• Title/Summary/Keyword: Glass Cap

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Micro System Packaging using New Micro-Heater (새로운 미세 가열기를 이용한 마이크로 시스템의 패키징)

  • Shim, Young-Dae;Shin, Kyu-Ho;Choa, Sung-Hun;Kim, Yong-Hun
    • Proceedings of the KIEE Conference
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    • 2002.11a
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    • pp.57-59
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    • 2002
  • 기존에 연구된 미세 가열기를 이용한 마이크로 시스템 패키징의 문제점을 해결하기 위해 새로운 미세 가열기를 제작하여 접합 실험을 실시하였다. 기존 형상의 미세 가열기와 새로운 미세 가열기의 형상을 각각 제작하여 접합시 미세 가열기에 발생하는 열분포를 IR 카메라를 이용하여 실험하였으며, 기존 형상의 미세 가열기가 불균일하게 가열되는 반면, 새로운 형상의 미세 가열기는 매우 균일하게 가열되는 형상을 나타내었다. 카메라 실험 결과를 바탕으로 접합 실험을 실시하기 위해서 폭 $50{\mu}m$, 두께 $2{\mu}m$의 미세 가열기를 제작하였으며, 0.2 Mpa의 압력을 Pyrex glass cap에 가한 상태에서 150 mA의 전류를 공급함으로서 접합을 완료하였다. 접합이 완료된 시편들에 대해서 IPA를 통한 leak 실험을 실시하였으며, 기존 형상의 미세 가열기를 이용한 시편들은 66%가 테스트를 통과한 반면 새로운 형상의 미세 가열기를 이용한 시편들은 85%이상이 테스트를 통과하였다. Leak 실험을 통과한 각각의 시편들에 대해서 접합력 측정을 실시한 결과, 기존 형상의 미세 가열기를 이용한 시편들은 $15{\sim}21$ Mpa의 접합력을 나타내었고, 새로울 형상의 미세 가열기를 이용한 시편들은 $25{\mu}30$ Mpa의 우수한 접합력을 나타내었다.

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Contact Resistance and Thermal Cycling Reliability of the Flip-Chip Joints Processed with Cu-Sn Mushroom Bumps (Cu-Sn 머쉬룸 범프를 이용한 플립칩 접속부의 접속저항과 열 싸이클링 신뢰성)

  • Lim, Su-Kyum;Choi, Jin-Won;Kim, Young-Ho;Oh, Tae-Sung
    • Korean Journal of Metals and Materials
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    • v.46 no.9
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    • pp.585-592
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    • 2008
  • Flip-chip bonding using Cu-Sn mushroom bumps composed of Cu pillar and Sn cap was accomplished, and the contact resistance and the thermal cycling reliability of the Cu-Sn mushroom bump joints were compared with those of the Sn planar bump joints. With flip-chip process at a same bonding stress, both the Cu-Sn mushroom bump joints and the Sn planar bump joints exhibited an almost identical average contact resistance. With increasing a bonding stress from 32 MPa to 44MPa, the average contact resistances of the Cu-Sn mushroom bump joints and the Sn planar bump joints became reduced from $30m{\Omega}/bump$ to $25m{\Omega}/bump$ due to heavier plastic deformation of the bumps. The Cu-Sn mushroom bump joints exhibited a superior thermal cycling reliability to that of the Sn planar bump joints at a bonding stress of 32 MPa. While the contact resistance characteristics of the Cu-Sn mushroom bump joints were not deteriorated even after 1000 thermal cycles ranging between $-40^{\circ}C$ and $80^{\circ}C$, the contact resistance of the Sn planar bump joints substantially increased with thermal cycling.

Growth of vertically aligned carbon nanotubes on Co-Ni alloy metal (Co-Ni 합금위에서 수직방향으로 정렬된 탄소나노튜브의 성장)

