• 제목/요약/키워드: Fusion Filling

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Effect of a Multi-Step Gap-Filling Process to Improve Adhesion between Low-K Films and Metal Patterns

  • Lee, Woojin;Kim, Tae Hyung;Choa, Yong-Ho
    • Korean Journal of Materials Research
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    • v.26 no.8
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    • pp.427-429
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    • 2016
  • A multi-step deposition process for the gap-filling of submicrometer trenches using dimethyldimethoxysilane (DMDMOS), $(CH_3)_2Si(OCH_3)_2$, and $C_xH_yO_z$ by plasma enhanced chemical vapor deposition (PECVD) is presented. The multi-step process consisted of pre-treatment, deposition, and post-treatment in each deposition step. We obtained low-k films with superior gap-filling properties on the trench patterns without voids or delamination. The newly developed technique for the gap-filling of submicrometer features will have a great impact on inter metal dielectric (IMD) and shallow trench isolation (STI) processes for the next generation of microelectronic devices. Moreover, this bottom up gap-fill mode is expected to be universally for other chemical vapor deposition systems.

Flow Analysis of Filling Imbalance according to Runner Shapes in Injection Mold (사출금형의 러너시스템 형상에 따른 충전불균형 유동해석 모델)

  • Jang, Min-Kyu;Go, Seung-Woo;Kim, Yeong-Min;Noh, Byeong-Su;Jeong, Yeong-Deug
    • Design & Manufacturing
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    • v.2 no.5
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    • pp.16-20
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    • 2008
  • Almost all injection molds have multi-cavity runner system for mass production, which are designed with geometrically balanced runner system in order to accomplish filling balance between cavity to cavity during processing; However, even though geometrically balanced runner is used, filling imbalances have been observed. In these day, the CAE has been used widely in injection molding. However, CAE with fusion mesh can't indicate such as jetting, flow mark and filling imbalance in multi cavity mold. In this study, we investigated the filling imbalance according to runner shapes by CAE analysis. As a result in CAE, in case of binary branch runner system, filling imbalance was indicated between cavity to cavity, but the flow pattern of each cavity uniformed in unary branch runner system.

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Surface energy assisted gecko-inspired dry adhesives

  • Rahmawan, Yudi;Kim, Tae-Il;Kim, Seong-Jin;Lee, Kwang-Ryeol;Moon, Myoung-Woon;Suh, Kahp-Yang
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.02a
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    • pp.449-449
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    • 2011
  • We reported the direct effect of intrinsic surface energy of dry adhesive material to the Van der Waals and capillary forces contributions of the total adhesion force in an artificial gecko-inspired adhesion system. To mimic the gecko foot we fabricated tilted nanohairy structures using both lithography and ion beam treatment. The nanohairy structures were replicated from Si wafer mold using UV curable polymeric materials. The control of nanohairs slanting angles was based on the uniform linear argon ion irradiation to the nanohairy polymeric surface. The surface energy was studied utilizing subsequent conventional oxygen ion treatment on the nanohairy structures which resulted in gradient surface energy. Our shear adhesion test results were found in good agreement with the accepted Van der Waals and capillary forces theory in the gecko adhesion system. Surface energy would give a direct impact to the effective Hamaker constant in Van der Waals force and the filling angle (${\varphi}$) of water meniscus in capillary force contributions of gecko inspired adhesion system. With the increasing surface energy, the effective Hamaker constant also increased but the filling angle decreased, resulting in a competition between the two forces. Using a simple mathematical model, we compared our experimental results to show the quantitative contributions of Van der Waals and capillary forces in a single adhesion system on both hydrophobic and hydrophilic surfaces. We found that the Van der Waals force contributes about 82.75% and 89.97% to the total adhesion force on hydrophilic and hydrophobic test surfaces, respectively, while the remaining contribution was occupied by capillary force. We also showed that it is possible to design ultrahigh dry adhesive with adhesion strength of more than 10 times higher than apparent gecko adhesion force by controlling the surface energy and the slanting angle induced-contact line of dry adhesive the materials.

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Semi-Solid Forming of Al-Zn-Mg-Cu Alloy Applying Low-Temperature Casting Process (저온 주조법을 응용한 Al-Zn-Mg-Cu 합금의 반응고 성형)

  • Kim, Jeong-Min;Kim, Ki-Tae;Jung, Woon-Jae
    • Journal of Korea Foundry Society
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    • v.22 no.2
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    • pp.82-88
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    • 2002
  • Al-5.5Zn-2.5Mg-l.5Cu semi-solid slurry was prepared by cooling the liquid metal with a low superheat to a solid and liquid co-existing temperature. Relatively round solid particles could be obtained in the slurry through the simple process. The prepared slurry was deformed into the metallic mold by a press and the mechanical properties of obtained specimens were investigated. Mold filling ability of the alloy slurry was also investigated and compared with that of A356 alloy. Al-Zn-Mg-Cu alloy showed lower mold filling ability than A356 alloy probably because small amount of eutectic phase is present and the heat of fusion generated during solidification is smaller than that of A356 alloy.

