• Applied Microscopy
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• v.39 no.4
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• pp.349-354
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• 2009

In this paper we have constructed three dimensional images and examined structural failure on thin film transistor (TFT) liquid crystal display (LCD) by using dual-beam focused ion beam (FIB) and IMOD software. Specimen was sectioned with dual-beam focused ion beam. Series of two dimensional images were obtained by scanning electron microscopy. Three dimensional reconstruction was constructed from them by using IMOD software. The short defect between Gate layer and Data layer was found from the result of three dimensional reconstruction. That phenomena made the function of the gate lost and data signal supplied to the electrode though the Drain continuously. That signal made continuous line defect. The result of the three dimensional reconstruction, serial section, SEM imaging by using the FIB will be the foundation of the next advanced study.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.16 no.5 s.96
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• pp.465-471
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• 2005

A method of calculation fur propagating and focusing of focused beams generated in antenna arrays, using BPM(Beam Propagation Method), is presented in this paper. Based on the diffraction theory, the beam focusing and Propagation is studied specially for the case of the antenna way fed by the Rotman lens that is able to focus microwave power on its focal arc or generate multiple beams. There are difficulties in performing a full-wave simulation using a commercial EM simulation tool for propagating and focusing of beams because of the structural complexity and the feeding assignment of the antenna array. Therefore, as an alternative solution, the BPM is presented to calculate the beam propagation from the aperture-type antennas. From the point of view of optics, the propagations of the lens have been simplified from the Fresnel diffraction integral to the Fourier transform. Using Fourier Transform, a beam propagation method is developed to show improvement of the resolution by controlling the wavefront of wave Propagating from an aperture-type antenna array. The beam width(or spot size) and the intensity are calculated for a focused beam propagating from an array having $10\lambda$ of its size. For the beams with $20\lambda,\;30\lambda$, and $50\lambda$ of geometrical focal length, the half-power beam widths(or spot size) are about 1.1\lambda,\;1.3\lambda,\;and\;1.9\lambda$ respectively.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2004.04a
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• pp.490-493
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• 2004

There is great difficulty in machine below 10 micrometers by conventional machining methods, such as micro-EDM. However, ultra micro machining using focused ion beam(FIB) is able to machine to 50 nanometers. Bie ＆ moulds techniques are better than one-to-one machining techniques in regards to production costs in the mass production of ultra size structures. Also, it is advantageous to machine die ＆ moulds to the 10 micrometers level by FIB technique rather than other techniques. It is difficult to machine the three dimensional machining, such as micro lens, using FIB system because of their machining characteristics. In this paper, three dimensional machining techniques were properly introduced, and also experiments showed effectiveness of their techniques.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2004.04a
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• pp.482-486
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• 2004

The application of focused ion beam (FIB) technology in micro/nano machining has become increasingly popular. Its use in micro/nano machining has advantages over contemporary photolithography or other micro/nano machining technologies, such as small feature resolution, the ability to process without masks and being accommodating for a variety of materials and geometries. This paper presents that the recent development and our research goals in FIB nano machining technology are given. The emphasis will be on direct milling, or chemical vapor deposition techniques (CVD), and this can distinguish the FIB technology from the contemporary photolithography process and provide a vital alternative to it. After an introduction to the technology and its FIB principles, the recent developments in using milling or deposition techniques for making various high-quality devices and high-precision components at the micro/nano meter scale are examined and discussed. Finally, conclusions are presented to summarize the recent work and to suggest the areas for improving the FIB milling technology and for studying our future research.

• Journal of the Korean Society for Precision Engineering
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• v.28 no.2
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• pp.245-250
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• 2011

A high-resolution shadow mask, a nanostencil, is widely used for high resolution lithography. This high-resolution shadowmask is often fabricated by a combination of MEMS processes and focused ion beam (FIB) milling. In this study, FIB milling on 500-nm-thin SiN membrane was tested and characterized. 500 nm thick and $2{\times}2$ mm large membranes were made on a silicon wafer by micro-fabrication processes of LPCVD, photolithography, ICP etching and bulk silicon etching. A subsequent FIB milling enabled local membrane thinning and aperture making into the thinned silicon nitride membrane. Due to the high resolution of the FIB milling process, nanoscale apertures down to 60 nm could be made into the membrane. The nanostencil could be used for nanoscale patterning by local deposition through the apertures.

