• Journal of the Microelectronics and Packaging Society
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• v.19 no.1
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• pp.9-16
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• 2012

Currently due to increasing integration of various electronic devices and need of multi-functions, more and more heat is produced and for electronic devices to achieve maximum performance with optimum life time, heat dissipation is critical. A solution to such problems is use of high heat dissipative insulating sheet. In this paper status of current products are introduced and several technology aspects to meet the demand of increased heat dissipation needs is introduced.

• Journal of Advanced Marine Engineering and Technology
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• v.40 no.8
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• pp.686-691
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• 2016

This paper employs numerical tools to obtain an optimal thermal design of a heat exchanger with plain-fins. This heat exchanger is located at the condensing section of a crevice-type heat pipe. The plain-fins in the heat exchanger are radically mounted to two tubes in the condensing section. To obtain the optimal design parameters, a computational fluid dynamics technique is introduced and applied to different placement configurations in a system module. Owing to its effects on the heat pipe performance, the temperature difference between the tube surfaces and ambient air is investigated in detail. A greater heat dissipation rate occurs when the plain-fin offsets change from 2 to 3 mm. When this temperature difference is ${\Delta}T=70^{\circ}C$, the upper part of the plain-fins undergoes an accumulation of heat. At below $70^{\circ}C$, the dissipation of heat is accepted. A rectangular plain-fin geometry with varying widths and heights does not have a significant impact on the heat dissipation through-out the overall system. In addition, the temperature distributions between different plain-fin pitches show an equal profile even with different fin pitches.

• Journal of Advanced Navigation Technology
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• v.24 no.4
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• pp.261-266
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• 2020

When a KW-class power control unit is installed in an aircraft installation, a heat dissipation design for a large amount of heat generated during power conversion should be considered. Failure to provide adequate heat dissipation can lead to equipment malfunction and fire, which can be a fatal factor in aviation operations. This paper describes the heat dissipation design of a KW-class power control unit installed in aircraft installation. The design and manufacturing test were conducted through computerized analysis, and the analysis model was corrected by confirming the rapid heat generation phenomenon of the heating element due to high power control. After the model revision, the design was improved, and the high-temperature operation test of the US military standard MIL-STD-810G was performed to confirm the feasibility of the improved design.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.36 no.6
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• pp.633-637
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• 2023

Recently, with the development of the smart device market, the integration of high-functional devices has increased the heat density, causing overload of the device, and resulting in various problems such as shortened lifespan, performance degradation, and failure. Therefore, research on heat dissipation materials is being actively conducted to realize next-generation electronic products. The heat dissipation material is characterized in that it is easy to dissipate heat due to its high thermal conductivity and minimizes leakage current flowing through the heat dissipation material due to its low electrical conductivity. In this study, flower-shaped Al₂O₃ and BN composites were engineered with a simple hydrothermal synthesis approach, and their thermal conductivity characteristics were compared and evaluated for each synthesis condition for the application to a heat dissipation material. Spherical BN and flower-shaped Al₂O₃ were easily obtained, and SEM/EDS analyses confirmed the uniform presence of BN between the Al₂O₃, and it can be expected that these shapes can affect the thermal conductivity.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.1
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• pp.170-178
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• 2019

Recently, as the interest in energy savings has increased, there has been increasing use of LED lighting, which is an eco-friendly device that replaces high energy consuming fluorescent lamps and incandescent lamps. In the case of a high output LED, however, the life time is shortened due to deterioration caused by heat generation. As a solution to this problem, this paper evaluated the LED life extension effect by increasing the convective heat transfer coefficient of the heat sink surface for LED packaging. A roughing process was carried out using sandpaper and sand blasting. The changes in surface roughness and surface area after each surface treatment process were evaluated quantitatively and the convective heat transfer coefficient was measured. When sandblasting and sandpaper were used to roughen the aluminum surface, a higher convection heat transfer coefficient was obtained compared to the untreated case, and a high heat dissipation efficiency of 82.76% was obtained in the sandblast treatment. Therefore, it is expected that the application of heat dissipation to the heat sink will extend the lifetime of the LED significantly and economically by increasing the heat efficiency.

