• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.860-864
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• 2003

Recently. use of compound semiconductor is widely increasing in the area of LED and RF device. In this study, wafer bonding module is designed and optimized to bond 6 inches device wafer and carrier wafer. Bonding process is performed in vacuum environment and resin is used to bond two wafers. Load spreader and double heating mechanisms are adopted to minimize wafer warpage and void. Structure and heat transfer analyses show the designed mechanisms are very effective in performance improvement.

• Journal of the Institute of Electronics and Information Engineers
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• v.50 no.2
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• pp.91-97
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• 2013

Self-heating effects during operation of high current AlGaN/GaN power transistors degrade the current-voltage characteristics. In particular, this problem becomes serious when a low thermal conductivity Si substrate is used. In this work, AlGaN/GaN-on-Si devices were fabricated with various channel widths and Si substrate thicknesses in which the structure dependent self-heating effects were investigated by temperature dependent measurements as well as thermal simulation. Accordingly, a device structure that can effectively dissipate the heat was proposed in order to achieve the maximum current in a multi-channel, large area device. Employing via-holes and common electrodes with a 100 ${\mu}m$ Si substrate thickness improved the current level by 75% reducing the channel temperature by 68%.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.6 s.171
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• pp.144-151
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• 2005

Spin coater is regarded as a major module rotating at high speed to be used build up polymer resin thin film layer fur bonding process of GaAs wafer. This module is consisted of spin unit for spreading uniformly, align device, resin spreading nozzle and et. al. Specially, spin unit which is a component of module can cause to vibrate and finally affect to the uniformity of polymer resin film layer. For the stability prediction of rotation velocity and uniformity of polymer resin film layer, it is very important to understand the dynamic characteristics of assembled spin coater module and the dynamic response mode resulted from rotation behavior of spin chuck. In this paper, stress concentration mode and the deformed shape of spin chuck generated due to angular acceleration process are presented using analytical method for evaluation of structural safety according to the revolution speed variation of spin unit. And also, deformation form of GaAs wafer due to dynamic behavior of spin chuck is presented fur the comparison of former simulated results.

• Applied Chemistry for Engineering
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• v.30 no.4
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• pp.504-508
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• 2019

The feasibility of replacing the tope cell of pn GaInP homojunction with our GaInP/AlGaInP heterojunction structure in III-V semiconductor multijunction photovoltaic (MJPV) cells having the highest current conversion efficiency was investigated. The performance of photovoltaic (PV) cells grown on $2^{\circ}$ and $10^{\circ}$ off-oriented GaAs substrates were compared to each other. The PV cells on the $10^{\circ}$ off-cut substrate showed higher short-circuit current density ($J_{sc}$) and conversion efficiency values than that of using the $2^{\circ}$ one. For $2{\times}2mm^2$ area PV cell on $10^{\circ}$ off substrate, the $J_{sc}$ of $9.21mA/cm^2$ and the open-circuit voltage of 1.38 V were measured under 1 sun illumination. For $5{\times}5mm^2$ cell on $10^{\circ}$ off substrate, the conversion efficiency was decreased from 6.03% (1 sun) to 5.28% (20 sun) due to a decrease in fiill factor (FF).

• Journal of Convergence for Information Technology
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• v.10 no.6
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• pp.28-34
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• 2020

A structure in which GaAs and AlGaAs epilayers are formed with a metal organic chemical vapor deposition equipment on a GaAs wafer similar to the structure of making a vertical cavity surface emitting laser is used. Photonic Quantum Ring (PQR) devices that are naturally generated by 3D resonance are manufactured by chemically assisted ion beam etching technology, which is a dry etching method. A new technology that can be fabricated has been studied, and as a result, the possibility of wet etching of a solution containing phosphoric acid, hydrogen peroxide and methanol was investigated, and the device fabrication by applying this method are also discussed. In addition, the spectrum of the fabricated optical device was measured, and the results were theoretically analyzed and compared with the wavelength value obtained by the measurement. It is expected that the PQR device will be able to model cells in a three-dimensional shape or be applied to the display field.