• Tribology and Lubricants
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• v.26 no.2
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• pp.122-128
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• 2010

Focused Ion Beam (FIB) has been used for site-specific TEM sample preparation and small scale fabrication. Moreover, analysis on the surface microstructure and phase distribution is possible by ion channeling contrast of FIB with high resolution. This paper describes FIB applications and deformed surface structure induced by sliding. The effect of FIB process on the surface damage was explored as well. The sliding experiments were conducted using high purity aluminum and OFHC(Oxygen-Free High Conductivity) copper. The counterpart material was steel. Pin-on-disk, Rotational Barrel Gas Gun and Explosively Driven Friction Tester were used for the sliding experiments in order to investigate the velocity effect on the microstructural change. From the FIB analysis, it is revealed that ion channeling contrast of FIB has better resolution than SEM and the tribolayer is composed of nanocrystalline structures. And the thickness of tribolayer was constant regardless of sliding velocities.

• Nuclear Engineering and Technology
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• v.50 no.2
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• pp.259-267
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• 2018

Focused ion beam-scanning electron microscope and electron backscattered diffraction examinations were conducted in the center of a $73\;GWd/t_U\;UO_2$ fuel. They showed the formation of subdomains within the initial grains. The local crystal orientations in these domains were close to that of the original grain. Most of the fission gas bubbles were located on the boundaries. Their shapes were far from spherical and far from lenticular. No interlinked bubble network was found. These observations shed light on previous unexplained observations. They plead for a revision of the classical description of fission gas release mechanisms for the center of high burn-up $UO_2$. Yet, complementary detailed observations are needed to better understand the mechanisms involved.

• Applied Science and Convergence Technology
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• v.25 no.5
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• pp.92-97
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• 2016

Surface erosion using focused ion beam irradiation is the most promising technology for the realization of micro/nanofabrication. However, accurate fabrication of predefined structures is still challenging. This article introduces a single step surface driving method to fabricated predefined curved structures. The previously reported multi step surface driving method (MSDM) has been modified so that a single ion dose profile can be used instead of multiple ion dose profiles. Experimental realization of the method is presented with the fabrication of predefined curved surfaces as well as reference to surface propagation theory. For the purpose of verification, simulations are performed on the basis of a sound mathematical model.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.5 s.170
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• pp.175-180
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• 2005

The application of focused ion beam (FIB) technology in micro/nano machining has become increasingly popular. Its use in micro/nano machining has advantages over contemporary photolithography or other micro/nano machining technologies such as small feature resolution, the ability to process without masks and being accommodating for a variety of materials and geometries. In this research, fabrication of micro plasma electrode was carried out using FIB. The one of problems of FIB-sputtering is the redeposition of material including Ga+ ion source during sputtering process. Therefore the effect of the redeposition was verified by EDX. And the micro plasma electrode of copper was fabricated by FIB.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.326-329
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• 2005

As a flexible method to fabricate sub-micrometer patterns, Focused Ion Beam (FIB) instrument and Self-Assembled Monolayer (SAM) resist are introduced in this work. FIB instrument is known to be a very precise processing machine that is able to fabricate micro-scale structures or patterns, and SAM is known as a good etch resistance resist material. If SAM is applied as a resist in FIB processing fur fabricating nano-scale patterns, there will be much benefit. For instance, low energy ion beam is only needed for machining SAM material selectively, since ultra thin SAM is very sensitive to $Ga^+$ ion beam irradiation. Also, minimized beam spot radius (sub-tens nanometer) can be applied to FIB processing. With the ultimate goal of optimizing nano-scale pattern fabrication process, interaction between SAM coated specimen and $Ga^+$ ion dose during FIB processing was observed. From the experimental results, adequate ion dose for machining SAM material was identified.