• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.233-236
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• 2003

수소 가스발생을 위한 마이크로 수소 발생기 개발에서 MEMS 공정을 이용하여 기판에 반응 유로를 위해 HAR(High Aspect Ratio) 구조물을 형성하고 Ru(ruthenium) 박막을 증착하여 수소 발생량을 측정하였다. Pyrex glass 기판상에 sand blast 방법으로 반응 구조물을 만들었으며, 그 위에 sputter system을 이용하여 Ru 박막을 $5500{\AA}$었다. 수소 발생량은 촉매 박막이 증착된 기판 재질과 기판의 표면 상태 그리고 마이크로 수소 발생기에 두께로 증착하였다. 반응 구조물의 전체 크기가 가로 2.0 cm, 세로 2.0cm의 면적에서 약 12.3 ml/min의 수소가 측정되 형성한 구조물의 형상에 의존하였다. Pyrex glass 기판을 사용하여 HAR로 반응 구조물을 형성한 경우에 단위 면적당 Ru 박반응 막의 반응 표면적이 증가되어 기존에 구조물을 형성하지 않은 평면 기판에 비교하여 약 5.5배 이상의 수소 발생이 증가하였다.

• The Korean Journal of Applied Statistics
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• v.35 no.1
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• pp.49-62
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• 2022

Realized volatility is well known to have long memory, strong association with other global financial markets and interdependences among macroeconomic indices such as exchange rate, oil price and interest rates. This paper proposes autoencoder factor-augmented heterogeneous autoregressive (AE-FAHAR) model for realized volatility forecasting. AE-FAHAR incorporates long memory using HAR structure, and exogenous variables into few factors summarized by autoencoder. Autoencoder requires intensive calculation due to its nonlinear structure, however, it is more suitable to summarize complex, possibly nonstationary high-dimensional time series. Our AE-FAHAR model is shown to have smaller out-of-sample forecasting error in empirical analysis. We also discuss pre-training, ensemble in autoencoder to reduce computational cost and estimation errors.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.40 no.8
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• pp.731-736
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• 2016

Three-dimensional (3D) high-aspect-ratio (HAR) microstructures for biomedical applications (e.g., microneedle, microadhesive, etc.) are microfabricated using the hybrid ultraviolet (UV) lithography in which inclined, rotational, and reverse-side UV exposure processes are combined together. The inclined and rotational UV exposure processes are intended to fabricate tapered axisymmetric HAR microstructures; the reverse-side UV exposure process is designed to sharpen the end tip of the microstructures by suppressing the UV reflection on a bottom substrate which is inevitable in conventional UV lithography. Hybrid UV lithography involves fabricating 3D HAR microstructures with an epoxy-based negative photoresist, SU-8, using our customized UV exposure system. The effects of hybrid UV lithography parameters on the geometry of the 3D HAR microstructures (aspect ratio, radius of curvature of the end tip, etc.) are measured. The dependence of the end-tip shape on SU-8 soft-baking condition is also discussed.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.11a
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• pp.69-69
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• 2003

최근 trench capacitor, isolation trench, micro-electromechanical system(MEMS), micro-opto-electromechanical system(MOEMS)등의 다양한 기술에 적용될 고종횡비(HAR) 실리콘 식각기술연구가 진행되어 지고 있다. 이는 기존의 습식식각시 발생하는 결정방향에 따른 식각률의 차이에 관한 문제와 standard reactive ion etching(RIE) 에서의 낮은 종횡비와 식각률에 기인한 문제점들을 개선하기 위해 고밀도 플라즈마를 이용한 건식식각 장비를 사용하여 고종횡비(depth/width), 높은 식각률을 가지는 이방성 트랜치 구조를 얻는 것이다. 초기에는 주로 HBr chemistry를 이용한 연구가 진행되었는데 이는 식각률이 낮고 많은양의 식각부산물이 챔버와 시편에 재증착되는 문제가 발생하였다. 또한 SF6 chemistry의 사용을 통해 식각률의 향상은 가져왔지만 화학적 식각에 기인한 local bowing과 같은 이방성 식각의 문제점들로 인해 최근까지 CHF3, C2F6, C4F8, CF4등의 첨가가스를 이용하여 측벽에 Polymer layer의 식각보호막을 형성시켜 이방성 구조를 얻는 multi_step 공정이 일반화 되었다. 이에 본 연구에서는 SF6 chemistry와 소량의 02/HBr의 첨가가스를 이용한 single_step 공정을 통해 공정의 간소화 및 식각 프로파일을 개선하여 최적의 HAR 실리콘 식각공정 조건을 확보하고자 하였다.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.34 no.6C
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• pp.619-625
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• 2009

