• 마이크로전자및패키징학회지
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• 제19권1호
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• pp.9-16
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• 2012

Currently due to increasing integration of various electronic devices and need of multi-functions, more and more heat is produced and for electronic devices to achieve maximum performance with optimum life time, heat dissipation is critical. A solution to such problems is use of high heat dissipative insulating sheet. In this paper status of current products are introduced and several technology aspects to meet the demand of increased heat dissipation needs is introduced.

• Journal of Advanced Marine Engineering and Technology
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• 제40권8호
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• pp.686-691
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• 2016

This paper employs numerical tools to obtain an optimal thermal design of a heat exchanger with plain-fins. This heat exchanger is located at the condensing section of a crevice-type heat pipe. The plain-fins in the heat exchanger are radically mounted to two tubes in the condensing section. To obtain the optimal design parameters, a computational fluid dynamics technique is introduced and applied to different placement configurations in a system module. Owing to its effects on the heat pipe performance, the temperature difference between the tube surfaces and ambient air is investigated in detail. A greater heat dissipation rate occurs when the plain-fin offsets change from 2 to 3 mm. When this temperature difference is ${\Delta}T=70^{\circ}C$, the upper part of the plain-fins undergoes an accumulation of heat. At below $70^{\circ}C$, the dissipation of heat is accepted. A rectangular plain-fin geometry with varying widths and heights does not have a significant impact on the heat dissipation through-out the overall system. In addition, the temperature distributions between different plain-fin pitches show an equal profile even with different fin pitches.

• 한국항행학회논문지
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• 제24권4호
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• pp.261-266
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• 2020

항공기 장착물에 KW급 전력변환장치가 탑재되는 경우, 전력 변환 시 발생하는 대량의 발열에 대한 방열설계가 고려되어야 한다. 적절한 방열을 하지 못하는 경우, 장비 오작동 및 화재의 우려가 발생하며 이는 항공기 운항에 있어 치명적인 요인이 될 수 있다. 본 논문은 항공기 장착물에 탑재되는 KW급 전력변환장치의 방열설계에 관하여 기술하였다. 전산해석을 통한 설계 및 제작 후 시험을 수행하였으며, 고전력 변환에 따른 발열부품의 급격한 발열 현상을 확인하여 해석 모델을 보정하였다. 모델 보정 후 방열구조가 개선된 형상으로 설계를 개선하였으며, 미 군사규격인 MIL-STD-810G 의 고온동작 시험을 수행하여 개선된 형상의 타당성을 검증하였다.

• 한국전기전자재료학회논문지
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• 제36권6호
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• pp.633-637
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• 2023

Recently, with the development of the smart device market, the integration of high-functional devices has increased the heat density, causing overload of the device, and resulting in various problems such as shortened lifespan, performance degradation, and failure. Therefore, research on heat dissipation materials is being actively conducted to realize next-generation electronic products. The heat dissipation material is characterized in that it is easy to dissipate heat due to its high thermal conductivity and minimizes leakage current flowing through the heat dissipation material due to its low electrical conductivity. In this study, flower-shaped Al₂O₃ and BN composites were engineered with a simple hydrothermal synthesis approach, and their thermal conductivity characteristics were compared and evaluated for each synthesis condition for the application to a heat dissipation material. Spherical BN and flower-shaped Al₂O₃ were easily obtained, and SEM/EDS analyses confirmed the uniform presence of BN between the Al₂O₃, and it can be expected that these shapes can affect the thermal conductivity.

• 한국산학기술학회논문지
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• 제20권1호
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• pp.170-178
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• 2019

최근 에너지 절감에 대한 관심도가 높아짐에 따라 에너지 소비가 높은 형광등과 백열등을 대체하는 친환경소재인 LED의 조명을 활용하는 움직임이 활발하다. 그러나, 고출력 LED의 경우 발열에 의한 열화현상 때문에 수명이 단축되는 현상이 발생하게 된다. 이에 대한, 해결방안으로 본 논문은 LED Packing중 방열판표면의 거칠기 처리를 통하여 열전달 계수를 증대시킴으로서 LED 수명연장 효과를 평가하였다. 거칠기 공정은 사포 및 샌드블라스트를 이용하여 진행하였다. 각 표면처리 공정에 따른 거칠기 및 표면적 변화를 정량적으로 평가하였으며, 열전달 계수를 측정하였다. 샌드블라스트, 사포를 이용하여 알루미늄 표면에 거칠기처리를 진행했을 경우 미 처리 시 보다 높은 대류 열전달 계수를 얻을 수 있었고, 샌드블라스트 처리 시 약 82.76%의 높은 방열 효율 향상을 얻을 수 있어, 이를 방열판에 적용할 시 큰 경제적 부담 없이 기존대비 더 높은 방열효율 증대를 통해 LED 수명을 대폭 연장 시킬 것으로 기대된다.

