• 한국ITS학회 논문지
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• 제9권5호
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• pp.72-79
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• 2010

본 논문은 GaN HEMT (Gallium Nitride High Electron Mobility Transistor)를 이용하여 Class-E 스위칭 모드를 적용한 S-대역 레이더용 고효율 스위칭 도허티 전력증폭기를 설계 및 제작하였다. 제안된 도허티 전력증폭기는 캐리어 증폭기와 피킹 증폭기가 고효율 특성을 갖는 Class-E 스위칭 모드로 구성되었다. 측정을 위한 입력 RF 신호는 $100\;{\mu}s$의 펄스폭과 1 kHz의 PRF (Pulse Repetition Frequency)인 duty 10%인 펄스 신호를 사용하였다. 2.85 GHz의 주파수 대역에서 스위칭 도허티 전력증폭기 측정결과 포화전력에서 6 dB 떨어진 지점의 전력부가 효율 (power-added efficiency, PAE) 및 드레인 효율 (drain efficiency)은 각각 64%와 80.6%로 측정되었다.

• 한국결정학회지
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• 제8권1호
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• pp.33-37
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• 1997

(1012)면 사파이어 기판위에서 성장되는 (12f10)면 GaN 이종적층막의 광학적 특성을 연구하였다. GaN 이종적층막은 $Ga/HC1/NH_3/He$계를 사용한 HVPE(halide vapor phase epitaxy)방법에 의하여 $990^{\circ}C$의 온도에서 성장시켰다. 이종적층막의 표면조직과 결정구조는 XRD, RHEED와 SEM으로 확인하였다. 결정구조가 확인된 (1210)면 GaN 단결정막의 광학적 특성은 PL과 Ra-man으로 관찰하였다. Raman 측정은 광학적포논에 기인된 활성모드를 결정축에 대하여 레이저빔의 편광과 진행방향에 의해 변화하는 것을 관찰하였다. Y(Z, Y & Z) X 방향에서의 측정은 $A_1(TO)=533\;cm^{-1},\;E_1(TO)=559\;cm^{-1}$과 $E_2=568\;cm^{-1}$ 모드에 기인된 Raman 스펙트럼을 관찰할 수 있었으며 Z(Y, Y & Z) X 방향에서의 측정은 $E_2$포논 만이 검출되었다.

• Journal of electromagnetic engineering and science
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• 제14권3호
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• pp.284-292
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• 2014

This paper presents a characteristic evaluation of commercial gallium nitride (GaN) transistors having two different gate-lengths of $0.4-{\mu}m$ and $0.25-{\mu}m$ in the design of a class-S power amplifier (PA). Class-S PA is operated by a random pulse-width input signal from band-pass delta-sigma modulation and has to deal with harmonics that consider quantization noise. Although a transistor having a short gate-length has an advantage of efficient operation at higher frequency for harmonics of the pulse signal, several problems can arise, such as the cost and export license of a $0.25-{\mu}m$ transistor. The possibility of using a $0.4-{\mu}m$ transistor on a class-S PA at 955 MHz is evaluated by comparing the frequency characteristics of GaN transistors having two different gate-lengths and extracting the intrinsic parameters as a shape of the simplified switch-based model. In addition, the effectiveness of the switch model is evaluated by currentmode class-D (CMCD) simulation. Finally, device characteristics are compared in terms of current-mode class-S PA. The analyses of the CMCD PA reveal that although the efficiency of $0.4-{\mu}m$ transistor decreases more as the operating frequency increases from 955 MHz to 3,500 MHz due to the efficiency limitation at the higher frequency region, it shows similar power and efficiency of 41.6 dBm and 49%, respectively, at 955 MHz when compared to the $0.25-{\mu}m$ transistor.

• 한국전자파학회논문지
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• 제25권6호
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• pp.646-652
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• 2014

본 논문은 GaN(Gallium Nitride) HEMT(High Electron Mobility Transistor) die를 이용하여 Ku-대역 전력 증폭기 설계, 제작 그리고 실험 결과에 대해 기술하였다. 저비용으로 Ku-대역 전력 증폭기를 설계하기 위하여 고가의 알루미나 회로 기판 제작 대신 PCB(Printed Circuit Board)를 이용하여 입/출력단 정합 회로를 이용하였다. 측정 결과로는 펄스 모드로 동작시켰을 때 14.8 GHz에서 42.6 dBm의 출력 전력, 37.7 % 드레인 효율 그리고 7.9 dB의 선형 이득을 얻었다. CW(Continuous Wave) 실험 결과로는 39.8 dBm의 출력 전력, 24.1 %의 드레인 효율 그리고 7.2 dB의 선형 이득을 얻을 수 있었다.

• Journal of electromagnetic engineering and science
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• 제17권2호
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• pp.105-107
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• 2017

The self-biasing circuit through a feedback resistor is applied to a gallium nitride (GaN) distributed power amplifier (PA) monolithic microwave circuit (MMIC). The self-biasing circuit is a useful scheme for biasing depletion-mode compound semiconductor devices with a negative gate bias voltage, and is widely used for common source amplifiers. However, the self-biasing circuit is rarely used for PAs, because the large DC power dissipation of the feedback resistor results in the degradation of output power and power efficiency. In this study, the feasibility of applying a self-biasing circuit through a feedback resistor to a GaN PA MMIC is examined by using the high operation voltage of GaN high-electron mobility transistors. The measured results of the proposed GaN PA are the average output power of 41.1 dBm and the average power added efficiency of 12.2% over the 6-16 GHz band.