Formation of Copper Seed Layers and Copper Via Filling with Various Additives (Copper Seed Layer 형성 및 도금 첨가제에 따른 Copper Via Filling)

  • Lee, Hyun-Ju;Ji, Chang-Wook;Woo, Sung-Min;Choi, Man-Ho;Hwang, Yoon-Hwae;Lee, Jae-Ho;Kim, Yang-Do
    • Korean Journal of Materials Research
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    • v.22 no.7
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    • pp.335-341
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    • 2012
  • Recently, the demand for the miniaturization of printed circuit boards has been increasing, as electronic devices have been sharply downsized. Conventional multi-layered PCBs are limited in terms their use with higher packaging densities. Therefore, a build-up process has been adopted as a new multi-layered PCB manufacturing process. In this process, via-holes are used to connect each conductive layer. After the connection of the interlayers created by electro copper plating, the via-holes are filled with a conductive paste. In this study, a desmear treatment, electroless plating and electroplating were carried out to investigate the optimum processing conditions for Cu via filling on a PCB. The desmear treatment involved swelling, etching, reduction, and an acid dip. A seed layer was formed on the via surface by electroless Cu plating. For Cu via filling, the electroplating of Cu from an acid sulfate bath containing typical additives such as PEG(polyethylene glycol), chloride ions, bis-(3-sodiumsulfopropyl disulfide) (SPS), and Janus Green B(JGB) was carried out. The desmear treatment clearly removes laser drilling residue and improves the surface roughness, which is necessary to ensure good adhesion of the Cu. A homogeneous and thick Cu seed layer was deposited on the samples after the desmear treatment. The 2,2'-Dipyridyl additive significantly improves the seed layer quality. SPS, PEG, and JGB additives are necessary to ensure defect-free bottom-up super filling.

Study of the Characteristics of Hydrogen-Gas Filling Process of Ultra-Light Composite Tanks for Fuel-Cell Vehicles (연료전지자동차용 초경량 복합재료 탱크의 수소 충전 특성 연구)

  • Yoo, Gye-Hyoung;Kim, Jong-Lyul;Lee, Taek-Su;Lee, Joong-Hee
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.35 no.7
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    • pp.813-819
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    • 2011
  • In this research, we investigated the hydrogen-gas filling characteristics of ultra-light composite tanks that have a plastic or aluminum liner inside the composite shell. The study was performed for different gas and tank temperatures. The temperature changes at various positions in the Type-4 tank during hydrogen-gas filling were monitored in order to understand the effects of the filling conditions. The results were compared with those obtained for a Type-3 tank. As the filling speed was increased, a quicker temperature rise was observed, and the temperature distribution over the entire region showed significant discrepancies.

Fabrication and Characterization of Superhydrophobic Glass Surfaces Using Silicon Micro-mold and Thermal-reflow Process (실리콘 마이크로 몰드와 유리의 열-재흐름 현상을 이용한 초소수성 유리 표면 제작 및 젖음 특성 평가)

  • Kim, Seung-Jun;Kong, Jeong-Ho;Lee, Dongyun;Kim, Jong-Man
    • Korean Journal of Metals and Materials
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    • v.50 no.8
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    • pp.591-597
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    • 2012
  • This paper presents regularly micro-textured glass surfaces ensuring the superhydrophobic properties in the Cassie-Baxter regime. The proposed surfaces were fabricated simply and efficiently by filling the glass material into a silicon micro-mold with periodic micro-cavities based on a thermal-reflow process, resulting in a successful demonstration of the textured glass surface with periodically-arrayed micro-pillar structures. The static and dynamic wetting properties of the micro-textured glass surfaces were characterized by measuring the static contact angle (SCA) and contact angle hysteresis (CAH), respectively. In addition, the surface wettability was estimated theoretically based on Wenzel and Cassie-Baxter wetting theories, and compared with the experimental ones. Through the experimental and theoretical observations, it was clearly confirmed that the proposed micro-textured glass surfaces showed the slippery superhydrophobic behaviors in the Cassie-Baxter wetting mode.