  • Lee, Cheol-Jin;Kim, Dae-Woon;Lee, Tae-Jae;Park, Jeong-Hoon;Son, Kwon-Hee;Lyu, Seung-Chul;Song, Hong-Ki;Choi, Young-Chul;Lee, Young-Hee
    • Proceedings of the KIEE Conference
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    • 1999.07d
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    • pp.1504-1507
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    • 1999
  • We have grown vertically aligned carbon nanotubes in a large area of Co-Ni codeposited Si substrates by the thermal CVD using $C_2H_2$ gas. Since the discovery of carbon nanotubes, Synthesis of carbon nanotubes for mass production has been achieved by several methods such as laser vaporization arc discharge, and pyrolysis. In particular, growth of vertically aligned nanotubes is of technological importance for applications to FED. Recently, vertically aligned carbon nanotubes have been grown on glass by PECVD Aligned carbon nanotubes can be also grown on mesoporous silica and Fe patterned porous silicon using CVD. Despite such breakthroughs in the growth, the growth mechanism of the alignment are still far from being clearly understood. Furthermore, FED has not been clearly demonstrated yet at a practical level. Here, we demonstrate that carbon nanotubes can be vertically aligned on catalyzed Si substrate when the domain density reaches a certain value. We suggest that steric hindrance between nanotubes at an initial stage of the growth forces nanotubes to align vertically and then nanotubes are further grown by the cap growth mechanism.

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Encapsulation of OLEDs Using Multi-Layers Consisting of Digital CVD $Si_3N_4$ and C:N Films

  • Seo, Jeong-Han;O, Jae-Eung;Seo, Sang-Jun
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.02a
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    • pp.538-539
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    • 2013
  • 여러 장점으로 인해 OLED는 디스플레이 및 조명 등 적용분야가 넓어지고 있지만, 수분 및 산소에 취약하여 그 수명이 제한되는 단점이 있다. 이를 해결하고자 현재까지는 glass cap을 이용한 encapsulation 기술이 적용되고 있지만, flexible 기판에 적용하지 못하는 문제가 있다. 이러한 문제를 해결하고자 여러 가지 thin film encapsulation 기술이 적용되고 있으나 보다 신뢰성이 높은 기술의 개발이 절실한 때이다. Encapsulation 무기 박막 물질로서 $Si_3N_4$ 박막은 PE-CVD (Plasma Enhanced Chemical Vapor Deposition) 등의 박막 증착법을 사용한 많은 연구가 진행되어, 저온에서의 좋은 품질의 박막 증착이 가능하지만, 100도 이하의 thermal budget을 갖는 OLED Encapsulation에 사용하기에는 충분하지 않았다. CVD 박막의 특성을 더욱 개선하기 위해 최근 ALD (Atomic Layer Deposition) 방법을 통한 $Al_2O_3$ film 증착 방법이 연구되고 있지만, 낮은 증착 속도로 인해 양산에 걸림돌이 되고 있다. 본 연구에서는 또 다른 해결책으로서 Digital CVD 방법을 이용한 양질의 $Si_3N_4$ 박막의 증착을 연구하였다. 이것은 ALD 증착법과 유사하며, 1st step에서 PECVD 방법으로 4~5 ${\AA}$의 얇은 silicon 박막을 증착하고, 2nd step에서 nitrogen plasma를 이용하여 질화 반응을 진행하고, 이러한 cycle을 원하는 두께가 될 때까지 반복적으로 진행된다. 이 때 1 cycle 당 증착속도는 7 ${\AA}$/cycle 정도였다. 최적의 증착 방법과 조건으로 기존의 CVD $Si_3N_4$ 박막 대비 1/5 이하로 pinhole을 최소화 할 수는 있지만 완벽하게 제거하기는 힘든 문제가 있고, 이를 해결하기 위한 개선을 위한 접근 방법이 필요하다고 판단하였다. 본 연구에서는 무기물 박막인 carbon nitride를 이용한 SiN/C:N multilayer 증착 연구를 진행하였다. Fig. 1은 CVD 조건으로 증착된 두께 750 nm SiN film에서 여러 층의 C:N film layer를 삽입했을 때, 38 시간의 85%/$85^{\circ}C$ 가속실험에 따라 OLED의 발광 사진이다. 그림에서 볼 수 있듯이 C:N 층을 삽입하고 또한 그 박막의 수가 증가함에 따라서 OLED에 대한 encapsulation 특성이 크게 개선됨을 확인할 수 있다.