• 한국전산유체공학회:학술대회논문집
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• 한국전산유체공학회 2005년도 춘계 학술대회논문집
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• pp.91-95
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• 2005

A heat dissipation modeling method of EEE parts is developed for thermal design and analysis of an satellite electronic equipment. The power consumption measurement value of each functional breadboard is used for the heat dissipation modeling method. For the purpose of conduction heat transfer modeling of EEE parts, surface heat model using very thin ignorable thermal plates is developed instead of conventional lumped capacity nodes. The thermal plates are projected to the printed circuit board and can be modeled and modified easily by numerically preprocessing programs according to design changes. These modeling methods are applied to the thermal design and analysis of CTU and verified by thermal cycling and vacuum tests.

• 대한전기학회논문지
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• 제45권4호
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• pp.553-557
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• 1996

Heat cycle aging of insulating materials in large generator stator winding has been investigated using both on-line and off-line test methods. On this study, principally, off-line test against actual generator in service was carried out to acquire information about polarization index(PI) and dissipation factor, dissipation factor tip-up, maximum partial discharge for the purpose of remnant breakdown voltage and life assessment. It was found from the tests that both dissipation factor and maximum partial discharge decreased with the increase of operating hours and starting numbers. It was found from off-line tests that the remnant breakdown voltage had a strong relationship with both dissipation factor and maximum partial discharge the remnant breakdown voltage as a results of both operating hours and starting number and the nondestructive tests were proposed as parameters which can predict the remnant lifetime of insulating materials in large generator stator windings. (author). 8 refs., 8 figs., 2 tabs.

• 한국정밀공학회지
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• 제21권3호
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• pp.117-123
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• 2004

A brake disc with helical grooved vent in radial direction is proposed for the improvement of thermal dissipation. The heat transfer phenomenon is analyzed far both the proposed disc and the conventional one using finite element method. The thermal dissipation is considerably influenced by the geometrical differences of the brake discs. The results of the analysis show that the proposed brake disc with helical grooved vent has the improved performance to dissipate the thermal energy more effectively.

• Journal of Advanced Marine Engineering and Technology
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• 제39권8호
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• pp.801-806
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• 2015

The experimental analysis of a crevice-type vapor chamber heat pipe (CVCHP) is investigated. The heat source of the CVCHP is a high-power light-emitting diode (LED). The CVCHP, which exhibits a bubble pumping effect, is used for heat dissipation in a high-heat-flux system. The working fluid is R-141b, and its charging ratio was set at 60 vol.% of the vapor chamber in a heat pipe. The total thermal conductivity of the falling-liquid-film-type model, which was a modified model, was 24% larger than that of the conventional model in the LED package. Flow visualization results indicated that bubbles grew larger as they combined. These combined bubbles pushed the working fluid to the top, partially wetting the heat-transfer area. The thermal resistance between the vapor chamber and tube in the modified design decreased by approximately 32%. The overall results demonstrated the better heat dissipation upon cooling of the high-power LED package.

• 한국기계가공학회지
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• 제18권12호
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• pp.82-90
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• 2019

This analysis demonstrates the effective removal of heat generated from a solar panel's output degradation factor solar cells (the solar panel's output deterioration factor), and solves the problems of oxidation and corrosion in existing metal heat sinks. The heat-dissipating test specimen was prepared using carbon materials; then, its thermal conductivity and its effectiveness in reducing temperatures were studied using heat transfer numerical analysis. As a result, the test specimen of the 30g/㎡ basis weight containing 80% of carbon fiber impregnated with carbon ink showed the highest thermal conductivity 6.96 W/(m K). This is because the surface that directly contacted the solar panel had almost no pores, and the conduction of heat to the panels appeared to be active. In addition, a large surface area was exposed to the atmosphere, which is considered advantageous in heat dissipation. Finally, numerical analysis confirmed the temperature reduction effectiveness of 2.18℃ in a solar panel and 1.08℃ in a solar cell, depending on the application of heat dissipating materials.