• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2002년도 하계종합학술대회 논문집(1)
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• pp.167-170
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• 2002

The design and fabrication of Q-band 3-stage monolithic microwave integrated circuit(MMIC) driver and power amplifiers for WLAN are presented using 0.2${\mu}{\textrm}{m}$ AlGaAs/InGaAs/GaAs pseudomorphic high electron mobility transistor(PHEMT). In each stage of the MMIC DA, a negative feedback is used for both broadband and good stability. The MMIC PA has employed a balanced configuration to overcome these difficulties and achieve high power with low VSWR over a wide frequency range. In the MMIC DA, the measurement results arc achieved as an input return loss under -4dB, an output return loss under -l0dB, a gain of 14dB, and a PldB of 17dB at C-band(36~ 44GHz). The chip size is 28mm$\times$1.3mm. The developed MMIC PA has the l0dB linear gain over 360Hz to 420Hz band and 22dBm PldB performance at 400Hz. The size of fabricated MMIC PA is 4mm x3mm. These results closely match with design results. This MMIC DA Sl PA will be used as the unit cells to develop millimeter-wave transmitters for use in wideband wireless LAN systems.

• 한국전자파학회논문지
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• 제16권10호
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• pp.989-994
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• 2005

위성통신 시스템의 초고주파 스위치 메트릭스(MSM)를 위한 MMIC 스위치 칩을 InGaAs/GaAs p-HEMT 공정을 이용하여 설계 및 제작하였다. MMIC 스위치는 on과 off상태에서 우수한 입출력 반사계수를 위해 흡수형으로 설계되었다. 또한, 스위치 칩의 크기를 줄이기 위해 MIM 커패시터와 spiral 인덕터의 집중소자를 이용하여 3 GHz 대역에서의 ${\lambda}/4$ 임피던스 변환기를 구현하였다. 설계된 MMIC 스위치는 $3.2\~3.6\;GHz$ 대역에서 사용할 수 있으며 $1.6\;mm{\times}1.3\;mm$의 칩 크기를 갖는다. On-wafer 측정 결과, 2 dB 이하의 삽입 손실과 56.8 dB 이상의 격리도 특성을 나타내었다. 이와 같은 측정 결과는 시뮬레이션 결과와 잘 일치하는 것이다.

• ETRI Journal
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• 제31권3호
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• pp.342-344
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• 2009

From a hydrodynamic device simulation for the pseudomorphic high electron mobility transistors (pHEMTs), we observe an increase of maximum extrinsic transconductance and a decrease of source-drain capacitances. This gives rise to an enhancement of the switching speed and isolation characteristics as the upper-to-lower planar-doping ratios (UTLPDR) increase. On the basis of simulation results, we fabricate single-pole-double-throw transmitter/receiver monolithic microwave integrated circuit (MMIC) switches with the pHEMTs of two different UTLPDRs (4:1 and 1:2). The MMIC switch with a 4:1 UTLPDR shows about 2.9 dB higher isolation and approximately 2.5 times faster switching speed than those with a 1:2 UTLPDR.

• 전자통신동향분석
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• 제36권3호
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• pp.53-64
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• 2021

As the 5G service market is expected to grow rapidly, the development of high-power, high-efficiency power amplifiers for the 5G communication infrastructure is indispensable. Gallium nitride (GaN) is attracting great interest as a key device in power devices and integrated circuits due to its wide bandgap, high carrier concentration, high electron mobility, and high-power saturation characteristics. In this study, we investigate the technology trends of Ka-band GaN radio frequency (RF) power devices and integrated circuits for operation in the millimeter-wave band of recent 5G mobile communication services. We review the characteristics of GaN RF high electron mobility transistor (HEMT) devices to implement power amplifiers operating at frequencies around 28 GHz and compare the technology of foreign companies with the device characteristics currently developed by the Electronics and Telecommunication Research Institute (ETRI). In addition, the characteristics of Ka-band GaN monolithic microwave integrated circuit (MMIC) power amplifiers manufactured using various GaN HEMT device technologies are reviewed by comparing characteristics such as frequency band, output power, and output power density of integrated circuits. In addition, by comparing the performance of the power amplifier developed by ETRI, the current status and future direction of domestic GaN power devices and integrated circuit technology will be discussed.

• JSTS:Journal of Semiconductor Technology and Science
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• 제16권3호
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• pp.312-318
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• 2016

This paper presents a 2-6 GHz GaN HEMT power amplifier monolithic microwave integrated circuit (MMIC) with bridged-T all-pass filters and output-reactance-compensation shorted stubs using the $0.25{\mu}m$ GaN HEMT foundry process that is developed by WIN Semiconductors, Inc. The bridged-T filter is modified to mitigate the bandwidth degradation of impedance matching due to the inherent channel resistance of the transistor, and the shorted stub with a bypass capacitor minimizes the output reactance of the transistor to ease wideband load impedance matching for maximum output power. The fabricated power amplifier MMIC shows a flat linear gain of 20 dB or more, an average output power of 40.1 dBm and a power-added efficiency of 19-26 % in 2 to 6 GHz, which is very useful in applications such as communication jammers and electronic warfare systems.

