• Applied Microscopy
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• v.45 no.4
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• pp.199-202
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• 2015

A simple and novel transmission electron microscopy (TEM) sample preparation method for phase change nanowire is investigated. A $Ge_2Sb_2Te_5$ (GST) nanowire TEM sample was meticulously prepared using nanomanipulator and gas injection system in a field emission scanning electron microscopy for efficient and accurate TEM analysis. The process can minimize the damage during the TEM sample preparation of the nanowires, thus enabling the crystallographic analysis of as-grown GST nanowires without unexpected phase transition caused by e-beam heating.

• Journal of Advanced Marine Engineering and Technology
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• v.33 no.1
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• pp.131-137
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• 2009

In this paper, we have manufactured hole type PRAM unit cell using phase change material $Ge_2Sb_2Te_5$. The phase change material $Ge_2Sb_2Te_5$ was deposited on hole of 500 nm size using sputtering method. Reset current of PRAM unit cell was confirmed by measuring R-V characteristic curve. Reset current of manufactured hole type PRAM unit cell is 15 mA, 100 ns. And electro and thermal characteristics of hole type PRAM unit cell were analyzed by 3-D finite element analysis. From simulation temperature of PRAM unit cell was $705^{\circ}C$.

• Proceedings of the KIEE Conference
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• 2003.10a
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• pp.120-122
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• 2003

We have been investigated phase-change with temperature and electric field in chalcogenide $Ge_2Sb_2Te_5$ thin film. $T_c$(crystallization temperature) is confirmed by measuring the resistance and conductivity with the varying temperature on the hotplate. We have measured I-V characteristics with $Ge_2Sb_2Te_5$ chalcogenide thin film. It is compared with I-V characteristics after impress the variable pulse. The pulse has variable height and duration that used voltage and current source.

• Journal of the Korean Institute of Telematics and Electronics
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• v.14 no.2
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• pp.10-16
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• 1977

Memory switching of the amorphous chalcogenide Ge-Te-Si memory devices were observed at various thicknesses and temperatures. For a given thickness, the distribution of threshold voltages shows a strong peaks, which is attributed to the intrinsic switching mechanism. The plot of Vth versus thickness indicates that threshold voltages were lowered and switching fields were raised as thickness was decreased. And threshold voltage sagged as temperature was raised and the fact that threshold voltage can be lowered at the temperature range under Tg was obtained.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.205-206
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• 2005

PRAM (Phase change Random Access Memory) is one of the most promising candidates for next generation Non-volatile Memories. The Phase change material has been researched in the field of optical data storage media. Among the phase change materials, $Ge_2Sb_2Te_5$(GST) is very well known for its high optical contrast in the state of amorphous and crystalline. However, the characteristics required in solid state memory are quite different from optical ones. In this study, the structural properties of GST thin films with bottom electrode were investigated for PRAM. The 100-nm thick GST films were deposited on TiN/Si and TiAlN/Si substrates by RF sputtering system. In order to characterize the crystal structure and morphology of these films, we performed x-ray diffraction (XRD) and atomic force microscopy (AFM).

• Journal of the Korean Ceramic Society
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• v.33 no.8
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• pp.855-862
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• 1996

The nucleation and the crystal growth rates of Ge-Se-Te chalcogenide glass by two step heat-treatment and its effect on the mechanical optical properties and water-resistance were determined. The maximum nuclea-tion and crystal growth rate were 2.1$\times$103/mm3 .min at 28$0^{\circ}C$ and 0.4${\mu}{\textrm}{m}$/min at 33$0^{\circ}C$ respectively. When the crystal volume fraction with crystal size $1.5mutextrm{m}$ was about 4% the (hardness and fracture toughness were about 117kg/mm2 and 6.0 MPa.mm1/2)respectively. The weight loss of crystallized glass in water was lower than parent glass($25^{\circ}C$ for 32 hrs : 0.03% 8$0^{\circ}C$ for 16 hrs : 0.1%) as 0.01% at $25^{\circ}C$, 0.03% at 8$0^{\circ}C$ for 16 hrs : 0.1%) at $25^{\circ}C$ 0.03% at 8$0^{\circ}C$ respectively. The IR-transmittance decreased with increasing crystal size and crystal volume fraction. The IR-transmittance of crystallized glass with the crystal size of $1.5mutextrm{m}$ (crystal volume fraction : 4%) presented 56% which was about 4% lower than that of parent glass.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.127-127
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• 2018