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A Surgical Treatment of the Esophageal Foreign Body (10 cases report) (수술적 처치가 필요했던 식도이물에 관한 임상적 고찰)

  • 황의두;황경환
    • Journal of Chest Surgery
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    • v.30 no.11
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    • pp.1117-1120
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    • 1997
  • Ten cases with esophageal foreign body were treated surgically from July 1980 to October 1995 at the Departme t of Thoracic and Cardiovascular Surgery, Chungnam National University Hospital. The mean age was 45.3 years, with a range from 25 to 71. Out of ten cases, 6 were female and four were male. Common symptoms were dysphagia, fever, foreign body sensation and neck pain. Three cases of foreign bodies were of fish bones, two of bubble paclcage of drugs, one case of a Eeer bottle cap, one of a piece glass, one of a bathtub plug, one of chicken and one of a bean. The diagnosis was established by esophagography using a water soluble contrast material and esophagoscopy. Among of ten cases, two had esophageal stricture due to the ingestion of Aye at a young age. One case had experienced psychological problems. All foreign bodies were removed by surgical procedures. Five cases were treated by cervical esophagostomy, one case by right thoracotomy, one case by retrograde bougienation through gastrostomy and two cases by cervical incision and drainage for cervical abscess. Three cases developed pos operative esophageal leaks which healed spontaneously and transient hoarseness developed in one case. One case developed traumatic pneumothorax and subcutaneous emphysema which was treated by closed thoracostomy. There were no operative deaths. C(ocean J Thorac Cardiovasc Surg 1997;30:1117-20)

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Degradation Mechanisms of Organic Light-emitting Devices with a Glass Cap (유리 덮개로 보호된 OLED소자의 발광특성 저하 연구)

  • Yang Yong Suk;Chu Hye Yong;Lee Jeong-Ik;Park Sang-He;Hwang Chi Sun;Chung Sung Mook;Do Lee-Mi;Kim Gi Heon
    • Journal of the Korean Vacuum Society
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    • v.15 no.1
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    • pp.64-72
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    • 2006
  • We demonstrated organic light-emitting devices (OLEDs) based on the organic thin-film materials such as tris-(8-hydroxyquinoline) aluminum $(Alq_3)$. The structure of OLEDs was vacuum deposited upon transparent and thin glass substrates pre-coated with a transparent, conducting indium tin oxide thin film. The luminance characteristics, current, capacitance, and dispersion factor for degraded OLEDs, which were made by various bias currents $(0.5mA\;{\leq}\;I_{Bias}\;{\leq}9mA)$, are studied. The current dependences of lifetime were divided at approximately 2mA, and they represented nearly linear behaviors but had different slopes in a logarithmic plot of lifetime versus bias current. With lighting OLEDs, the anomaly of capacitance, as shown in the CV curve, occurred because of two factors, polarization in the bulk of organic materials and the interface between the metal and organic layers. In decayed OLEDs that had lower bias currents of less than 2mA, it was found that the degradation of luminance was related to both the decrease of polarization and to the lowering of the injection barrier.

Wafer Level Hermetic Sealing Characteristics of RF-MEMS Devices using Non-Conductive Epoxy (비전도성 에폭시를 사용한 RF-MEMS 소자의 웨이퍼 레벨 밀봉 실장 특성)

  • 박윤권;이덕중;박흥우;송인상;김정우;송기무;이윤희;김철주;주병권
    • Journal of the Microelectronics and Packaging Society
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    • v.8 no.4
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    • pp.11-15
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    • 2001
  • In this paper, hermetic sealing technology was studied for wafer level packaging of the RF-MEMS devices. With the flip-chip bonding method. this non-conductive B-stage epoxy sealing will be profit to the MEMS device sealing. It will be particularly profit to the RF-MEMS device sealing. B-stage epoxy can be cured by 2-step and hermetic sealing can be obtained. After defining 500 $\mu\textrm{m}$-width seal-lines on the glass cap substrate by screen printing, it was pre-baked at $90^{\circ}C$ for about 30 minutes. It was, then, aligned and bonded with device substrate followed by post-baked at $175^{\circ}C$ for about 30 minutes. By using this 2-step baking characteristic, the width and the height of the seal-line could be maintained during the sealing process. The height of the seal-line was controlled within $\pm$0.6 $\mu\textrm{m}$ in the 4 inches wafer and the bonding strength was measured to about 20MPa by pull test. The leak rate, that is sealing characteristic of the B-stage epoxy, was about $10^{-7}$ cc/sec from the leak test.

