• Title/Summary/Keyword: HEMT

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High Breakdown-Voltage AlGaN/GaN High Electron Mobility Transistor having a Trapezoidal Gate Structure (사다리꼴 게이트 구조를 갖는 고내압 AlGaN/GaN HEMT)

  • Kim, Jae-Moo;Kim, Su-Jin;Kim, Dong-Ho;Jung, Kang-MIn;Choi, Hong-Goo;Hahn, Cheol-Koo;Kim, Tae-Geun
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.46 no.4
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    • pp.10-14
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    • 2009
  • We propose a trapezoidal gate AlGaN/GaN high electron mobility transistor(HEMT) to improve the breakdown voltage characteristics and its feasibility is investigated by two-dimensional device simulations. The use of a trapezoidal gate structure appears to be quite effective in dispersing the electric fields concentrated near the gate edge on the drain side from the simulation result. We find that a peak value of the electric field along the 2-DEG channel is reduced by 30%, from 4.8 to 3.5 MV/cm and thereby, the breakdown voltage(Vbr) of the proposed AlGaN/GaN HEMT is increased by about 40%, from 49 to 69 V, compared to those of the standard AlGaN/GaN HEMT.

The Impact of NiO on the Electrical Characteristics of AlGaN/GaN MOSHFET (NiO 게이트 산화막에 의한 AlGaN/GaN MOSHFET의 전기적 특성 변화)

  • Park, Yong Woon;Yang, Jeon Wook
    • Journal of IKEEE
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    • v.25 no.3
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    • pp.511-516
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    • 2021
  • The electrical characteristics of AlGaN/GaN/HEMT and MOSHFETs with NiO were studied. The threshold voltage of NiO MOSHFET revealed positive shift of +1.03 V than the -3.79 V of HEMT and negative shift of -1.73 V for SiO2 MOSHFET. Also, NiO MOSHFET showed better linearity in drain current corresponding to gate voltage and higher transconductance at positive gate voltage than the others. The response of gate pulse with base voltage of -5 V was different for both transistors as HEMT showed 20 % drain current decrease at the frequency range of 0.1 Hz~10 Hz and NiO MOSHFET decreased continuously above 10 Hz.

A Dual Gate AlGaN/GaN High Electron Mobility Transistor with High Breakdown Voltages (높은 항복 전압 특성을 가지는 이중 게이트 AlGaN/GaN 고 전자 이동도 트랜지스터)

  • Ha Min-Woo;Lee Seung-Chul;Her Jin-Cherl;Seo Kwang-Seok;Han Min-Koo
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.54 no.1
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    • pp.18-22
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    • 2005
  • We have proposed and fabricated a dual gate AlGaN/GaN high electron mobility transistor (HEMT), which exhibits the low leakage current and the high breakdown voltage for the high voltage switching applications. The additional gate between the main gate and the drain is specially designed in order to decrease the electric field concentration at the drain-side of the main gate. The leakage current of the proposed HEMT is decreased considerably and the breakdown voltage increases without sacrificing any other electric characteristics such as the transconductance and the drain current. The experimental results show that the breakdown voltage and the leakage current of proposed HEMT are 362 V and 75 nA while those of the conventional HEMT are 196 V and 428 nA, respectively.

Implementation and Evaluation of Interleaved Boundary Conduction Mode Boost PFC Converter with Wide Band-Gap Switching Devices

  • Jang, Jinhaeng;Pidaparthy, Syam Kumar;Choi, Byungcho
    • Journal of Power Electronics
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    • v.18 no.4
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    • pp.985-996
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    • 2018
  • The implementation and performance evaluation of an interleaved boundary conduction mode (BCM) boost power factor correction (PFC) converter is presented in this paper by employing three wide band-gap switching devices: a super junction silicon (Si) MOSFET, a silicon carbide (SiC) MOSFET and a gallium nitride (GaN) high electron mobility transistor (HEMT). The practical considerations for adopting wide band-gap switching devices to BCM boost PFC converters are also addressed. These considerations include the gate drive circuit design and the PCB layout technique for the reliable and efficient operation of a GaN HEMT. In this paper it will be shown that the GaN HEMT exhibits the superior switching characteristics and pronounces its merits at high-frequency operations. The efficiency improvement with the GaN HEMT and its application potentials for high power density/low profile BCM boost PFC converters are demonstrated.

