• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 1999.02a
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• pp.3-9
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• 1999

The grain morphology, the changes in morphology and Jc with the thermo-mechanical treatment (TMT) history, the field dependence of Jc and the nature of intergranular bonding were studied in $T_{10.8}$$Pb_{.2}$$Bi_{0.2}$$Sr_{1.8}$$Ba_{0.2}$$Ca_{2.2}$$Cu_{3}$$O_{z}$/Ag tapes. As a result, incorporation of intermediate rolling during the final heat-treatment resulted in of plate-like TI-1223 grains, and thus enhanced Jc. Jc's near 2.5$\times$104 A/cm2 at 77 K and 0 T were obtained in just rolled tapes with an excellent reproducibility. The high Jc's seem to grain-connectivity easy recovery of excellent grain-connectivity during final heat-treatment after inter -mediate rolling, probably due to retarded T1 evaporation and excessive Ca content in the present composition. The strong field dependence of Jc even in low fields, however, indicated that there still existed significant weak-links and the degree of directional grain-alignment was far from the desired one. The intergranular binding in the tapes seemed to be mainly dominated by SIS junctions.

• Advances in materials Research
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• v.1 no.1
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• pp.51-74
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• 2012

A powder metallurgy-based rapid consolidation technique, Plasma Pressure Compaction ($P^2C^{(R)}$), was utilized to produce near-net shape parts of gamma titanium aluminides (${\gamma}$-TiAl). Micron-sized ${\gamma}$-TiAl powders, composed of Ti-50%Al and Ti-48%Al-2%Cr-2%Nb (at%), were rapidly consolidated to form near-net shape ${\gamma}$-TiAl parts in the form of 1.0" (25.4 mm) diameter discs, as well as $3"{\times}2.25"$ ($76.2mm{\times}57.2mm$) tiles, having a thickness of 0.25" (6.35 mm). The ${\gamma}$-TiAl parts were consolidated to near theoretical density. The microstructural morphology of the consolidated parts was found to vary with consolidation conditions. Mechanical properties exhibited a strong dependence on microstructural morphology and grain size. Because of the rapid consolidation process used here, grain growth during consolidation was minimal, which in turn led to enhanced mechanical properties. Consolidated ${\gamma}$-TiAl samples corresponding to Ti-48%Al-2%Cr-2%Nb composition with a duplex microstructure (with an average grain size of $5{\mu}m$) exhibited superior mechanical properties. Flexural strength, ductility, elastic modulus and fracture toughness for these samples were as high as 1238 MPa, 2.3%, 154.58 GPa and 17.95 MPa $m^{1/2}$, respectively. The high temperature mechanical properties of the consolidated ${\gamma}$-TiAl samples were characterized in air and vacuum and were found to retain flexural strength and elastic modulus for temperatures up to $700^{\circ}C$. At high temperatures, the flexural strength of ${\gamma}$-TiAl samples with Ti-50%Al composition deteriorated in air by 10% as compared to that in vacuum. ${\gamma}$-TiAl samples with Ti-48%Al-2%Nb-2%Cr composition exhibited better if not equal flexural strength in air than in vacuum at high temperatures.

• Journal of the Korean institute of surface engineering
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• v.27 no.5
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• pp.292-302
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• 1994

Alloy deposits of 80Sn-20Pb, electroplated on Cu-based leadframe alloy from an organic sulfonate bath were aged at $150^{\circ}C$ to form intermetallic phases between substrate and deposit, and effects of the deposit morphology, influenced by deposition conditions, on the fracture resistance of the 80Sn-20Pb deposit aged at $150^{\circ}C$ were examined. The growth rate of intermetallic compound layer on aging depended on the microstructure of deposit ; it was fastest in deposit formed using pulse current in bath without grain refining additive, but slowest in deposit formed using dc current in bath containing grain refining additive in spite of similar structure with equivalent grain size. The grain refining additive incorporated in electrodeposit appears to inhibit diffusion of atoms on aging, resulting in slow growth of intermetallic layer in the thickness direction but substantial growth in the lateral one. Density of surface cracks that were occurring when samples were subjected to the $90^{\circ}$-bending test increased with increasing the thickness of intermatallic layer on aging. For the same aged samples, the surface crack density of the sample electrodeposited from a bath containing the grain refining additive was the least due to the inhibiting effect of the additive incorporated into the deposit during electrolysis on atomic diffusion.