Effective Pre-rating Method Based on Users' Dichotomous Preferences and Average Ratings Fusion for Recommender Systems

  • Cheng, Shulin;Wang, Wanyan;Yang, Shan;Cheng, Xiufang
    • Journal of Information Processing Systems
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    • v.17 no.3
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    • pp.462-472
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    • 2021
  • With an increase in the scale of recommender systems, users' rating data tend to be extremely sparse. Some methods have been utilized to alleviate this problem; nevertheless, it has not been satisfactorily solved yet. Therefore, we propose an effective pre-rating method based on users' dichotomous preferences and average ratings fusion. First, based on a user-item ratings matrix, a new user-item preference matrix was constructed to analyze and model user preferences. The items were then divided into two categories based on a parameterized dynamic threshold. The missing ratings for items that the user was not interested in were directly filled with the lowest user rating; otherwise, fusion ratings were utilized to fill the missing ratings. Further, an optimized parameter λ was introduced to adjust their weights. Finally, we verified our method on a standard dataset. The experimental results show that our method can effectively reduce the prediction error and improve the recommendation quality. As for its application, our method is effective, but not complicated.

The Study on Filling Factor of Radiation Shielding Lead-free Sheet Via Screen Printing Method (스크린 프린팅 공법을 통한 방사선 무연 차폐 시트에 관한 연구)

  • Kang, Sang-Sik;Jeong, Ah-Rim;Lee, Su-Min;Yang, Seung-Woo;Kim, Kyo-Tae;Heo, Ye-Ji;Park, Ji-Koon
    • Journal of the Korean Society of Radiology
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    • v.12 no.6
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    • pp.713-718
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    • 2018
  • In many previous studies, monte carlo simulation is used to produce lead-free shielding sheet, and the possibility of radiation shielding capability and weight reduction is presented. But it is difficult to simulation for binder and micro-pores because of In fact it does not provide sufficient information necessary for the commercialization process. Therefore, in this paper, the results of radiation shielding capability corresponding to filling factor was presented by using the screen printing method to provide information on gel-paste required for the commercialization process. In this study, the geometric setup for evaluate of radiation shielding ability was designed to comply with IEC 61331-1:2014 and KS A 4025. In addition, radiation irradiation conditions were 100 kVp filtered with 2.0 mmAl total filtration was applied according to KS A 4021 standard. In this study, Pb $1270{\mu}m$, $BaSO_4$ $3035{\mu}m$, $Bi_2O_3$ $1849{\mu}m$ and $WO_3$ $2631{\mu}m$ were analyzed based on ten value layer. Additionally, the filling factor was analyzed as $BaSO_4$ 38.6%, $Bi_2O_3$ 27.1%, $WO_3$ 30.15%. However, in the case of applying low-temperature high-pressure molding in the future, it is expected that the radiation shielding capability can be sufficiently improved by reducing the porosity while increasing the filling factor.

Discharge Characteristics of Large-Area High-Power RF Ion Source for Neutral Beam Injector on Fusion Devices

  • Chang, Doo-Hee;Park, Min;Jeong, Seung Ho;Kim, Tae-Seong;Lee, Kwang Won;In, Sang Ryul
    • Proceedings of the Korean Vacuum Society Conference
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    • 2014.02a
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    • pp.241.1-241.1
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    • 2014
  • The large-area high-power radio-frequency (RF) driven ion sources based on the negative hydrogen (deuterium) ion beam extraction are the major components of neutral beam injection (NBI) systems in future large-scale fusion devices such as an ITER and DEMO. Positive hydrogen (deuterium) RF ion sources were the major components of the second NBI system on ASDEX-U tokamak. A test large-area high-power RF ion source (LAHP-RaFIS) has been developed for steady-state operation at the Korea Atomic Energy Research Institute (KAERI) to extract the positive ions, which can be used for the NBI heating and current drive systems in the present fusion devices, and to extract the negative ions for negative ion-based plasma heating and for future fusion devices such as a Fusion Neutron Source and Korea-DEMO. The test RF ion source consists of a driver region, including a helical antenna and a discharge chamber, and an expansion region. RF power can be transferred at up to 10 kW with a fixed frequency of 2 MHz through an optimized RF matching system. An actively water-cooled Faraday shield is located inside the driver region of the ion source for the stable and steady-state operations of RF discharge. The characteristics and uniformities of the plasma parameter in the RF ion source were measured at the lowest area of the expansion bucket using two RF-compensated electrostatic probes along the direction of the short- and long-dimensions of the expansion region. The plasma parameters in the expansion region were characterized by the variation of loaded RF power (voltage) and filling gas pressure.

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