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Low Temperature Hermetic Packaging by Localized Heating using Forced Potential Scheme Micro Heater (Forced Potential Scheme 미세 가열기를 이용한 부분 가열 저온 Hermetic 패키징)

  • 심영대;신규호;좌성훈;김용준
    • Journal of the Microelectronics and Packaging Society
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    • v.10 no.2
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    • pp.1-5
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    • 2003
  • In this project, the efficiency of localized heating for micro systems packaging is developed by using a forced potential scheme microheater. Less than 0.2 Mpa contact pressure was used for bonding with a 200 mA current input for $50{\mu}m$ width, $2{\mu}m$ height and $8mm{\times}8mm$, $5mm{\times}5mm$, $3mm{\times}3mm$ sized phosphorus-doped poly-silicon microheater. The temperature can be raised at the bonding region to $800^{\circ}C$, and it was enough to achieve a strong and reliable bonding in 3 minutes. The IR camera test results show improved uniformity in heat distribution compared with conventional microheaters. For performing the gross leak check, IPA (Isopropanol Alcohol) was used. Since IPA has better wetability than water, it can easily penetrate small openings, and is more suitable for conducting a gross leak check. The pass ratio of bonded dies was 67%, for conventional localized heating, and 85% for our newly developed FP scheme. The bonding strength was more than 25Mpa for FP scheme packaging, which shows that FP scheme can be a good candidate for micro-scale hermetic packaging.

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The study on the measurement of formaldehyde in saliva and urine by GC-MS (가스크로마토그래프-질량분석기에 의한 타액 및 뇨 중 포름알데하이드 분석법 연구)

  • Shin, Ho-Sang;Ahn, Hye-Sil
    • Analytical Science and Technology
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    • v.19 no.2
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    • pp.149-154
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    • 2006
  • A gas chromatography-mass spectrometric method was developed for the determination of formaldehyde in urine and saliva. In a 20 mL glass tube, 0.2 mL of urine or saliva was taken. Further, 1.8 mL of 0.1 M HCl, 0.1 mL of 2,000 mg/L 2,4-dinitrophenyl hydrazine and $20{\mu}l$ of 500 mg/L acetone-$d_6$ as internal standard were added in the tube and sealed tightly with cap. The solution was shaken for 20 min at room temperature and extracted using 4 mL of toluene. The extract was concentrated and redissolved with $100{\mu}l$ of acetonitrile, and then measured by gas chromatography-mass spectrometer (selected ion monitoring). The detection limit was 2.0 ng/mL and 0.5 ng/mL in saliva and urine, respectively. The calibration curves showed good linearity with r = 0.997 and 0.998 for saliva and urine, respectively. The method was used to analyze formaldehyde in rat urine after oral exposure. The developed method may be use ful to the monitoring for formaldehyde exposure in human.

Studies on the Processing of Low Salt Fermented Sea Foods 4. Processing of Low Salt Fermented Anchovy (저염수산발효식품의 가공에 관한 연구 4. 저염 멸치젓의 가공)

  • CHA Yong-Jun;PARK Hyang-Suk;CHO Soon-Yeong;LEE Eung-Ho
    • Korean Journal of Fisheries and Aquatic Sciences
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    • v.16 no.4
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    • pp.363-367
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    • 1983
  • Low salt fermented products of anchovy, Engraulis japonica, caught in the coasts of East Sea of Korea, were prepared tentatively and also discussed the retarding effect of rancidity of the product by the addition of BHA or red pepper. Fresh anchovies were purchased from Kichang fish market. The raw samples were mixed with $8\%$ table salt, $0.5\%$ lactic acid, $6\%$ sorbitol, $4\%$ ethyl alcohol and $0.02\%$ BHA or $0.5\%$ red pepper and filled in the glass bottles and sealed with the cap. Conventional fermented product of anchovy as a control was prepared from fresh anchovy and $20\%$ salt only. After preparation, the products were fermented for 90 days at room temperature. Amino-nitrogen, TBA value, peroxide value and viable counts of bacteria of these products were determined and also evaluation of their qualify was compared with control product by sensory evaluation during fermentation. Amino-nitrogen contents of the low salt products reached a peak in 55 days of fermentation, and the volatile basic nitrogen contents ranged $100\;mg\%$ even after 90 days of fermentation. Thiobarbituric acid value of the product with $0.02\%$ BHA showed a little increase up to 65 days of fermentation regardless of salt contents, while that of the control product increased sharply up to 65 days and then decreased gradually. BHA was effective on retarding rancidity of fermented products of anchovy and red pepper was also slightly effective. All the products showed the highest cell population in about 55 days of fermentation. Judging from the results of analysis and sensory evaluation, the low salt fermented product of anchovy could be prepared with $8\%$ salt, $0.5\%$ lactic acid, $6\%$ sorbitol, $4\%$ ethyl alcohol and $0.02\%$ BHA or $0.5\%$ red pepper to the fresh round anchovy.

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