• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 춘계학술대회 논문집 기술교육전문연구회
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• pp.31-34
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• 2003

The sapphire wafers for blue light emitting devices were manufactured by the implementation of the surface machining technology based on micro-tribology. This process has been performed by chemical and mechanical polishing(CMP) process. The sapphire crystalline wafers were characterized by double crystal X-ray diffraction. The sample quality of sapphire crystalline wafer at surfaces has a full width at half maximum 89 arcses. The surfaces of sapphire wafers were mechanically affected by residual stress and surface default. Sapphire wafers's waveness has higher abrasion rate in the edge of the wafer than its center due to Newton's Ring interference.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.44-44
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• 2009

Recently, transparent ZnO-based TFTs have attracted much attention for flexible displays because they can be fabricated on plastic substrates at low temperature. We report the fabrication and characteristics of ZnO channel layers(ZnO TFTs) having different channel thicknesses. The ZnO film were deposited as active channel layers on $Si_3N_4/Ti/SiO_2p$-Si substrates by rf magnetron sputtering at $100\;^{\circ}C$ without additional annealing. Also the Zno thin films deposited at oxygen partial pressures of 40%. ZnO TFTs using a bottom-gate configuration were investigated. The $Si_3N_4$ film were deposited as gate insulator by PE-CVD at $15\;^{\circ}C$. All Processes were processed below $150^{\circ}C$ which is optimal temperature for flexible display and were used dry etching method.

• 한국정밀공학회지
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• 제29권11호
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• pp.1183-1189
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• 2012

Organic light-emitting diodes (OLEDs) using microcavity effect have attracted great attention because they can reduce the width of emission spectra from organic materials, and enhance brightness from the same material. We demonstrate the simulation results of the radiation properties from top-emitting organic light-emitting diodes (TE-OLEDs) with microcavity structures based on the general electromagnetic theory. Organic materials such as N,N'-di (naphthalene-1-yl)-N,N'-diphenylbenzidine (NPB) as a hole transport layer and tris (8-hydroxyquinoline) ($Alq_3$) as emitting and electron transporting layer are used to form the OLEDs. The organic materials were sandwiched between anode such as Ni or Au and cathode such as Al, Ag, or Al:Ag. The devices were characterized with electroluminescence phenomenon. We confirmed that the simulation results are consistent with experimental results.

• 한국전기전자재료학회논문지
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• 제24권11호
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• pp.911-914
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• 2011

We optimize electrical and optical properties of thermal and SF6 plasma treated indium tin oxide (ITO)/Al based reflector for high-power ultraviolet (UV) light-emitting diodes (LEDs). After thermal and $SF_6$ plasma treatments of ITO/Al reflector, the specific contact resistance decreased from $1.04{\times}10^{-3}\;{\Omega}{\cdot}cm^2$ to $9.21{\times}10^{-4}\;{\Omega}{\cdot}cm^2$, while the reflectance increased from 58% to 70% at the 365 nm wavelength. The low resistance and high reflectance of ITO/Al reflector are attributed to the reduced Schottky barrier height (SBH) between the ITO and AlGaN by large electronegativity of fluorine species and reduced interface roughness between the ITO and Al, respectively.

• 한국전기전자재료학회논문지
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• 제32권3호
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• pp.201-206
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• 2019

This report constitutes the first demonstration in Korea of single-crystal lateral gallium oxide ($Ga_2O_3$) as a metal-oxide-semiconductor field-effect-transistor (MOSFET), with a breakdown voltage in excess of 480 V. A Si-doped channel layer was grown on a Fe-doped semi-insulating ${\beta}-Ga_2O_3$ (010) substrate by molecular beam epitaxy. The single-crystal substrate was grown by the edge-defined film-fed growth method and wafered to a size of $10{\times}15mm^2$. Although we fabricated several types of power devices using the same process, we only report the characterization of a finger-type MOSFET with a gate length ($L_g$) of $2{\mu}m$ and a gate-drain spacing ($L_{gd}$) of $5{\mu}m$. The MOSFET showed a favorable drain current modulation according to the gate voltage swing. A complete drain current pinch-off feature was also obtained for $V_{gs}<-6V$, and the three-terminal off-state breakdown voltage was over 482 V in a $L_{gd}=5{\mu}m$ device measured in Fluorinert ambient at $V_{gs}=-10V$. A low drain leakage current of 4.7 nA at the off-state led to a high on/off drain current ratio of approximately $5.3{\times}10^5$. These device characteristics indicate the promising potential of $Ga_2O_3$-based electrical devices for next-generation high-power device applications, such as electrical autonomous vehicles, railroads, photovoltaics, renewable energy, and industry.

• Industrial Engineering and Management Systems
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• 제6권1호
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• pp.83-93
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• 2007

This paper gives an attempt to build a decision support tool linked with a simulation software called ARENA for evaluating and comparing the performance of the push and pull material driven strategies operating in the flow shop environment with a bottleneck resource as the shop's constraint. To be fair for such evaluation, the comparison must be made fairly under the optimal setting of both systems' operating parameters. In this study, an optimal-seeking heuristic algorithm, Genetic Algorithm (GA), is employed to suggest a systems' best design based on the economic consideration, which is the profit generated from the system. Results from the study have revealed interesting outcomes, letting us know the strength and weakness of the push and pull mechanisms as well as the effect of each operating parameter to the overall system's financial performance.

