• JSTS:Journal of Semiconductor Technology and Science
• /
• v.14 no.6
• /
• pp.818-823
• /
• 2014

A high-gain wideband low noise amplifier (LNA) using $0.25-{\mu}m$ Gallium-Nitride (GaN) MMIC technology is presented. The LNA shows 8 GHz to 15 GHz operation by a distributed amplifier architecture and high gain with an additional common source amplifier as a mid-stage. The measurement results show a flat gain of $25.1{\pm}0.8dB$ and input and output matching of -12 dB for all targeted frequencies. The measured minimum noise figure is 2.8 dB at 12.6 GHz and below 3.6 dB across all frequencies. It consumes 98 mA with a 10-V supply. By adjusting the gate voltage of the mid-stage common source amplifier, the overall gain is controlled stably from 13 dB to 24 dB with no significant variations of the input and output matching.

• Journal of electromagnetic engineering and science
• /
• v.14 no.4
• /
• pp.399-404
• /
• 2014

A power amplifier (PA) for a femto-cell base station should be highly efficient, linear and small. The efficiency for amplification of a high peak-to-average power ratio (PAPR) signal was improved by designing an asymmetric Doherty PA (DPA). The linearity was improved by applying third-order inter-modulation (IM3) cancellation method. A small size is achieved by designing the DPA using GaN MMIC process. The implemented 2-stage DPA delivers a power-added efficiency (PAE) of 38.6% and a gain of 33.4 dB with an average power of 34.2 dBm for a 7.2 dB PAPR 10 MHz bandwidth LTE signal at 2.14 GHz.

• Bulletin of the Korean Chemical Society
• /
• v.30 no.2
• /
• pp.302-308
• /
• 2009

This study investigated the production of hydrogen over Ga (1.0, 2.0, and 5.0 mol%)-$TiO_2$ photocatalysts prepared by a solvothermal method. The absorption band was slightly blue-shifted upon the incorporation of the gallium ions, but the intensity of the photoluminescence (PL) curves of Ga-incorporated $TiO_2$s was distinguishably smaller, with the smallest case being the 2.0 mol% Ga-$TiO_2$, which was related to the recombination between the excited electrons and holes. $H_2$ evolution from photo splitting of water over Ga-incorporated $TiO_2$ in the liquid system was enhanced, compared to that over pure $TiO_2$; particularly, the production of 5.6 mL of $H_2$ gas after 8 h when 1.5 g of the 2.0 mol% Ga-incorporated $TiO_2$ was used.

• Journal of the Korea Institute of Military Science and Technology
• /
• v.13 no.6
• /
• pp.1071-1079
• /
• 2010

This paper describes the design and fabrication of a high-efficiency GaN HEMT(Gallium Nitride High-electron Mobility Transistor) Pallet power amplifier module for S-band phased array radar applications. Pallet amplifier module has a series 2-cascaded power amplifier and the final amplification-stage consists of balanced GaN HEMT transistor. In order to achieve high efficiency characteristic of pallet power amplifier module, all amplifiers are designed to the switching-mode amplifier. We performed with various PRF(Pulse Repetition Frequency) of 1, 10, 100 and 1000Hz at a fixed pulse width of $100{\mu}s$. In the experimental results, the output power, gain, and drain efficiency(${\eta}_{total}$) of the Pallet power amplifier module are 300W, 33dB, and 51% at saturated output power of 2.9GHz, respectively.

• Journal of the Korea Institute of Military Science and Technology
• /
• v.19 no.5
• /
• pp.574-581
• /
• 2016

Trend on high-power GaN(Gallium Nitride) SSPA(Solid-State Power Amplifier) and its availability in miniature radar systems are presented. There are numerous studies on high-power GaN devices since they have some characteristics of high-breakdown voltage, high power density, and high-temperature stability. Recent scaled GaN technology makes it possible to apply it in SSPAs for W- and G-band applications, with increasing its maximum frequency. In addition, it leads to downsizing and power-efficiency improvement of SSPAs, which means that GaN SSPAs can be available in miniature radar systems. This study also shows radar performance and comparison in the case of using such SSPAs at three frequency bands of Ku, Ka, and W. Finally, we demonstrate prospects of scaled GaN SSPAs in future miniature radar systems.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.22 no.5
• /
• pp.373-376
• /
• 2009