• Tribology and Lubricants
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• 제35권5호
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• pp.274-285
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• 2019

Chemical mechanical polishing (CMP), which is a material removal process involving chemical surface reactions and mechanical abrasive action, is an essential manufacturing process for obtaining high-quality semiconductor surfaces with ultrahigh precision features. Recent rapid growth in the industries of digital devices and semiconductors has accelerated the demands for processing of various substrate and film materials. In addition, to solve many issues and challenges related to high integration such as micro-defects, non-uniformity, and post-process cleaning, it has become increasingly necessary to approach and understand the processing mechanisms for various substrate materials and abrasive particle behaviors from a tribological point of view. Based on these backgrounds, we review recent CMP R&D trends in this study. We examine experimental and analytical studies with a focus on substrate materials and abrasive particles. For the reduction of micro-scratch generation, understanding the correlation between friction and the generation mechanism by abrasive particle behaviors is critical. Furthermore, the contact stiffness at the wafer-particle (slurry)-pad interface should be carefully considered. Regarding substrate materials, recent research trends and technologies have been introduced that focus on sapphire (${\alpha}$-alumina, $Al_2O_3$), silicon carbide (SiC), and gallium nitride (GaN), which are used for organic light emitting devices. High-speed processing technology that does not generate surface defects should be developed for low-cost production of various substrates. For this purpose, effective methods for reducing and removing surface residues and deformed layers should be explored through tribological approaches. Finally, we present future challenges and issues related to the CMP process from a tribological perspective.

• 한국재료학회지
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• 제15권5호
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• pp.348-352
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• 2005

Gallium oxyhydroxide (GaOOH) powders were heat-treated in a flowing ammonia gas to form GaN, and the reaction kinetics of the oxide to nitride was quantitatively determined by X-ray diffraction analysis. GaOOH turned into intermediate mixed phases of $\alpha-\;and\;\beta-Ga_2O_3$, and then single phase of GaN. The reaction time for full conversion $(t_c)$ decreased as the temperature increased. There were two-types of rapid reaction processes with the reaction temperature in the initial stage of nitridation at below $t_c$, and a relatively slow processes followed over $t_c$ does not depends on temperatures. The nitridation process was found to be limited by the rate of an interfacial reaction with the reaction order n value of 1 at $800^{\circ}C$ and by the diffusion-limited reaction with the n of 2 at above $1000^{\circ}C$, respectively, at below $t_c$. The activation energy for the reaction was calculated to be 1.84 eV in the temperature of below $830^{\circ}C$, and decreased to 0.38 eV above $830^{\circ}C$. From the comparative analysis of data, it strongly suggest the rate-controlling step changed from chemical reaction to mass transport above $830^{\circ}C$.

• 전자통신동향분석
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• 제34권5호
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• pp.71-80
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• 2019

Gallium nitride (GaN) can be used in high-voltage, high-power-density/-power, and high-speed devices owing to its characteristics of wide bandgap, high carrier concentration, and high electron mobility/saturation velocity. In this study, we investigate the technology trends for X-/Ku-band GaN RF power devices and MMIC power amplifiers, focusing on gate-length scaling, channel structure, and power density for GaN RF power devices and output power level and output power density for GaN MMIC power amplifiers. Additionally, we review the technology trends in gallium arsenide (GaAs) RF power devices and MMIC power amplifiers and analyze the technology trends in RF power devices and MMIC power amplifiers based on both GaAs and GaN. Furthermore, we discuss the current direction of national research by examining the national and international technology trends with respect to X-/Ku-band power devices and MMIC power amplifiers.

• 공업화학
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• 제25권4호
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• pp.414-417
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• 2014

습식제련 기술을 통한 Ga의 재활용을 위해 고결정성 GaN으로 구성되어 있는 LED 공정스크랩의 침출 거동을 연구하였다. 고결정성 GaN은 산성 및 염기성 조건에서 매우 안정하여 침출이 어려운 물질로 알려져 있다. 따라서, 본 연구에서는 볼밀링을 통해 원료와 $Na_2CO_3$를 1:1 비율로 섞은 후 관상로를 이용해 $1000-1200^{\circ}C$에서 열처리 하여 산화물로의 상변화를 유도하였다. 열처리 결과로써, $1100^{\circ}C$에서 GaN은 약 73 wt%의 Ga을 포함하는 산화물로 상변화 되었다. 이러한 열처리 샘플은 $100^{\circ}C$ 4 M HCl에서 96%의 높은 침출률을 나타냈다.

• 한국전자파학회논문지
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• 제24권4호
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• pp.394-402
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• 2013

본 논문은 GaN(Gallium Nitride) HEMT(High Electron Mobility Transistor)를 이용한 S대역 레이더용 전력증폭기 설계하고 제작된 스위칭 모드 전력증폭기의 ruggedness 시험에 관련된 내용을 기술하였다. 고효율 특성을 위해 전력증폭기를 Class-F로 설계하였으며, 측정을 위한 입력 신호는 $100{\mu}s$의 pulse width 및 10 %의 duty cycle인 pulse 신호를 사용하였다. 제작된 Class-F 전력증폭기의 중심 주파수에서 측정한 결과, 8.7 dB의 전력 이득과 42 dBm의 출력 전력, 54.2 %의 전력 부가 효율(PAE) 및 62.6 %의 드레인 효율이 측정되었다. 또한, 전력증폭기의 신뢰성 시험의 일환으로 Ruggedness 시험을 위한 실험 구성을 제안하고, VSWR(Voltage Standing Wave Ratio)을 변화시켜 출력 전력과 효율을 측정하였다. 설계된 전력증폭기가 VSWR 변화에 따라 출력 전력 32.6~41.1 dBm까지 변화하고, 드레인 효율은 23.4~63 %까지 변하는 특성을 얻을 수 있었다.