• Korean Journal of Materials Research
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• v.16 no.10
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• pp.652-655
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• 2006

A direct wafer bonding process necessary for GaAs-on-insulator (GOI) fabrication with high thermal annealing temperatures was studied by using PECVD oxides between gallium arsenide and silicon wafers. In order to apply some uniform pressure on initially-bonded wafer pairs, a graphite sample holder was used for wafer bonding. Also, a tool for measuring the tensile forces was fabricated to measure the wafer bonding strengths of both initially-bonded and thermally-annealed samples. GaAs/$SiO_2$/Si wafers with 0.5-$\mu$m-thick PECVD oxides were annealed from $100^{\circ}C\;to\;600^{\circ}C$. Maximum bonding strengths of about 84 N were obtained in the annealing temperature range of $400{\sim}500^{\circ}C$. The bonded wafers were not separated up to $600^{\circ}C$. As a result, the GOI wafers with high annealing temperatures were demonstrated for the first time.

• Proceedings of the Optical Society of Korea Conference
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• 2003.02a
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• pp.172-173
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• 2003

SOI (Silicon on insulator) 웨이퍼를 이용하여 제작된 전자소자는 고온에서 동작이 안정될 뿐만 아니라 초고속 동작이 가능하고, 사용 소비전력이 낮고, 단위 소자의 집적 효율이 우수해 활발한 연구가 이루어지고 있다. 최근에 초고속 광소자와 단위 광소자들의 집적을 위해 Si 이외의 GaAs, InP, SIC 등의 반도체 박막을 절연층 위에 만드는 연구가 많이 진행되고 있다 따라서 초기에 절연체 위에 실리콘 박막을 형성하는 Silicon on insulator (SOI) 기술은 다양한 종류의 반도체 박막을 절연체 위에 형성하는 Semiconductor on insulator로 SOI의 의미가 확장되고 있다. (중략)

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.247-247
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• 2010

CdTe는 최근 적외선 검출기 개발에 응용하기 위해 활발한 연구가 진행 중인데 이는 HgCdTe(MCT)와 격자 불일치가 0.3% 이하로 대구경 단결정 MCT박막 제작이 용이하기 때문이다. 본 연구에서는 MBE 공정으로 GaAs 물질이 완충층으로 증착된 Si(100)기판을 사용하여 CdTe 물질과 Si기판간의 격자 불일치를 줄여 대면적 CdTe 단결정 박막을 얻고자 완충층의 두께별 결정성 및 표면 특성을 보았다. CdTe 박막의 증착은 Metal Organic Chemical Vapor Deposition system (MOCVD)를 이용하였고 실험결과 2nm의 GaAs 완충층이 사용된 박막에서 단결정 CdTe(400) 박막이 성장 되었으며, GaAs 완충층의 두께가 증가 함에 따라 $1{\mu}m$ 완충층에서는 다결정 박막이 성장 되었다. 본 연구결과는 Si 기판에 성장된 단결정 CdTe층을 이용 대면적 HgCdTe웨이퍼의 제조에 널리 이용 될 수 있으리라 여겨진다.

• Korean Journal of Materials Research
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• v.4 no.5
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• pp.600-607
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• 1994

Optimum exper~mental conditions were established for the growth of heteroepitaxial GaAs layers on InP using liquid phase epitaxy (LPE) technique. Results showed that the optimum growth temperature was $720^{\circ}C$ at a cooling rate of $0.5^{\circ}C$/min. Surface morphology of the grown layers significantly improved by addition of about 0.005wt% Se to the Ga growth melt, which effectively suppressed melt-back of InP substrates into the melt during the initial stage of growth. It was observed that the quality of GaAs layers also improved substantially when the substrates patterned with grating structure were used, as determined by the (400) double crystal X-ray diffraction. The transmission electron microscopy observation indicated t.hat the misfit dislocations interact with each other at the grating region, resulting in a lower dislocation density in the upper GaAs layer.

• Korean Journal of Optics and Photonics
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• v.10 no.6
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• pp.518-523
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• 1999

In thi, study, we made experiments to fonn a mesa shape by meltback method with various concentration of solutions and found that unsaturated (20%) InGaAsP (1.55 !-tm) solution at a growth temperature was the most suitable for the formation of a mesa ,hape on the wafer which has an InGaAsP active layer and an InP cap layer on an n-InP substrate. It was difficult to form a proper mesa shape for the fabrication of PBH-LDs only by the meltback method; therefore, we fabricated PBH-LDs by forming the mesa shape with the meltback method after wet etching and by growing a current-blocking layer successively. As the electrical and optical charaleri,tiecs of MQW-PBH-LDs fabricated by above methods, when the cavity length was $300{\mu}m$, the threshold current was about 10 mA, internal quantum efficiency 82%, internal loss $9.2cm^{-1}$, and characteristic temperature was 65 K at $25~45^{\circ}C$ and 42 K at $45~65^{\circ}C$. /TEX>.