology
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• v.40 no.2
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• pp.96-101
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• 2016

The thermal management of high-power LED components in an assembly structure is crucial for the stable operation and proper luminous function. This study employs numerical tools to determine the optimum thermal design in LEDs with a heat sink consisting of a crevice-type vapor-chamber heat pipe. The effects of the MCPCB are investigated in terms of the substrate thicknesses on which the LEDs are mounted. Further, different placement configurations in a system module are considered. This study found that for a confined area, a power of 40 W/LED is applicable to a high-power package. Furthermore, the thermal conductivity of dielectric layer materials should ideally be greater than 0.9 W/m.K. The temperature conditions of the vapor chamber in a heat pipe greatly affect the thermal performance of the system. At an offset distance of 9.0 mm and a $2^{\circ}C$ increase in the temperature of the heat pipe, the resulting maximum temperature increase is approximately $1.9^{\circ}C$ for each heat dissipation temperature. Finally, at a thermal conductivity of 0.3 W/m.K, it was found that the total thermal resistance changes dramatically. Above 1.2 W/m.K, the resistance change reduces exponentially.

• Journal of the Korean institute of surface engineering
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• v.53 no.4
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• pp.160-168
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• 2020

A polymer-based carbon nanomaterial composite was fabricated and characterized for the application of a thermal conductive adhesive. Low-dimensional carbon nanomaterials with excellent thermal conductivity such as carbon nanotube (CNT) and graphene were selected as a filler in the composite. Thermal, electrical and adhesive properties of the composite were investigated with respect to the morphology and content of the low-dimensional carbon nanomaterials. As a result, the composite-based adhesive fabricated by the loading of surface-treated MWCNTs of 0.4 wt% showed uniform dispersion, moderate adhesion and effective heat dissipation properties. Finally, it was confirmed through the thermal image analysis of LED module that the temperature reduction of 10℃ was achieved using the fabricated composite adhesive with MWCNT-6A. Expecially, heat dissipation performance of the optimized composite adhesive was evident at the hot spot in the module compared to other samples mixed with graphene or different MWCNT loading ratios.

• Transactions of the Korean Society of Automotive Engineers
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• v.19 no.6
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• pp.61-67
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• 2011

The cooling module needs enough space (or distance) from hood to absorb the energy from any pedestrian collision. Downsized cooling module for pedestrian protection is important to reduce the severity of pedestrian injury. When a vehicle collision happens, the downsized cooling module is required to reduce the risk of injury to the upper legs of adults and the heads of children. In this study, the performance of cooling module to cool the engine was investigated under 25% height reduction. The heat dissipation and pressure drop characteristics have been experimentally studied with the variation of coolant flow rate, air inlet velocity and A/C operation ON/OFF for the downsized cooling module. The results indicated that the cooling performance was about 94% level compared to that of the conventional cooling module. Therefore, we checked that the cooling module had good performance, and expected that the cooling module could meet the same cooling performance as conventional cooling module through optimization of components efficiency.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.95-100
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• 2010

LED (Light Emitting Diode) is 85% of the applied energy is converted into heat that is already well known. Lately, LED chips increasing the capacity as result delivered to increase the heat of the LED products and module that directly related to life span and degradation. Thus, in industry the high-power LED chip to control the heat generated during the course of the study and the existing aluminum, copper adhesives, and uses MLC (Metal clad laminate) structures using low-cost FR4 and copper CCL (Copper Clad Laminate) to reduce costs by changing to a study being carried out. In this study, using low-cost CCL Class, mounted 1W LED chip to analyze changes in the thermal resistance. In addition, heat dissipation in the CCL to facilitate a variety of thermal via design outside of the heat generated by the LED chip to control and facilitate the optimal structure of the heat dissipation is suggested.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.18 no.11
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• pp.874-880
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• 2006

The power density and heat dissipation rate per unit area of the telecommunication equipment have been increased with the technology development in the footprint of telecommunication hardware. A proper heat dissipation method from the PCB module is very important to allow reliable operation of its electronic component. In this study, a hybrid air-conditioner for the telecommunication equipment room was designed to save energy and obtain system reliability. For high outdoor temperatures, the hybrid system operates in the vapor compression cycle, while, for low outdoor temperatures, the hybrid system works in the secondary fluid cooling cycle with no operation of the compressor. The performance of the hybrid air-conditioner was measured by varying outdoor and indoor temperatures. The hybrid air-conditioner yielded 50% energy saving compared with the conventional refrigeration system when the mode switch temperature was $8.3^{\circ}C$.