• 한국해양공학회지
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• 제6권2호
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• pp.21-34
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• 1992

The behavior of fatigue crack growth in the single spot welded joint of zinc galvanized steel sheets was studied experimentally and analytically based on fracture mechanics. Axial tension fatigue tests were carried out with the BSxGAB specimen that the bare plane(GAB) of monogalvanized steel sheet was spot welded to the double thickness bare steel sheet(BS), and with the GAxGAB specimen that the galvanized plane (GA) was spot welded to the equal thickness bare plane (GAB) 1. The relation between maximum stress intensity factor, K sub(max) and the number of cycles to failure, N sub(f) has shown a linear relation on log-log plot in the spot weld of the zinc galvanized steel sheet. 2. The fatigue strength of BSxGAB specimens is about 23% higher than that of GAxGAB specimens at the fatigue strength of $1\times10^6$ cycles. And the fatigue life of BSxGAB specimens at the same load range increases 6~9 times higher than that of GAxGAB specimens. 3. The general tendency at the angle of bending($\theta$) in an applied load has changed rapidly at the initial 20% of its life. After then, it has changed slowly. The change at the angle of bending has increased linearly as the load range increases. 4. It has shown a linear relation between the location ratio of initiation ${\gamma}$ and fatigue life $N_f$ on the semi-log graph paper. Here $\gamma$ means that the crack distance between main crack and sub-crack, 2L is divided by the nugget diameter, 2r. $\gamma=a{\cdot}log N_f+n$ (where a and n are material constant.)

• 한국전자파학회논문지
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• 제26권9호
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• pp.837-840
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• 2015

그래핀은 한 원자 두께의 탄소재료로서 전자가 매우 빠른 속도로 이 층을 통과할 수 있기 때문에, 트랜지스터를 비롯한 다양한 디바이스 응용을 위한 연구가 수행되어 왔다. 높은 전자이동도 특성으로 인해 높은 주파수 대역이나 고속 스위치 등의 시스템 응용에 적합하다. 본 연구에서는 양산에 적합한 RT-CVD(Rapid Thermal Chemical Vapor Deposition) 공정을 이용하여 실리콘 기판 상에 그래핀 층을 형성하고, 다양한 공정조건 최적화를 통해 $7,800cm^2/Vs$의 전자이동도를 추출하였다. 이는 실리콘 기판의 7배 이상 되는 값이고, GaAs 기판보다도 높은 수치이다. 밴드갭이 존재하지 않는 그래핀 기반 트랜지스터 모델링을 위해 pMOS와 nMOS의 모델을 융합하여 적용하였고, 실험을 통해 추출된 전자이동도 값을 적용하였다. 추출된 모델을 이용하여 트랜지스터의 핵심 파라미터 중의 하나인 게이트의 길이와 폭 등에 따른 전기적 특성을 고찰하였다.

• 한국전기전자재료학회논문지
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• 제22권10호
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• pp.821-825
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• 2009

Recently, transparent ZnO-based TFTs have attracted much attention for flexible displays because they can be fabricated on plastic substrates at low temperature. We report the fabrication and characteristics of ZnO TFTs having different channel thicknesses deposited at low temperature. The ZnO films were deposited as active channel layer on $Si_3N_4/Ti/SiO_2/p-Si$ substrates by RF magnetron sputtering at $100^{\circ}C$ without additional annealing. Also, the ZnO thin films deposited at oxygen partial pressures of 40%. ZnO TFTs using a bottom-gate configuration were investigated. The $Si_3N_4$ film was deposited as gate insulator by PE-CVD at $150^{\circ}C$. All Processes were processed below $150^{\circ}C$ which is optimal temperature for flexible display and were used dry etching method. The fabricated devices have different threshold slop, field effect mobility and subthreshold slop according to channel thickness. This characteristics are related with ZnO crystal properties analyzed with XRD and SPM. Electrical characteristics of 60 nm ZnO TFT (W/L = $20\;{\mu}m/20\;{\mu}m$) exhibited a field-effect mobility of $0.26\;cm^2/Vs$, a threshold voltage of 8.3 V, a subthreshold slop of 2.2 V/decade, and a $I_{ON/OFF}$ ratio of $7.5\times10^2$.

• 한국전기전자재료학회논문지
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• 제32권5호
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• pp.371-375
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• 2019

Developing a thin-film transistor with characteristics such as a large area, high mobility, and high reliability are key elements required for the next generation on displays. In this paper, we have investigated the research trends related to improving the reliability of oxide-semiconductor-based thin-film transistors, which are the primary focus of study in the field of optical displays. It has been reported that thermal treatment in a high-pressure oxygen atmosphere reduces the threshold voltage shift from -7.1 V to -1.9 V under NBIS. Additionally, a device with a $SiO_2/Si_3N_4$ dual-structure has a lower threshold voltage (-0.82 V) under NBIS than a single-gate-insulator-based device (-11.6 V). The dual channel structure with different oxygen partial pressures was also confirmed to have a stable threshold voltage under NBIS. These can be considered for further study to improve the NBIS problem.