• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2000년도 추계종합학술대회 논문집(1)
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• pp.357-360
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• 2000

This paper describes a parameter extraction method for HBT(Heterojunction Bipolar Transistor) equivalent circuit model without measurements of special test structures or numerical optimizations. Instead, all equivalent circuit parameters are calculated analytically from small-signal S-parameters measured under different bias conditions. These values being extracted from the cutoff mode can be used to extract intrinsic parameters at the active mode. This method yields a deviation of about 1.3 % between the measured and modeled S-parameters.

• 한국광학회:학술대회논문집
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• 한국광학회 2007년도 하계학술발표회 논문집
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• pp.289-290
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• 2007

We have theoretically derived a electrical model and extracted a parasitic parameters of leakage current in InGaN/GaN light emitting diodes (LEDs). The parasitic parameters of our LED are $R_p=10^{10}{\Omega}$, $I_{0,2}=10^{-17}A$ and $n_2=3.6$, which provide information of leakage current.

• 한국전자파학회지:전자파기술
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• 제2권2호
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• pp.30-37
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• 1991

GaAs MESFET의 소신호 등가 모델에서 외부 푀로 성분들을 결정하는 개선된 방법을 제시하였다. 정화간 내부 회로 성분값들을 구하기 위하여 외부 회로 성분들을 제거하는 것이 중요하다. 전송선로를 포함한 기생 인덕터와 커패시터로 이루어지 ㄴ외부 회로를 정립하고, 산란 행렬로부터 이들의 값을 구한 후에 내부 회로 성분을 구하였다. 특히 기생 인덕턴스와 커패시턴스값들은 주파수에 따라 거의 일정한 변화를 보였다.

• 환경영향평가
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• 제20권3호
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• pp.357-365
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• 2011

The QUAL2K has the same basic characteristics as the QUAL2E model, which has been widely used in stream water quality modeling; in QUAL2K, however, various functions are supplemented. The QUAL2Kw model uses a genetic algorithm(GA) for automatic calibration of QUAL2K, and it can search for optimum water quality parameters efficiently using the calculation results of the model. The QUAL2Kw model was applied to the Gangneung Namdaecheon River on the east side of the Korean Peninsula. Because of the effluents from the urban area, the middle and lower parts of the river are more polluted than the upper parts. Moreover, the hydraulic characteristics differ between the lower and upper parts of rivers. Thus, the river reaches were divided into seven parts, auto-calibration for the multiple reaches was performed using the function of the user-defined automatic calibration of the rates worksheets. Because GA parameters affect the optimal solution of the model, the impact of the GA parameters used in QUAL2Kw on the fitness of the model was analyzed. Sensitivity analysis of various factors, such as population size, crossover probability, crossover mode, strategy for mutation and elitism, mutation rate, and reproduction plan, were performed. Using the results of this sensitivity analysis, the optimum GA parameters were selected to achieve the best fitness value.

• 한국전기전자재료학회논문지
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• 제14권3호
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• pp.241-245
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• 2001

In this paper, we present parameter optimization technique for GaAs/AlGaAs multiple quantum well avalanche photodiodes used for image capture mechanism in high-definition system. Even under flawless environment in semiconductor manufacturing process, random variation in process parameters can bring the fluctuation to device performance. The precise modeling for this variation is thus required for accurate prediction of device performance. The precise modeling for this variation is thus required for accurate prediction of device performance. This paper will first use experimental design and neural networks to model the nonlinear relationship between device process parameters and device performance parameters. The derived model was then put into genetic algorithms to acquire optimized device process parameters. From the optimized technique, we can predict device performance before high-volume manufacturign, and also increase production efficiency.

