• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.931-934
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• 2001

GaN nanowires has much interest as one-dimensional materials for blue light LED. GaN-based materials have been the subject of intensive research for blue light emission and high temperature/high power electronic devices. In this letter, the synthesis of GaN nanowires by the reaction of mixture of GaN nanowires by the reaction of mixture of Ga meta and GaN powder with NH$_3$ using thermal chemical vapor deposition is reported. X-ray diffraction, energy dispersive x-ray spectrometer, scanning electron microscopy, and transmission electron microscopy indicate that those GaN nanowires with hexagonal wurtzite structure were about 60nm in diameter and up to several hundreds of micrometers in length.

• 열처리공학회지
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• 제31권5호
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• pp.237-243
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• 2018

In-rich InGaN epilayers were grown on (0001) sapphire substrates by radio-frequency plasma-assisted molecular beam epitaxy (RF-MBE). InGaN epilayers grown at various growth condition were observed by SEM, XRD, and RHEED. When plasma power of nitrogen increased from 290 to 350 W, surface morphology and crystal quality became worse according to more active nitrogen on the surface of InGaN at N-rich growth condition. As In composition was reduced from 89 to 71% by changing the incoming flux of In and Ga, surface morphology and crystal quality became worse. In addition, weak peaks of cubic InGaN phase was observed from InGaN layer with 71% In composition by XRD ${\Phi}$ scan measurement. When growth temperature decreased from 500 to $400^{\circ}C$, RHEED diffraction pattern was changed to be from streaky to spotty which means atomically rough surface, and spotty pattern showed cubic symmetry of InGaN clearly. XRD ${\Phi}$ scan measurement gave clear evidence that more cubic InGaN phase was formed at low growth temperature. All these results indicates that extremely low surface mobility of Ga adatom caused inferior crystal quality and cubic InGaN phase.

• 한국전기전자재료학회논문지
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• 제18권11호
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• pp.1056-1060
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• 2005

We investigated the fabrication and characteristics of the nitride-based spin-polarized LEDs with room-temperature ferromagnetic (Ga,Mn)N layer as a spin injection source. The (Ga,Mn)N thin films having room-temperature ferromagnetic ordering were found to exhibit the negative MR and anomalous Hall resistance up to room temperature, revealing the existence of spin-polarized electrons in (Ga,Mn)N films at room temperature. The electrical characteristics in the spin LEDs did not degraded in spite of the insertion of the (Ga,Mn)N layer into the LED structure. In EL spectra of the spin LEDs, it is confirmed that the devices produce intense EL emission at 7 K as well as room temperature. These results are expected to open up new opportunities to realize room-temperature operating semiconductor spintronic devices.

• 센서학회지
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• 제28권3호
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• pp.152-156
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• 2019

An ultraviolet (UV) image sensor is an extremely important optoelectronic device used in scientific and medical applications because it can detect images that cannot be obtained using visible or infrared image sensors. Because photodetectors and transistors are based on different materials, conventional UV imaging devices, which have a hybrid-type structure, require additional complex processes such as a backside etching of a GaN epi-wafer and a wafer-to-wafer bonding for the fabrication of the image sensors. In this study, we developed a monolithic GaN UV passive pixel sensor (PPS) by integrating a GaN-based Schottky-barrier type transistor and a GaN UV photodetector on a wafer. Both individual devices show good electrical and photoresponse characteristics, and the fabricated UV PPS was successfully operated under UV irradiation conditions with a high on/off extinction ratio of as high as $10^3$. This integration technique of a single pixel sensor will be a breakthrough for the development of GaN-based optoelectronic integrated circuits.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2003년도 추계학술발표강연 및 논문개요집
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• pp.165-165
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• 2003

The growth of GaN on Si is of great interest due to the several advantages low cost, large size and high-quality wafer availability as well as its matured technology. The crystal quality of GaN is known to be much influenced by the surface pretreatment of Si substrate [1]. In this work, the properties of GaN overlayer grown on ion implanted Si(111)and bare Si(111) have been investigated. Si(111) surface was treated ion implantation with 60KeV and dose 1${\times}$10$\^$16//$\textrm{cm}^2$ prior to film growth. GaN epilayers were grown at 1100$^{\circ}C$ for 1 hour after growing AlN buffer layers for 15-30 minutes at 1100$^{\circ}C$ with metal organic chemical vapor deposition (MOCVD). The properties of GaN epilayers were evaluated by X-Ray Diffraction (XRD), Scanning electron microscope (SEM) Photoluminescence (PL) at room temperature and Hall measurement The results showed that the GaN on ion implanted Si(111) markedly affected to the structural, optical and electrical characteristic of GaN layers.

• 한국재료학회지
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• 제3권5호
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• pp.443-450
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• 1993

실리콘이 주입된 CaAs 기판위에 플라즈마 화학 증착법으로 자기정렬 gate구조의 Schottky contact을 형성하였다. 갈륨비소 소자 제조를 위하여 두께 1600$\AA$의 턴스텐질화막을 $350^{\circ}C$에서 증착하여 $750^{\circ}C$에서 $900^{\circ}C$까지 급속 열처리 하였다. 텅스텐 질화막과 GaAs계면의 열적 안정성을 XRD(X-ray diffraction), PL(photoluminescence),ODLTS(optical deep livel transient spectroscopy)측정으로 조사하였으며, W보다 $W_{67}N_{33}$ gate를 형성시킬 경우에 GaAs에 미치는 열적손상이 적음을 알 수 있으며 이온 주입한 Si이온이 활성화 되는 것으로 생각된다. $W_{67}N_{33}$ GaAs 다이오드가 약 800-$900^{\circ}C$의 고온열처리 온도에서 W/GaAs 다이오드의 경우보다 열적 안정성이 우수하였다.