열전변환기술은 폐열을 전기로 변환하는 제벡효과를 이용한 기술이다. 열전변환효율은 재료의 성능에 따라 결정되며 성능지수 $ZT=S^2{\sigma}T/k$로 표현할 수 있다. 여기서 S는 제벡계수, ${\sigma}$는 전기전도도, k는 열전도도, T는 절대온도이다. GeTe계 열전재료는 $200{\sim}500^{\circ}C$에서 쓰이는 중온용 열전재료이다. 높은 성능지수를 가지기 위해서는 파워펙터($S2{\sigma}$)의 향상과 열전도도의 감소가 필요하다. GeTe계 화합물은 Ge의 공공 때문에 높은 캐리어 농도를 가지게 되고, 이로 인해 낮은 제벡계수 값과 높은 열전도도를 가지게 된다. 따라서 GeTe계 화합물의 성능 향상을 위해서는 캐리어농도 제어가 필수적이다. TEM을 통하여 GeTe를 관찰하면 밝고 어두운 콘트라스트들이 형성되어 있는 헤링본구조를 확인 할 수 있다. 콘트라스트를 보여주는 작은 평행사변형 하나는 헤링본구조의 가장 작은 단위인 도메인이며 이 도메인들이 특정한 방향으로 배열되어 콜로니를 형성하고 콜로니들이 특정한 방향으로 배열되어 헤링본구조를 이룬다. 헤링본의 폭과 길이를 제어 할 수 있다면 GeTe계 화합물의 열전특성 향상에 영향을 미칠 수 있을 것으로 예상된다. 따라서 본 연구에서는 GeTe계 화합물내에 도핑원소 첨가를 통한 캐리어 농도제어와 도핑원소 첨가에 따른 헤링본구조의 변화에 관하여 연구하였다.

• Proceedings of the Korean Vacuum Society Conference
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• 2008.02a
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• pp.283-283
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• 2008

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.11a
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• pp.203-206
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• 2004

For the realization of PRAM, $Ge_2Sb_2Te_5$ (GST) has been employed for the phase transition between the crystal and amorphous states by electrical joule heating. Although there has been a vast amount of results concerning the GST in material aspect for the laser-induced optical storage disc applications, the process-related issues of GST for the PRAM applications have not been reported. In this work, the etching behaviors of GST were investigated when the processing conditions were varied in the high-density helicon plasma. The etching parameters of RF main power, RF bias power, and chamber pressure were fixed at 600 W, 150 W, and 5 mTorr, respectively. For the etching processes, gas mixtures of $Ar/Cl_2$, $Ar/CF_4$, and $Ar/CHF_3$ were employed, in which the etching rates and etching selectivities of GST thin film in given gas mixtures were evaluated. From obtained results, it is found that we can arbitrarily design the etching process according to given cell structures and material combinations for PRAM cell fabrications.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.05a
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• pp.21.1-21.1
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• 2009

상변화 메모리는 비휘발성 메모리이면서 빠른 동작 속도, 낮은 동작 전압 등 다양한 장점을 지니고 있어 차세대 메모리로 주목 받고 있다. 최근 상변화 메모리의 동작 전류를 감소시키기 위해 상변화 물질 및 전극 물질에 대한 연구를 진행하고 있으며, 소자의 크기를 최소화 하기 위한 연구가 진행되고 있다. 본 연구에서는 나노 임프린트 리소그래피와 전도성 AFM을 이용하여 나노급 상변화 물질의 특성을 평가하였다. 나노급 상변화 물질을 형성하기 위해 열경화성 나노 임프린트 리소그래피를 이용하여 $Ge_2Sb_2Te_5$(GST)/Mo/SiO2 기판 위에 200nm급 홀 패턴을 형성하였다. 홀 패턴에 Cr을 증착하여 리프트 오프 한 뒤 Cr을 하드 마스크로 사용하여 GST를 식각하였다. 그 결과, Mo 하부 전극 위에200nm 지름과 100nm 높이를 가지는 GST 나노 기둥을 형성하였다. GST 나노 기둥의 전기적 특성 평가를 위해 저항 측정 장비 및 펄스 발생기와AFM을 사용하였다. AFM은 접촉 모드로 설정하였으며, Pt가 코팅된 AFM tip을 사용하여 Cr 하드 마스크와 함께 상부 전극으로 사용하였다. GST 나노 기둥을 초기화 시키기 위해 I-V sweep을 하였으며, 그 결과 $1M\Omega$에서 $10\;k\Omega$으로 저항이 변화함을 확인하였다. GST 나노 기둥은 2V, 5ns의 리셋 펄스에서 비정질로 변화하였으며, 1.3V, 150ns의 셋 펄스에서 결정질로 변화하였다. 이 동작 전압으로 5번의 스위칭 특성을 평가하였으며, 이 결과는 소자 형태의 200nm 급GST의 특성과 유사하여 나노급 상변화 물질을 테스트하는 새로운 방법으로 사용될 수 있을 것이다.