• Title/Summary/Keyword: Gate characteristics

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Breakdown characteristics of gate oxide with tungsten polycide electrode (텅스텐 폴리사이드 전극에 따른 게이트 산화막의 내압 특성)

  • 정회환;이종현;정관수
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.33A no.12
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    • pp.77-82
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    • 1996
  • The breakdown characteristics of metal-oxide-semiconductor(MOS) capacitors fabricated by Al, polysilicon, and tungsten polycide gate electrodes onto gate oxide was evaluated by time zero dielectric breakdwon (TZDB). The average breakdown field of the gate oxide with tungsten polycide electride was lower than that of the polysilicon electrode. The B model (1~8MV/cm) failure of the gate oxide with tungsten polycide electrode was increased with increasing annealing temperature in the dry $O_{2}$ ambient. This is attributed ot fluorine and tungsten diffusion from thungsten silicide film into the gate oxide, and stress increase of tungsten polcide after annealing treatment.

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MOSFET Characteristics and Hot-Carrier Reliability with Sidewall Spacer and Post Gate Oxidation (Sidewall Spacer와 Post Gate Oxidation에 따른 MOSFET 특성 및 Hot Carrier 신뢰성 연구)

  • 이상희;장성근;이선길;김선순;최준기;김용해;한대희;김형덕
    • Proceedings of the IEEK Conference
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    • 1999.06a
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    • pp.243-246
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    • 1999
  • We studied the MOSFET characteristics and the hot-carrier reliability with the sidewall spacer composition and the post gate oxidation thickness in 0.20${\mu}{\textrm}{m}$ gate length transistor. The MOSFET with NO(Nitride+Oxide) sidewall spacer exhibits the large degradation of hot-carrier lifetime because there is no buffering oxide against nitride stress. When the post gate oxidation is skipped, the hot-carrier lifetime is improved, but GIDL (Gate Induced Drain Leakage) current is also increased.

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Macro-model for Estimation of Maximum Power Dissipation of CMOS Digital Gates (CMOS 디지털 게이트의 최대소모전력 예측 매크로 모델)

  • Kim, Dong-Wook
    • The Transactions of the Korean Institute of Electrical Engineers A
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    • v.48 no.10
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    • pp.1317-1326
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    • 1999
  • As the integration ratio and operation speed increase, it has become an important problem to estimate the dissipated power during the design procedure as a method to reduce the TTM(time to market). This paper proposed a prediction model to estimate the maximum dissipated power of a CMOS logic gate. This model uses a calculational method. It was formed by including the characteristics of MOSFETs of which a CMOS gate consists, the operational characteristics of the gate, and the characteristics of the input signals. As the modeling process, a maximum power estimation model for CMOS inverter was formed first, and then a conversion model to convert a multiple input CMOS gate into a corresponding CMOS inverter was proposed. Finally, the power model for inverter was applied to the converted result so that the model could be applied to a general CMOS gate. For experiment, several CMOS gates were designed in layout level by $0.6{\mu}m$ layout design rule. The result by comparing the calculated results with those from HSPICE simulations for the gates showed that the gate conversion model has within 5% of the relative error rate to the SPICE and the maximum power estimation model has within 10% of the relative error rate. Thus, the proposed models have sufficient accuracies. Also in calculation time, the proposed models was more than 30 times faster than SPICE simulation. Consequently, it can be said that the proposed model could be used efficiently to estimate the maximum dissipated power of a CMOS logic gate during the design procedure.

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The Fabrication and Electrical Characteristics of Pentacene TFT using Polyimide and Polyacryl as a Gate Dielectric Layer (Polymide와 Polyacryl을 게이트 절연층으로 이용한 pentacene TFT의 제작과 전기적 특성에 관한 연구)

