• Korean Journal of Materials Research
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• v.14 no.8
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• pp.552-557
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• 2004

Thin Ni-B films, 1 ${\mu}m$ thick, were electrolessly deposited on Cu bus electrode fabricated by electro deposition. The purpose of these films is to encapsulate Cu electrodes for preventing Cu oxidation and to serve as a diffusion barrier against copper contamination of dielectric layer in AC-plasma display panel. The layers were heat treated at $580^{\circ}C$(baking temperature of dielectric layer) with and without pre-annealing at $300^{\circ}C$($Ni_{3}B$ formation temperature) for 30 minutes. In the layer with pre-annealing, amount of Cu diffusion was lower about 5 times than that in the layer without pre-annealing. The difference of Cu concentration could be attributed to Cu diffusion before $Ni_{3}B$ formation at grain boundaries. However, the diffusion behavior of the layer with pre-annealing was similar to that of the layer without pre-annealing after $Ni_{3}B$ formation. With increasing annealing time, Cu concentration of both layers increased due to grain growth.

• Journal of the Korean Society of Combustion
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• v.14 no.4
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• pp.33-40
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• 2009

Waste Thermal Pyrolysis Melting process was proposed and has been studied in order to prevent air pollution by dioxin and fly ash generated from combustion process for disposal of waste. In this study, applicability as the fuel of diffusion burner of synthesis gas formed from Waste Thermal Pyrolysis process was addressed. Results showed that there is no big difference in the flame shape between MNDF and SNDF, and lift off was detected in MIDF but flame is more stable in SIDF which contains hydrogen with high combustion velocity as flow rate in first nozzle is increased. And radiation heat flux in inverse diffusion flame of synthesis gas was found to be more by 1.5 times than that in inverse diffusion flame of methane because of higher mole fraction of $CO_2$ with high emissivity in product gas.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.32 no.12
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• pp.915-923
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• 2008

The performance experiments for a microchannel printed circuit heat exchanger (PCHE) of high-performance and high-efficiency on the two technologies of micro photo-etching and diffusion bonding were performed in this study. The microchannel PCHE were experimentally investigated for Reynolds number in ranges of 100 $\sim$ 700 under various flow conditions in the hot side and the cold side. The inlet temperatures of the hot side were conducted in range of $40^{\circ}C\;{\sim}\;50^{\circ}C$ while that of the cold-side were fixed at $20^{\circ}C$. In the flow pattern, the counter flow was provided 6.8% and 10 $\sim$ 15% higher average heat transfer rate and heat transfer performance than the parallel flow, respectively. The average heat transfer rate, heat transfer performance and pressure drop increases with increasing Reynolds number in all the experiment. The increasing of inlet temperature in the experiment range has not an effect on the heat transfer performance while the pressure drop decrease slightly with that of inlet temperature. The experimental correlations to the heat transfer coefficient and pressure drop factor as a function of the Reynolds number have been suggested for the microchannel PCHE.

• Journal of computational fluids engineering
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• v.8 no.4
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• pp.34-40
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• 2003

The effect of nose radius on aerodynamic heating is investigated by using the Navier-Stokes code extended to thermochemical nonequilibrium airflow, Spherical blunt bodies, whose nose radius varies from 0.O03048 m to 0.6096 m, flying at Mach 25 at an altitude of 53.34 km are considered. Comparison of heat flux at stagnation point with the solution of Viscous Shock Layer and Fay-Riddell are made. Results show that the flow for very small radius is in a nearly frozen state, and therefore the heat flux due to diffusion is smaller than that due to translational energy. As the radius becomes larger, the portion of heat flux by diffusion becomes greater than that of heat flux by translational temperature and approaches to a constant value.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.30A no.7
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• pp.47-59
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• 1993

The thermal stability of "stuffed" TiN/Ti barrier matals with different annealing history has been studied to improve the contact reliability of Al/Si contacts in 16M DRAM. The annealing conditions before the Al deposition such as film thickness, the annealing temperature and the annealing ambient have been varied. For TiN(900A)/Ti(300A) annealed at 450 in nitrogen ambient to form a "stuffed barrier" by inducing oxygen atoms into grain boundaries, there is no observation of Al penetrations into Si substrates after the post heat treatment of up to 700 even though there are massive amounts of Al found in TiN film after the post heat treatment of 600 indicating that TiN has a "sponge-like" function due to its ability to absorb several amounts of aluminum at elevated temperature. The TiN/Ti diffusion barrier annealed at 550 has, however, failed after the post heat treatment at 600. The thinner diffusion barriers with TiN(300A)/Ti(100A) failed after the post heat treatment at 600.he post heat treatment at 600.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.9
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• pp.589-595
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• 2017

MOS-FET structured gas sensors were manufactured using MWCNTs for application as NOx gas sensors. As the gas sensors need to be heated to facilitate desorption of the gas molecules, heat dispersion plays a key role in boosting the degree of uniformity of molecular desorption. We report the desorption of gas molecules from the sensor at $150^{\circ}C$ for different sensor electrode gaps (30, 60, and $90{\mu}m$). The COMSOL analysis program was used to verify the process of heat dispersion. For heat analysis, structure of FET gas sensor modeling was proceeded. In addition, a property value of the material was used for two-dimensional modeling. To ascertain the degree of heat dispersion by FEM, the governing equations were presented as partial differential equations. The heat analysis revealed that although a large electrode gap is advantageous for effective gas adsorption, consideration of the heat dispersion gradient indicated that the optimal electrode gap for the sensor is $60{\mu}m$.

• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1651-1656
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• 2003

The present study has been conducted to analytically investigate the thermal control performance of variable conductance heat pipe(YCHP) with axial grooves. The condenser port of the YCHP is occupied by a inert gas in which the concentration of gas is varied with the operation temperature and the heat transport capacity is thus varied with the operating temperature due to the variation of inert gas concentration. In this study, numerical evaluation for the thermal control of the YCHP with axial grooves is made from the 1st order diffusion model that considers the diffusive expansion of inert gas by concentration gradient. Ammonia is used as a working fluid and Nitrogen as a control gas in the Aluminum tube. As a result, the thermal performance of YCHP based on diffusion model has been compared with that of YCHP from flat front model. Additionally, it is found that the concentration of inert gas is distributed in the condenser region of YCHP with axial grooves.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.2
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• pp.150-155
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• 2004

This study attempts to form a TiN barrier layer against Cu diffusion by the easier and more convenient method. In this new approach, Ti was sputter-deposited, and nitrided by heat-treating in the NH$_3$ambient. Sheet resistance of as-deposited Ti was 20 Ω/$\square$, but increased to 195 Ω/$\square$ after the heat-treatment at 30$0^{\circ}C$, and lowered to 120 Ω/$\square$ after the heat-treatment at 50$0^{\circ}C$, and $600^{\circ}C$. AES results for these thin films confirmed that the atomic ratio of Ti and N was close to 1:1 at or above 40$0^{\circ}C$ heat-treatment. However, it was also found that excessive oxygen was contained in the TiN layer. To examine the barrier property against Cu diffusion, 100nm Cu was deposited on the TiN layer and then annealed at 40$0^{\circ}C$ for 40 min.. Cu remained at the surface without diffusing into the Si layer.

• Nuclear Engineering and Technology
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• v.40 no.3
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• pp.233-238
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• 2008

This study investigates the surface modification of a Hastelloy X plate and diffusion bonding in the assembly of surface modified plates. These types of plates are involved in the key processes in the fabrication of a process heat exchanger (PHE) for a $SO_3$ decomposer. Strong adhesion of a SiC film deposited onto Hastelloy X can be achieved by a thin SiC film deposition and a subsequent N ion beam bombardment followed by an additional deposition of a thicker film that prevents the Hastelloy X surface from becoming exposed to a corrosive environment through the pores. This process not only produces higher corrosion resistance as proved by electrolytic etching but also exhibits higher endurance against thermal stress above 9$900^{\circ}C$. A process for a good bonding between Hastelloy X sheets, which is essential for a good heat exchanger, was developed by diffusion bonding. The diffusion bonding was done by mechanically clamping the sheets under a heat treatment at $900^{\circ}C$. When the clamping jig consisted of materials with a thermal expansion coefficient that was equal to or less than that of the Hastelloy X, sound bonding was achieved.

• Nuclear Engineering and Technology
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• v.53 no.3
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• pp.833-841
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• 2021

During the postulated severe accident of nuclear reactor, eutectic reaction leads to low-temperature melting of fuel cladding and early failure of core structure. In order to model eutectic melting with the moving particle semi-implicit (MPS) method, the eutectic reaction model is developed to simulate the eutectic reaction phenomenon. The coupling of mass diffusion and phase diagram is applied to calculate the eutectic reaction with the uniform temperature. A heat transfer formula is proposed based on the phase diagram to handle the heat release or absorption during the process of eutectic reaction, and it can combine with mass diffusion and phase diagram to describe the eutectic reaction with temperature variation. The heat transfer formula is verified by the one-dimensional melting simulations and the predicted interface position agrees well with the theoretical solution. In order to verify the eutectic reaction models, the eutectic reaction of uranium and iron in two semi-infinite domains is simulated, and the profile of solid thickness decrease over time follows the parabolic law. The modified MPS method is applied to calculate Transient Reactor Test Facility (TREAT) experiment, the penetration rate in the simulations are agreeable with the experiment results. In addition, a hypothetical case based on the TREAT experiment is also conducted to validate the eutectic reaction with temperature variation, the results present continuity with the simulations of TREAT experiment. Thus the improved method is proved to be capable of simulating the eutectic reaction in the severe accident.