In this paper we report upon an investigation into the effect of DC bias voltage on the electrical and optical properties of Gallium doped zinc oxide (GZO) film. GZO films were deposited on glass substrate without substrate temperature by RF magnetron sputtering from a ZnO target mixed with 5 wt% $Ga_{2}O_{3}$. we investigated sample properties of bias voltage change in 0 to -60 V. We were able to achieve as low as $5.89{\times}10^{-4}{\Omega}cm$ and transmittance over 88 %. without substrate heating.

• The Transactions of the Korean Institute of Power Electronics
• /
• v.20 no.6
• /
• pp.558-565
• /
• 2015

Gallium nitride high-electron mobility transistor (GaN HEMT) is the strongest candidate for replacing Si MOSFET. Comparing the figure of merit (FOM) of GaN with the state-of-the-art super junction Si MOSFET, the FOM is much better because of the wide band gap characteristics and the heterojunction structure. Although GaN HEMT has many benefits for the power conversion system, the performance of the power conversion system with the GaN HEMT is sensitive because of its low threshold voltage ($V_{th}$) and even lower parasitic capacitance. This study examines the characteristics of a phase-shifted full-bridge dc-dc converter with cascode GaN HEMT. The problem of unoptimized dead time is analyzed on the basis of the output capacitance of GaN HEMT. In addition, the printed circuit board (PCB) layout consideration is analyzed to reduce the negative effects of parasitic inductance. A comparison of the experimental results is provided to validate the dead time and PCB layout analysis for a phase-shifted full-bridge dc-dc converter with cascode GaN HEMT.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2009.10a
• /
• pp.998-1001
• /
• 2009

A new flexible TFT backplane structure with improved mechanical reliability is proposed. Amorphous indium-gallium-zinc-oxide (a-IGZO) thin film transistors based on this structure have been fabricated on a polyimide substrate, and the resultant mechanical durability has been evaluated in a cyclic bending test. The panel can withstand 10,000 bending cycles at a bending radius of 5 mm without any noticeable TFT degradation. After 10K bending cycles, the change of threshold voltage, mobility, sub-threshold slope, and gate leakage current were only -0.22V, -0.13$cm^2$/V-s, -0.05V/decade, and $-3.05{\times}10^{-13}A$, respectively.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2007.08a
• /
• pp.145-148
• /
• 2007

The authors report on the fabrication of thin film transistors (TFTs) that use amorphous indium-gallium-zinc oxide (a-IGZO) channel and have the channel length (L) and width (W) patterned by dry etching. To prevent the plasma damage of active channel, a 100-nm-thckness $SiO_{x}$ by PECVD was adopted as an etch-stopper structure. IGZO TFT (W/L=10/50${\mu}m$) fabricated on glass exhibited the high performance mobility of $35.8\;cm^2/Vs$, a subthreshold gate voltage swing of $0.59V/dec$, and $I_{on/off}$ of $4.9{\times}10^6$. In addition, 4.1” transparent QCIF active-matrix organic light-emitting diode display were successfully fabricated, which was driven by a-IGZO TFTs.

• Bulletin of the Korean Chemical Society
• /
• v.24 no.7
• /
• pp.953-956
• /
• 2003

Hexagonal GaN (h-GaN) films have been grown on Si(111) substrates by metal organic chemical vapor deposition using the azidodiethylgallium methylamine adduct, Et₂Ga(N₃)·NH₂Me, as a new single precursor. Deposition was carried out in the substrate temperature range 385-650 °C. The GaN films obtained were stoichiometric and did not contain any appreciable amounts of carbon impurities. It was also found that the GaN films deposited on Si(111) had the [0001] preferred orientation. The photoluminescence spectrum of a GaN film showed a band edge emission peak characteristic of h-GaN at 378 nm.