Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Review of Technology Development of High Heat Dissipative Insulating Sheet

고방열 절연시트의 기술개발 동향

  • Received : 2012.02.29
  • Accepted : 2012.03.09
  • Published : 2012.03.31
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Abstract

Currently due to increasing integration of various electronic devices and need of multi-functions, more and more heat is produced and for electronic devices to achieve maximum performance with optimum life time, heat dissipation is critical. A solution to such problems is use of high heat dissipative insulating sheet. In this paper status of current products are introduced and several technology aspects to meet the demand of increased heat dissipation needs is introduced.

Keywords

References

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