A Design of High Power Pulsed Solid State Power Amplifier for S-Band RADAR System Using GaN HEMT (GaN HEMT를 이용한 S-대역 레이더시스템용 고출력 펄스 SSPA 설계)

  • Kim, Ki-Won;Kwack, Ju-Young;Cho, Sam-Uel
    • Proceedings of the KAIS Fall Conference
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    • 2010.11a
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    • pp.168-171
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    • 2010
  • 본 논문에서는 GaN HEMT 소자를 이용한 고출력 고효율 특성을 가지는 광대역 SSPA의 개발을 다루고 있다. 개발한 SSPA는 8W 급과 15W 급의 GaN HEMT 소자를 사용하여 Pre-Drive 증폭단을 구성하였으며, Drive 증폭단은 50W/150W급 GaN HEMT 소자를 직/병렬구조로 사용하였다. Main 증폭단은 4-way 분배기와 결합기를 이용한 Balanced Structure를 적용하여 높은 출력을 구현하였으며, 안정적인 동작을 위하여 음(-)전원 제어 회로와 출력신호 검출 회로를 포함하고 있다. 제작된 SSPA의 사용가능 대역은 2.9GHz~3.3GHz로 단일전원을 사용하고 있으며 100us 펄스 폭, 10% Duty Cycle 조건에서 60dB의 전압이득, 1kW 출력과 약 28% 효율 특성을 가지는 것으로 측정되었다. 본 논문에서 개발한 SSPA는 S-대역을 사용하는 레이더시스템의 송신단에 적용될 수 있다.

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A Study on HEMT Device Process, Part III: Fabrication of a discrete Device and its Characteristics (HEMT 소자 공정연구, Part III : 개별소자 제작 및 특성분석)

  • 이종람;이재진;맹성재;박성호;마동훈;강태원;김진섭;마동성
    • Journal of the Korean Institute of Telematics and Electronics
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    • v.26 no.11
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    • pp.1706-1711
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    • 1989
  • Unit processes for the fabrication of HEMT(high electron mobility transistor)was studied and the optimum conditions of them were applied to the fabrifcation of a discrete HEMT device. The HEMT with a nominal gate-source spacing of 3.6\ulcorner and a gate length of 2.8\ulcorner showed a transconductance of 46.1mS/mm and a threshold voltage of -0.29V. A source-drain voltage of 2.0V for a saturation current of 35mA/mm was achieved.

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Numerical Simulation of AlGaN/GaN HEMT (AlGaN/GaN HEMT의 수치해석 시뮬레이션 연구)

  • Ha, Min-Woo;Choi, Kangmin;Kwag, Jaewon
    • Proceedings of the KIEE Conference
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    • 2015.07a
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    • pp.1124-1125
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    • 2015
  • 밴드-갭이 큰 반도체는 실리콘에 비하여 다양한 전기 물성 장점을 가져 고주파수 증폭 소자나 차세대 전력 반도체 소자로 각광을 받고 있다. 다양한 와이드 밴드-갭 반도체 중 AlGaN/GaN 이종접합 반도체는 채널의 높은 전도성과 높은 임계 전계로 인하여 우수한 전기적 특성을 가진다. 최근 발전된 수치해석 시뮬레이션을 이용하여 AlGaN/GaN 고전자 이동도 트랜지스터 (high-electron-mobility transistor, HEMT)의 설계연구를 진행하였다. AlGaN 장벽층의 두께가 증가할수록 채널의 전자 면 농도가 증가하도록 설계하였다. 또한 게이트 필드 플레이트 설계를 통하여 AlGaN/GaN HEMT의 역방향 전계 피크를 1개에서 2개로 증가시켜 항복전압을 368 V에서 최대 822 V로 개선하였다. 수렴문제를 개선한 수치해석 시뮬레이션은 RF power AlGaN/GaN HEMT의 설계에 유용하다.

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2DEG Calculation in InP HEMT (InP HEMT의 2DEG계산)

  • Hwang, K.C.;Ahn, H.K.;Han, D.Y.
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2003.07a
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    • pp.316-318
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    • 2003
  • 양자우물 구조를 사용한 HEMT(High Electron Mobility Transistor)는 고속 스위칭 소자와 초고주파 통신용 소자 및 센서에에 우수한 동작특성을 갖고 있다. 본 논문에서는 AlInAs/InP HEMT의 heterostructure를 파동방정식과 Poisson 방정식을 self-consistent 한 방법으로 해석하였다. 파동방정식으로 junction의 전자농도를 계산하고, Poisson 방정식을 해석하여 potential profile에 의한 전자 농도가 heterostructure에서 self-consistent가 되도록 연산하였다. 끝으로 AlInAs/InP 구조에서 positively ionized donor, valance band에서의 hole, conduction band의 free electron과 구조내의 2DEG를 AlGaAs/GaAs 및 AlGaAs/InGaAs/GaAs와 비교하였다.

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