• 전자공학회논문지A
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• 제33A권12호
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• pp.39-46
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• 1996

In AlGaAs/GaAs HBT the temperature dependence of DC parameters was investigated over the temperature range between 95K and 580K. The temperature dependence of DC parameters depends on the relative contribution of each of the current components suc as emitter-injection-current, base-injection-current, bulk recombination current, interface recombination curretn, thermal generation ecurrent and avalanche current due to impact ionization within the collector space charge layer in a specific temperature. In this paper we investigated the temperature effects on DC parameters such as V$_{BE,ON}$ current gain, input and output characteristics, V$_{CE, OFF}$, R$_{E}$, R$_{C}$ and analyzed the origins, and extracted the qualitativ econditions for a stable HBTs against the temperature variation. Finally, in order to keep HBTs stable with respect to the variation of temperature, the valance-band-energy-discontinuity at emitter-base heterojunction should be large enough to enhance the effect of carrier suppression at a relatively high temperature. In addition the recombination centers, especially around collector junction, should be removed and the area of emitter and collector junction should be identical as well.

• 한국지능시스템학회논문지
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• 제11권6호
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• pp.500-504
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• 2001

에미커 크기가 2$\times10\mu m^2$인 InGaP/GaAs이종접합 바이폴라 트랜지스터의 T자 모양으로 연결된 등기회로 요소를추출하기 위하여, 경계구간 설정이 개선된 유전자 알고리즘을 채택하였다. 이 소신호 모델 파리미터를 유전자 알고리즘을 사용하여, 다양한 순방향 바이서스에 측정한 S-파리미터로부터 추출하였다. 추출된 값들은 물리적인의미와 일관성을 보여준다. 모델 S-파리미터는 측정 S-파라미터와 2GHz-26.6GHz의 주파수 범위에서 잘 일치한다.

• 대한전자공학회논문지
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• 제26권9호
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• pp.1308-1316
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• 1989

A simplified 10-element GaAs MESFET equivalent circuit model has been presented which is suitable for the design of ultrabroad-band microwave small-signal amplification, the these circuit element values are extracted from measured S-parameters using complex-curve fitting algorithm. Packaged GaAs MESFET equivalent circuits are composed of intrinsic \ulcornermodel and several extrinsic elements at microwave frequencies, of which the largest effects are caused by package lead inductances. If these are eliminated from measured S-parameters, newly obtained S-parameters are closed to intrinsic \ulcornermodel, and the rest element values can be easily extracted. The modeling results applied to the packaged GaAs MESFET NE71083 are almost equal between the measure S-parameters and the mideled S-parameters within b 2% errors from DC to 8GHz, and errors are increased to \ulcorner% upto 12GHz wide bandwidth.

• 대한기계학회논문집A
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• 제27권8호
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• pp.1309-1316
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• 2003

The general dicing process cuts a semiconductor wafer to lengthwise and crosswise direction by using a rotating circular diamond blade. But products with inferior quality are produced under the influence of several parameters in dicing process such as blade, wafer, cutting water and cutting conditions. Moreover we can not apply this dicing method to GaN wafer, because the GaN wafer is harder than the other wafer such as SiO2, GaAs, GaAsP, and AlGaAs. In order to overcome this problem, development of a new dicing process and determination of dicing parameters are necessary. This paper describes a new wafer dicing method using fixed diamond scriber and precision servo mechanism and determination of several parameters - scribing depth, scribing force, scriber inclined angle, scribing speed, and factor for scriber replacement - for a new dicing machine using scriber.

• 한국정밀공학회지
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• 제20권2호
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• pp.218-225
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• 2003

The general dicing process cuts a semiconductor wafer to lengthwise and crosswise direction by using a rotating circular diamond blade. However, inferior goods may be made under the influence of several parameters in dicing process such as blade, wafer, cutting water and cutting conditions. Moreover we can not apply this dicing method to a GaN wafer, because the GaN wafer is harder than other wafers such as SiO$_2$, GaAs, GaAsP, and AlGaAs. In order to overcome this problem, development of a new dicing process and determination of dicing parameters are necessary. This paper describes determination of several parameters - scribing depth, scribing force, scriber inclined angle, scribing speed, and factor for scriber replacement - for a new dicing machine using a scriber.