• Journal of Advanced Marine Engineering and Technology
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• 제33권1호
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• pp.144-152
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• 2009

This paper propose highly miniaturized active $90^{\circ}C$ phase difference power divider and combiner for application to wireless communication system. The conventional passive $90^{\circ}C$ power divider and combiner cannot be integrated on MMIC because of their very large circuit size. Therefore, the highly miniaturized active $90^{\circ}C$ phase difference power divider and combiner are required for a development of highly integrated MMIC. In this paper, the highly miniaturized active $90^{\circ}C$ phase difference power divider and combiner employing InGaAs/GaAs HBT were designed, fabricated on GaAs substrate. According to the results, the circuit size of fabricated active $90^{\circ}C$ phase difference power divider and combiner were $1.67{\times}0.87$ mm and $2.42{\times}1.05$ mm, respectively, which were 31.6% and 2.2% of the size of conventional passive branch-line coupler. The output gain division characteristic of proposed divider circuit showed 8.4 dB and 7.9 dB respectively, and output phase difference characteristic showed $-89.3^{\circ}C$. The output gain coupling characteristic of proposed combiner circuit showed 9.4 dB and 10.5 dB respectively, and output phase difference characteristic showed $-92.6^{\circ}C$. The highly miniaturized active $90^{\circ}C$ phase difference power divider and combiner exhibited good RF performances compared with the conventional passive branch-line coupler.

• 한국정보통신학회논문지
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• 제18권11호
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• pp.2697-2702
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• 2014

본 논문에서는 위성 통신 시스템 응용을 위하여 Ku 대역에서 동작 가능한 2W MMIC (monolithic microwave integrated circuit) 전력증폭기를 개발하였다. 2W MMIC 전력증폭기는 WIN (wireless information networking) semiconductor Corp.의 GaAs 기반 PHEMT (pseudomorphic high electron mobility transistor) 공정을 사용하여 개발되었다. 개발된 Ku 대역 2W MMIC 전력증폭기의 측정결과, 13.75 GHz ~ 14.5 GHz의 동작주파수 범위에서 29 dB 이상의 이득, 33.4 dBm 이상의 포화 출력전력을 얻었다. 특히 전력부가효율은 29 %로 기존에 발표된 GaAs 기반 Ku 대역 2W MMIC 전력증폭기 상용 제품들에 비하여 높은 결과를 얻을 수 있었다.

• ETRI Journal
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• 제27권2호
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• pp.133-139
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• 2005

A monolithic microwave integrated circuit (MMIC) chip set consisting of a power amplifier, a driver amplifier, and a frequency doubler has been developed for automotive radar systems at 77 GHz. The chip set was fabricated using a 0.15 ${\mu}$ gate-length InGaAs/InAlAs/GaAs metamorphic high electron mobility transistor (mHEMT) process based on a 4-inch substrate. The power amplifier demonstrated a measured small signal gain of over 20 dB from 76 to 77 GHz with 15.5 dBm output power. The chip size is 2mm${\times}$ 2mm. The driver amplifier exhibited a gain of 23 dB over a 76 to 77 GHz band with an output power of 13 dBm. The chip size is 2.1mm${\times}$ 2mm. The frequency doubler achieved an output power of -6 dBm at 76.5 GHz with a conversion gain of -16 dB for an input power of 10 dBm and a 38.25 GHz input frequency. The chip size is 1.2mm ${\times}$ 1.2mm. This MMIC chip set is suitable for the 77 GHz automotive radar systems and related applications in a W-band.

• 전기전자학회논문지
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• 제24권4호
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• pp.1093-1097
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• 2020

본 논문에서는 위성 통신 시스템 응용을 위하여 Ku-대역에서 동작하는 3 W PHEMT MMIC 전력 증폭기의 특성을 기술한다. 3 W PHEMT MMIC 전력 증폭기는 WIN(wireless information networking) semiconductor Corp.에서 제공하는 게이트 길이가 0.25 ㎛인 GaAs 기반 PHEMT (pseudomorphic high electron mobility transistor) 공정을 사용하여 개발되었다. 개발된 Ku-대역 PHEMT MMIC 전력 증폭기는 13.75 GHz에서부터 14.5 GHz까지의 동작주파수 범위에서 22.2~23.1 dB의 소신호 이득과 34.8~35.4 dBm의 포화 출력 전력을 가진다. 최대 포화 출력 전력은 13.75 GHz에서 35.4 dBm (3.47 W)이었다. 전력 부가 효율은 30.8~37.83%의 특성을 얻었으며 칩의 크기는 4.4 mm×1.9 mm이다. 개발된 PHEMT MMIC 전력 증폭기는 다양한 Ku-대역 위성 통신 시스템 응용에 적용 가능할 것으로 예상된다.

• 대한전자공학회논문지SD
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• 제37권3호
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• pp.34-38
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• 2000

본 논문에서는 AlGaAs/lnGaAs/GaAs P-HEMT 소자를 이용한 10 Gb/s 광수신기용 MMIC 초고속 저잡음 전치증폭기를 설계, 제작하고 특성을 분석 하였다. T 형태의 0.15㎛ 게이트 길이를 갖는 P-HEMT 소자를 이용하여 3단 트랜스임피던스 구조로 회로를 설계하였으며 광대역 특성을 얻기 위하여 피킹인덕터를 사용하였고, 저잡음특성을 위하여 게이트폭을 최적화하였다. 제작된 전치증폭기는 트랜스임피던스 이득 60㏈Ω, 대역폭 9.15 ㎓, 잡음지수가 3.9 ㏈ 이하인 특성을 보였다.