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http://dx.doi.org/10.6117/kmeps.2012.19.1.009

Review of Technology Development of High Heat Dissipative Insulating Sheet  

Yoo, Myong-Jae
Park, Seong-Dae
Lim, Ho-Sun
Lee, Woo-Sung
Publication Information
Journal of the Microelectronics and Packaging Society / v.19, no.1, 2012 , pp. 9-16 More about this Journal
Abstract
Currently due to increasing integration of various electronic devices and need of multi-functions, more and more heat is produced and for electronic devices to achieve maximum performance with optimum life time, heat dissipation is critical. A solution to such problems is use of high heat dissipative insulating sheet. In this paper status of current products are introduced and several technology aspects to meet the demand of increased heat dissipation needs is introduced.
Keywords
Heat dissipation; Insulation; Composite; Sheet;
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