  • Kim, Yun-Myoung;Kim, Ok-Byoung;Kim, Young-Kwan;Kim, Jung-Soo
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.50 no.4
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    • pp.161-168
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    • 2001
  • Organic thin film transitors(TFTs) are of interest for use in broad area electronic applications. For example, in active matrix liquid crystal displays(AMLCDs), organic TFTs would allow the use of inexpensive, light-weight, flexible, and mechanically rugged plastic substrates as an alternative to the glass substrates needed for commonly used hydrogenated amorphous silicon(a-Si:H). Recently pentacene TFTs with carrier field effect, mobility as large as 2 $cm^2V^{-1}s^{-1}$ have been reported for TFTs fabricated on silicon substrates, and it is higher than that of a-Si:H. But these TFTs are fabricated on silicon wafer and $SiO_2$ was used as a gate insulator. $SiO_2$ deposition process requires a high insulator which is polyimide and photo acryl. We investigated trasfer and output characteristics of the thin film transistors having active layer of pentacene. We calculated field effect mobility and on/off ratio from transfer characteristics of pentacene thin film transistor, and measured IR absorption spectrum of polymide used as the gate dielectric layer. It was found that using the photo acryl as a gate insulator, threshold voltage decreased from -12.5 V to -7 V, field effect mobility increased from 0.012 $cm^2V^{-1}s^{-1}$ to 0.039 $cm^2V^{-1}s^{-1}$ , and on/off current ratio increased from $10^5\;to\;10^6$. It seems that TFTs using photo acryl gate insulator is apt to form channel than TFTs using polyimide gate insulator.

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W Polymetal Gate Technology for Giga Bit DRAM

  • Jung, Jong-Wan;Han, Sang-Beom;Lee, Kyungho
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.1 no.1
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    • pp.31-39
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    • 2001
  • W polymetal gate technology for giga bit DRAM are presented. Key module processes for polymetal gate are studied in detail. $W/WN_x/poly-silicon$ adopted for a word line of 256Mbit DRAM has good gate oxide integrity and junction leakage characteristics through full integration, which is comparable to those of conventional $WSi_x$/Poly-silicon gate process. These results undoubtedly show that $W/WN_x/poly-silicon$ is the strongest candidate as a word line for Giga bit DRAM.

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Temperature dependent hysteresis characteristics of a-Si:H TFT (비정질 실리콘 박막 트랜지스터 히스테리시스 특성의 온도의존성)

  • 이우선;오금곤;장의구
    • Electrical & Electronic Materials
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    • v.9 no.3
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    • pp.277-283
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    • 1996
  • The temperature dependent characteristics of hydrogenerated amorphous silcon thin film transistor (a-Si:H TFT) with a bottom gate of N-Type <100> Si wafer were investigated. Drain current on the hysteresis characteristic curve showed an exponential variation. Hysteresis area of TFT increased with the gate voltage increased and decreased with the small gate voltage. According to the variation of gate voltages, drain current of TFT increased by temperature increase, and hysteresis characteristics mainly depended on the temperature increase. The hysteresis current showed negative characteristics curve over 383K. The hysteresis occurance area and the differences of forward and reverse sweep were increased at the higher temperature. Hysteresis current of I$_{d}$(on/off) ratio decreased at the lower temperature and increased at the higher temperature.e.

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Model Tests Study on Flow-induced Vibration of fainter Gate in Estuary Sulices (I) - Flow from the Gate Outside to the Gate Inside - (배수갑문 테인터 게이트(Tainter Gate)의 진동현상에 관한 모형실험 ( I ) - 문비 밖에서 안으로의 흐름 -)

  • Lee, Seong-Haeng
    • Journal of The Korean Society of Agricultural Engineers
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    • v.46 no.1
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    • pp.27-34
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    • 2004
  • A model test is carried out to investigate flow-induced vibration of a Tainter gate in estuary sulices. The gate model scaled with the ratio of 1:25 is made of acryl panel dimensioned 0.66m in width, 0.5m in height in the concrete test flume. Firstly, natural frequencies of the model gate are measured and the results are compared with the numerical results in order to verify the model. The amplitudes of the vibration are measured under the different gate opening and water level conditions in flow from the gate outside to the gate inside. Also 5 revised gate models with bottom width increased 0.5 cm each are tested under the different gate opening and water level. The results are analyzed to study the characteristics of the gate vibration. These test results are assessed in comparison with formerly test results, as a result, presents a design method of Tainter gate to reduce the gate vibration and a basic data for the guide manuals of gate management.