This paper proposes a parallel architecture of a Parity Checksum Generator adopted for packet synchronization and error detection in the ITU-T Recommendation J.83 Annex B. The proposed parallel processing architecture removes a performance bottleneck occurred in a conventional serial processing architecture, leading to significant decrease in processing time for generating a Parity Checksum. The implementation results show that the proposed parallel processing architecture reduces the processing time by 83.1% at the expense of 16% area increase.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.10a
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• pp.356-359
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• 2007

Continuing improvements in integrated circuit chip density and functionality have mostly contributed toward a very large-scale integrated circuit(VLSI) and display device. In order to test (pass or fail) all of the high integrated semiconductor chip and display device, fine pitch probes are used. Fine pitch probes are manufactured by electroforming process of a Ni alloy in an electrolytic bath. In this paper, we expect that the electric field in bath with the Finite Element Method and applying the FEM result. So, we can obtained the probes that have high aspect ratio of 10 : 1

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.497-502
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• 2004

This paper presents applications of the objective stress rates to stress update algorithms for transient shell dynamic analysis within the context of explicit time integration. The hypo elasto-plastic materials are assumed in establishing constitutive equations. The derivation of the objective stress rates are investigated by use of the Lie derivative. Comparison results are given between the Kirchhoff and Cauchy stress formulation. The Jacobian determination algorithm proposed in this paper is presented in association with the Belytschko-Lin-Tsay shell theory. Several numerical examples are demonstrated including contact and non-contact examples, by which proposed algorithms are compared with respect to the accuracy and effectiveness.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.30 no.10 s.253
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• pp.1314-1319
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• 2006

This paper describes the novel fabrication method of the high-aspect-ratio nano structure which is impossible by conventional method using a shadow mask and a Deep X-ray Lithography (DXRL). The shadow mask with $1{\mu}m-sized$ apertures is fabricated on the silicon membrane using a conventional UV-lithography. The size of aperture is reduced to 200nm by accumulated low stress silicon nitride using a LPCVD (low pressure chemical vapor deposition) process. The X-ray mask is fabricated by depositing absorber layer (Au, $3{\mu}m$) on the back side of nano shadow mask. The thickness of an absorber layer must deposit dozens micrometers to obtain contrast more than 100 for a conventional DXRL process. The thickness of $3{\mu}m-absorber$ layer can get sufficient contrast using a central beam stop method, blocking high energy X-rays. The nano circle and nano line, 200nm in diameter in width, respectively, were demonstrated 700nm in height with a negative photoresist of SU-8.

• The Journal of the Korea Contents Association
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• v.12 no.2
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• pp.182-195
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• 2012

Pictorial Images are often used when persuading someone, since people believe that photographs tell us what happened in reality. This paper aims to strengthen the role of pictorial images as a powerful method of persuasion through interpolating sensibility, which is a key factor in decision making, into the pictorial images. This paper analyses the structure of sensibility in pictorial images, in order to draw out specific factors that arouse positive impression. Furthermore, intensional meanings were given to various factors that compose the sensibility of pictorial images, and the factors are prioritized to enhance applicability. Recognitions of the sensibility in pictorial images differ due to diverse variables, but the photographed subjects themselves and the specific attributes of picture quality are the primary factors that influence the recognition. In order to achieve general and detailed results, broadly selected shooting subjects and images that have various picture quality attributes.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.29 no.10 s.241
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• pp.1407-1415
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• 2005

Strength change of an over-aged A12024 material was studied after being subjected to stages of severe plastic deformation by ECAP (Equal Channel Angular Pressing). Various kinds of strength value were measured using the conventional tensile test, Rockwell and Vickers hardness and the SP (small punch) test Due to limitation of the specimen size, tension test in transverse direction could not be conducted. Hence, SP test was employed for assessing the strength in transverse direction. Based on TEM observation the measured strength characteristics were explained based on the relation between microstructure, dislocation and strength. As the number of ECAP pass increases, the strength of A12024 was also increased. However, considerable change of strength, which is generally predicted, was not observed in this study. For the strength in transverse direction even decrease of the strength was observed after 6 passes of ECAP. It was argued that this decrease was due to dynamic recovery of dislocation density during or after ECAP processes at $150^{\circ}C$. The strength assessment equation proposed by the authors in the previous paper was shown to be very accurate. This argument was supported by comparing the results of conventional tensile test with those of SP test. It was also pointed that the Rockwell har(3ness value seemed to be able to represent the strength in the transverse direction.