• 한국전산유체공학회:학술대회논문집
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• 2005.04a
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• pp.91-95
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• 2005

A heat dissipation modeling method of EEE parts is developed for thermal design and analysis of an satellite electronic equipment. The power consumption measurement value of each functional breadboard is used for the heat dissipation modeling method. For the purpose of conduction heat transfer modeling of EEE parts, surface heat model using very thin ignorable thermal plates is developed instead of conventional lumped capacity nodes. The thermal plates are projected to the printed circuit board and can be modeled and modified easily by numerically preprocessing programs according to design changes. These modeling methods are applied to the thermal design and analysis of CTU and verified by thermal cycling and vacuum tests.

• The Transactions of the Korean Institute of Electrical Engineers
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• v.45 no.4
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• pp.553-557
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• 1996

Heat cycle aging of insulating materials in large generator stator winding has been investigated using both on-line and off-line test methods. On this study, principally, off-line test against actual generator in service was carried out to acquire information about polarization index(PI) and dissipation factor, dissipation factor tip-up, maximum partial discharge for the purpose of remnant breakdown voltage and life assessment. It was found from the tests that both dissipation factor and maximum partial discharge decreased with the increase of operating hours and starting numbers. It was found from off-line tests that the remnant breakdown voltage had a strong relationship with both dissipation factor and maximum partial discharge the remnant breakdown voltage as a results of both operating hours and starting number and the nondestructive tests were proposed as parameters which can predict the remnant lifetime of insulating materials in large generator stator windings. (author). 8 refs., 8 figs., 2 tabs.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.3
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• pp.117-123
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• 2004

A brake disc with helical grooved vent in radial direction is proposed for the improvement of thermal dissipation. The heat transfer phenomenon is analyzed far both the proposed disc and the conventional one using finite element method. The thermal dissipation is considerably influenced by the geometrical differences of the brake discs. The results of the analysis show that the proposed brake disc with helical grooved vent has the improved performance to dissipate the thermal energy more effectively.

• Journal of Advanced Marine Engineering and Technology
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• v.39 no.8
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• pp.801-806
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• 2015

The experimental analysis of a crevice-type vapor chamber heat pipe (CVCHP) is investigated. The heat source of the CVCHP is a high-power light-emitting diode (LED). The CVCHP, which exhibits a bubble pumping effect, is used for heat dissipation in a high-heat-flux system. The working fluid is R-141b, and its charging ratio was set at 60 vol.% of the vapor chamber in a heat pipe. The total thermal conductivity of the falling-liquid-film-type model, which was a modified model, was 24% larger than that of the conventional model in the LED package. Flow visualization results indicated that bubbles grew larger as they combined. These combined bubbles pushed the working fluid to the top, partially wetting the heat-transfer area. The thermal resistance between the vapor chamber and tube in the modified design decreased by approximately 32%. The overall results demonstrated the better heat dissipation upon cooling of the high-power LED package.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.18 no.12
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• pp.82-90
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• 2019

This analysis demonstrates the effective removal of heat generated from a solar panel's output degradation factor solar cells (the solar panel's output deterioration factor), and solves the problems of oxidation and corrosion in existing metal heat sinks. The heat-dissipating test specimen was prepared using carbon materials; then, its thermal conductivity and its effectiveness in reducing temperatures were studied using heat transfer numerical analysis. As a result, the test specimen of the 30g/㎡ basis weight containing 80% of carbon fiber impregnated with carbon ink showed the highest thermal conductivity 6.96 W/(m K). This is because the surface that directly contacted the solar panel had almost no pores, and the conduction of heat to the panels appeared to be active. In addition, a large surface area was exposed to the atmosphere, which is considered advantageous in heat dissipation. Finally, numerical analysis confirmed the temperature reduction effectiveness of 2.18℃ in a solar panel and 1.08℃ in a solar cell, depending on the application of heat dissipating materials.