Gate Driving Methods to Compensate Feed-Through Voltage for Large Size, High Quality TFT-LCD (대면적 고화질 TFT-LCD의 Feed-through 전압 보상을 위한 Gate Driving 방법)

  • 정순신;윤영준;박재우;최종선
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1999.11a
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    • pp.99-102
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    • 1999
  • In recent years, attempts have been made to greatly improve the display quality of active-matrix liquid crystal display devices, and many techniques have been proposed to solve such problems as gate signal delay, feed-through voltage and image sticking. To improve these problems which are caused by the fried-through voltage, we have evaluated new driving methods to reduce the fled-through voltage. Two level gate-pulse was used for the gate driving of the cst-on-common structure pixels. And two-gate line driving methods with the optimized gate signals were applied for the cst-on-gate structure pixels. These gate driving methods were better feed-through characteristics than conventional simple gate pulse. The evaluation of the suggested driving methods were performed by using a TFT-LCD array simulator PDAST which can simulate the gate, data and pixel voltages of a certain pixel at any time and at any location on a TFT array. The effect of the new driving method was effectively analyzed.

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Simulation of do Performance and Gate Breakdown Characteristics of MgO/GaN MOSFETs (MgO/GaN MOSFETs의 dc 특성 및 Gate Breakdown 특성 Simulation)

  • Cho, Hyeon;Kim, Jin-Gon;Gila, B.P.;Lee, K.P.;Abernathy, C.R.;Pearton, S.J.;Ren, F.
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2003.11a
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    • pp.176-176
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    • 2003
  • The effects of oxide thickness and gate length of MgO/GaN metal oxide semiconductor field effect transistors (MOSFETs) on I-V, threshold voltage and breakdown voltage characteristics were examined using a drift-diffusion model. The saturation drain current scales in an inverse logarithmic fashion with MgO thickness and is < 10$^{-3}$ A.${\mu}{\textrm}{m}$$^{-1}$ for 0.5 ${\mu}{\textrm}{m}$ gate length devices with oxide thickness > 600 $\AA$ or for all 1 ${\mu}{\textrm}{m}$ gate length MOSFETs with oxide thickness in the range of >200 $\AA$. Gate breakdown voltage is > 100 V for gate length >0.5 ${\mu}{\textrm}{m}$ and MgO thickness > 600 $\AA$. The threshold voltage scales linearly with oxide thickness and is < 2 V for oxide thickness < 800 $\AA$ and gate lengths < 0.6 ${\mu}{\textrm}{m}$. The GaN MOSFET shows excellent potential for elevated temperature, high speed applications.

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Characteristics of Organic Thin Film Transistors with Organic and Organic-inorganic Hybrid Polymer Gate Dielectric (유기물과 유무기 혼합 폴리머 게이트 절연체를 사용한 유기 박막 트랜지스터의 특성)

  • Bae, In-Seob;Lim, Ha-Young;Cho, Su-Heon;Moon, Song-Hee;Choi, Won-Seok
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.22 no.12
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    • pp.1009-1013
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    • 2009
  • In this study, we have been synthesized the dielectric layer using pure organic and organic-inorganic hybrid precursor on flexible substrate for improving of the organic thin film transistors (OTFTs) and, design and fabrication of organic thin-film transistors (OTFTs) using small-molecule organic semiconductors with pentacene as the active layer with record device performance. In this work OTFT test structures fabricated on polymerized substrates were utilized to provide a convenient substrate, gate contact, and gate insulator for the processing and characterization of organic materials and their transistors. By an adhesion development between gate metal and PI substrate, a PI film was treated using $O_2$ and $N_2$ gas. The best peel strength of PI film is 109.07 gf/mm. Also, we have studied the electric characteristics of pentacene field-effect transistors with the polymer gate-dielectrics such as cyclohexane and hybrid (cyclohexane+TEOS). The transistors with cyclohexane gate-dielectric has higher field-effect mobility, $\mu_{FET}=0.84\;cm^2/v_s$, and smaller threshold voltage, $V_T=-6.8\;V$, compared with the transistor with hybrid gate-dielectric.