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Development of Micro Plasma Electrode using Focused Ion Beam  

Choi Hon-Zong (한국생산기술연구원 나노가공팀)
Kang Eun-Goo (한국생산기술연구원 나노가공팀)
Lee Seok-Woo (한국생산기술연구원 나노가공팀)
Hong Won-Pyo (한국생산기술연구원 나노가공팀)
Publication Information
Journal of the Korean Society for Precision Engineering / v.22, no.5, 2005 , pp. 175-180 More about this Journal
Abstract
The application of focused ion beam (FIB) technology in micro/nano machining has become increasingly popular. Its use in micro/nano machining has advantages over contemporary photolithography or other micro/nano machining technologies such as small feature resolution, the ability to process without masks and being accommodating for a variety of materials and geometries. In this research, fabrication of micro plasma electrode was carried out using FIB. The one of problems of FIB-sputtering is the redeposition of material including Ga+ ion source during sputtering process. Therefore the effect of the redeposition was verified by EDX. And the micro plasma electrode of copper was fabricated by FIB.
Keywords
Micro plasma electrode; FIB(Focused Ion Beam); Nano machining technology; Sputtering;
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  • Reference
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