• Bulletin of the Korean Chemical Society
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• v.32 no.3
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• pp.943-946
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• 2011

The electronic absorption and surface morphology evolution of two types of molecular double layer thin films, copper phthalocyanine (CuPc) layer deposited on chloro[subphthalocyaninato]boron(III) (SubPc) layer, denoted as SubPc/CuPc, and vice versa, with various thicknesses were investigated using ultraviolet (UV)-visible spectroscopy and atomic force microscopy (AFM). Both types of double layer structures showed similar broadened absorption patterns in the UV-visible region that were consistent with the fitted spectra following simple linear combination of the single layer absorption spectra of the two materials. In contrast, the surface morphology of double layer structures was dependent on the order of deposition. For the CuPc/SubPc structures, surface morphology was characterized by elongated grains, which are characteristic of SubPc thin films, indicating that the morphological influence of the underlying CuPc layer on the subsequent SubPc layer was not large. For the SubPc/CuPc structures, however, the underlying SubPc layer acted as a morphological template for the subsequently deposited CuPc layer. It was also observed that the grain size of the CuPc layer varied according to the thickness of the underlying SubPc layer.

• Proceedings of the KIEE Conference
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• 1995.07c
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• pp.1181-1183
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• 1995

In this study, we observed the surface morphology of amorphous silicon annealed at $700{\sim}1000^{\circ}C$ for recrystallization. In case of $700{\sim}800^{\circ}C$ annealing, deposited amorphous silicon have the saturated XRD intensity and decreased surface roughness after annealing for 3 hours. It is thought that surface roughness of amorphous silicon increases because of contributions caused by atomic rearrangement of surface, for instance, surface stress etc., in the course of recrystallinzation and decrease because of the relaxation of stress by annealing in reaching completion of recrystallization. In case of $1000^{\circ}C$ annealing, the effect of grain size on deposited silicon is more effective than that of surface roughness. These results show that small grain silicon has the stronger dependence on surface roughness than large grain one.

• Journal of the Korean Society for Heat Treatment
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• v.22 no.2
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• pp.75-79
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• 2009

Precipitate formations and grain size variations in various Mg-Sn-Zn alloys have been investigated and their effects on the tensile properties and sheet metal formability were evaluated. MgSn and MgZn precipitates were observed in the alloy sheets, however any clear difference in morphology or size for the precipitates could not be found even though MgSn precipitates tend to be larger than MgZn. The highest formability in terms of conical cup value was found in the Mg-4 wt%Sn-2 wt%Zn where the high tensile elongation and the reduced grain coarsening at elevated temperatures were observed.

• Proceedings of the KIEE Conference
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• 1991.07a
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• pp.171-173
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• 1991

the poly silicon film was deposited by APCVD. and then the deposition mechanism and electrical characteristics was investigated for that film. The grain phase, the deposition rate, and the etch characteristics were evaluated according to the deposition conditions. The criteria temperature of surface morphology state was $730^{\circ}C {\sim}780^{\circ}C$ between the mirror phase grain and the powder phase grain.

• Journal of Powder Materials
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• v.10 no.5
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• pp.310-317
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• 2003

Two-component ceramic (alumina-zirconia) composites were fabricated by a soft-solution process in which polyethylene glycol (PEG) was used as a polymeric carrier. Metal salts and PEG were dissolved in ethyl alcohol without any precipitation in 1:1 volume ratio of alumina and zirconia. In the non-aqueous system, the flammable solvent made explosive, exothermic reaction during drying process. The reaction resulted in formation of volume expanded, porous precursor powders by a vigorous decomposition of organic components in the precursor sol. The PEG content affected the grain size of sintered composites as well as the morphology of precursor powders. The difference of microstructure in sintered composite was attribute to the solubility and homogeneity of metal cations in precursor sol. At the optimum amount of the PEG polymer, the metal ions were dispersed effectively in solution and a homogeneous polymeric network was formed. It made less agglomerated particles in the precursor sol and affected on uniform grain size in sintered composite.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.2 no.1
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• pp.70-75
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• 1992

A model for a microstructural residual stress in a ferroelectric material is proposed. Based on this model, two facts are estimated. One of them is that the residual stress on a grain boundary is larger than that on a domain boundary. Another one is that the microstructural residual stress decrease with increasing grain size. These facts are confirmed by the microcrack morphology and the dependence of dielectric constant hysteresis between heating and cooling on grain size in $PbZr_{0.4}Ti_{0.6}O_3$ ceramics.

• Journal of Korea Foundry Society
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• v.34 no.4
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• pp.136-142
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• 2014

Numerical solution of thermal stress by CAE analysis could be an effective method in product development stage of castings to predict and treat the problem of solidification cracking of castings. Quantitative stress-strain data are necessary, in this case. Tension type apparatus of a solidification crack test which can measure stress-strain relationship quantitatively was developed and the test procedure was established by this research. Solidification crack strength obtained from the following test procedure could be utilized to evaluate it in terms of effect factors on thermo-plastic characteristic of solidifying alloy such as grain size of solid, grain morphology, distribution of solid grain, etc. Proposed test procedure is as follow: Prediction of temperature at the failure site of solidification cracked specimen by computer simulation of solidification, Calculation of solid fraction of the failure site from thermodynamic solution of solidification under Scheil condition.