• 마이크로전자및패키징학회지
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• 제27권2호
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• pp.33-38
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• 2020

광전기화학적 물분해에서 광전극으로 이용되는 GaN은 전해질에 대해 높은 안정성을 가지고 있으며 물의 산화 환원준위를 포함하고 있어 외부전압 없이 물분해가 가능하다. 그러나 GaN 광전극의 경우, 재료 자체의 효율이 낮아 상용화하기에는 부족한 실정이다. 본 연구에서는 광효율을 향상시키기 위해 Cobalt phosphate(Co-pi) 촉매를 광전기증착(Photoelectro-deposition)방법을 통하여 GaN 광전극에 도입하였다. Co-pi 촉매 증착 후 SEM, EDS, XPS분석을 진행하여 Co-pi의 증착 여부 및 증착 정도를 확인하고, Potentiostat를 이용해 PEC 특성을 분석하였다. SEM 이미지를 통해 Co-pi가 GaN 표면 위에 20~25 nm 사이즈의 클러스터 형태로 고르게 증착되어 있는 것을 확인하였다. EDS 및 XPS 분석을 통해 GaN 표면의 입자가 Co-pi임을 확인하였다. 이 후 측정된 PEC 특성에서 Co-pi를 증착 시킨 후 0.5 mA/㎠에서 0.75 mA/㎠로 향상된 광전류밀도 값을 얻을 수 있었다. 향상된 원인을 밝히기 위하여, 임피던스 및 Mott-Schottky 측정을 진행하였고, 측정 결과, 50.35 Ω에서 34.16 Ω으로 감소한 분극저항(R_p)과 증가된 donor 농도(N_D) 값을 확인하였다. 물분해 전 후, 표면 성분을 분석한 결과 물분해 후에도 Co-pi가 남아있음으로써 Co-pi 촉매가 안정적이라는 것을 확인하였다. 이를 통해, Co-pi가 GaN의 효율 향상을 위한 촉매로서 효과가 있음을 확인하였고, 다른 광전극에 촉매로써 적용시켰을 경우, PEC 시스템의 효율을 향상시킬 수 있을 것으로 판단된다.

• Journal of the Optical Society of Korea
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• 제2권1호
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• pp.13-21
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• 1998

Based on the escape cone concepts, high-brightness light-emitting diodes (LEDs) have been analyzed. In AlGaAs or InGaAlP LEDs, photon absorption in the ohmic region under the electrode is known to be significant. Thus, ins general, a thick window layer (WL) and a transparent substrate (TS) would minimize photon shielding by the electrodes and considerably improve photon output coupling efficiency. However, the schemes do not seem to be necessary in InGaN system. Photon absorption in ohmic contact to a wide bandgap semiconductor such as GaN may be negligible and, as a result, the significant photon shielding by the electrodes will not degrade the photon output coupling efficiency so much. The photon output coupling efficiency estimated in InGaN LEDs is about 2.5 - 2.8 times that of the conventional high-brightness LED structures based on both WL and TS schemes. As a result, the extenal quantum efficiency in InGaN LEDs is as high as 9% despite the presumably very low internal quantum efficiency.

• 한국재료학회지
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• 제9권3호
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• pp.257-262
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• 1999

MOCVD를 이용하여 $SiO_2$로 패턴된 GaN/sapphire 기판상에서 $NH_3$유량과 성장온도가 GaN 성장의 선택성과 성장 특성에 미치는 영향을 조사하였다. $NH_3$유량을 500~1300sccm, 성장온도를 $950~1060^{\circ}C$로 변화시켜 성장변수에 따른 영향을 주사전자현미경으로 관찰하였다.$NH_3$유량이 증가할수록 성장선택성이 향상되었으나 기판윈도우에서 성장되는 GaN 형상변화에는 큰 영향을 미치지 못하였다. 성장온도가 높을수록 GaN의 성장선택성이 향상됨이 관찰되었다. 패턴 모양을 원형, 선형, 방사선모양(선형 패턴을 30, $45^{\circ}$로 회전)으로 제작하여 GaN 성장을 수행한 후 관찰한 결과 {1101}으로 이루어진 Hexagonal 피라밋 형상과 마스크층 위로의 측면성장을 얻을 수 있었으며, 성장조건에 따른 <1100>와 <1210>의 방향으로의 측면성장속도의 차이를 관찰할 수 있었다.

• 한국결정성장학회지
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• 제17권1호
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• pp.6-10
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• 2007

R-plane 사파이어 위에 a-plane GaN층이 성장된 기판에 혼합소스 HVPE(mixed-source hydride vapor phase epitaxy) 방법으로 GaN/InGaN의 이종접합구조(heterostructure)를 구현하였다. GaN/InGaN 이종접합구조는 GaN, InGaN, Mg-doped GaN 층으로 구성되어 있다. 각 층의 성장온도는 GaN층은 $820^{\circ}C$, InGaN 층은 $850^{\circ}C$, Mg-doped GaN 층은 $1050^{\circ}C$에서 성장하였다. 이때의 $NH_3$와 HCl 가스의 유량은 각각 500 sccm, 10 sccm 이었다. SAG-GaN/InGaN 이종접합구조의 상온 EL (electroluminescence) 특성은 중심파장은 462 nm, 반치폭(FWHM : full width at half maximum) 은 0.67eV 이었다. 이 결과로부터 r-plane 사파이어 기판위에 multi-sliding boat system의 혼합소스 HVPE 방법으로 이종접합구조의 성장이 가능함을 확인하였다.