• 센서학회지
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• 제31권3호
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• pp.145-150
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• 2022

The importance of flexible polymer-based pressure sensors is growing in fields like healthcare monitoring, tactile recognition, gesture recognition, human-machine interface, and robot skin. In particular, health monitoring and tactile devices require high sensor sensitivity. Researchers have worked on sensor material and structure to achieve high sensitivity. A simple and effective method has been to employ three-dimensional pressure sensors. Three-dimensional (3D) structures dramatically increase sensor sensitivity by achieving larger local deformations for the same pressure. In this paper, the performance, manufacturing method, material, and structure of high-sensitivity flexible pressure sensors based on 3D structures, are reviewed.

• 정보처리학회논문지:소프트웨어 및 데이터공학
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• 제9권1호
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• pp.1-10
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• 2020

유동적으로 변화하는 환경에서 사용자의 요구에 따라 서비스를 제공하는 서비스 로봇은 클라우드 서비스와 같은 외부 서비스를 이용할 수 있어야 한다. 그러나 클라우드 서비스는 지속해서 변화하고 확장되므로 서비스의 기능 및 데이터 변경에 적응할 수 있는 일반적이고 유연한 인터페이스가 필요하다. 이를 위해 다양한 클라우드 서비스에 대한 모델 기반의 일반적인 인터페이스를 활용하여야 한다. 이러한 접근 방법을 통해 변경된 서비스에 접근할 수 있는 표준 서비스 프로파일을 정의함으로써 일반적이고 확장 가능한 인터페이스를 구현하였다. 또한, 지능형 서비스 로봇을 활용한 실험을 통해 새로운, 혹은 변경된 외부 서비스에 대해 유연하게 적응하는 결과를 검증하였다.

• Journal of Welding and Joining
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• 제31권3호
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• pp.4-10
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• 2013

In electronic industry, the trend of future electronics will be flexible, bendable, wearable electronics. Until now, there is few study on bonding technology and reliability of bonding joint between chip with micro solder bump and flexible substrate. In this study, we investigated joint properties of Si chip with eutectic Sn-58Bi solder bump on Cu pillar bump bonded on flexible substrate finished with ENIG by flip chip process. After flip chip bonding, we observed microstructure of bump joint by SEM and then evaluated properties of bump joint by die shear test, thermal shock test, and bending test. After thermal shock test, we observed that crack initiated between $Cu_6Sn_5IMC$ and Sn-Bi solder and then propagated within Sn-Bi solder and/or interface between IMC and solder. On the other hands, We observed that fracture propated at interface between Ni3Sn4 IMC and solder and/or in solder matrix after bending test.

• 마이크로전자및패키징학회지
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• 제31권1호
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• pp.7-15
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• 2024

유연신축성 전자 디바이스의 다기능화, 소형화 및 고출력화 추세에 따라 우수한 열 전달 특성을 갖춘 재료나 구조가 이슈로 부상하고 있다. 기존의 열계면 소재는 급격한 구부림, 비틀림, 신축 등을 겪어야 하는 유연신축성 전자 디바이스의 방열 요구성능을 충족시키지 못한다. 이러한 문제를 해결하기 위하여 높은 열전도성과 신축성을 동시에 갖는 열계면 소재 개발이 요구된다. 본 논문에서는 Liquid metal, Carbon, Ceramic 기반 신축성 열계면 소재의 연구동향을 살펴보고 열적, 기계적 특성 향상을 위한 효과적 전략을 알아보고자 한다.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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• pp.364-366
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• 2009

We successfully fabricated flexible electronic paper display (EPD) by using toner particles on plastic (PC) substrate. It has high resolution (WVGA : 800 ${\times}$ 480) and 7 inch diagonal viewable image size. The response time was about 0.25 msec at 90 V, a contrast ratio of about 2, a driving voltage of 60 V which we successfully demonstrated to display several images at.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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• pp.886-888
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• 2009

We fabricated flexible electronic paper display(EPD) by using toner particles on plastic (PC) substrate. We observed the relationship between contrast ratio and changes of rib structures. One is a fabrication of ribs on bottom substrate. The display with ribs on bottom substrate had higher contrast ratio about 46% than display with ribs on top substrate. The other is a change of density of rib. The less density of ribs fabricated, the higher the contrast ratio become.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.413-413
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• 2014

In this paper, we present a fabrication method of functionalized gold nanostructures on flexible substrate that can be implemented for plasmonic sensing application. For biomolecular sensing, many researchers exploit unconventional lithography method like nanoimprint lithography (NIP), contact transfer lithography, soft lithography, colloidal transfer printing due to its usability and easy to functionalization. In particular, nanoimprint and contact transfer lithography need to have anti-adhesion layer for distinctive metallic properties on the flexible substrates. However, when metallic thin film was deposited on the anti-adhesion layer coated substrates, we discover much aggravation of the mold by repetitive use. Thus it would be impossible to get a high quality of metal nanostructure on the transferred substrate for developing flexible electronics based transfer printing. Here we demonstrate a method for nano-pillar mold and transfer the controllable nanoparticle array on the flexible substrates without an anti-adhesion layer. Also functionalization of gold was investigated by the different length of thiol applied for effectively localized surface plasmonic resonance sensing. First, a focused ion beam (FIB) and ICP-RIE are used to fabricate the nanoscale pillar array. Then gold metal layer is deposited onto the patterned nanostructure. The metallic 130 nm and 250 nm nanodisk pattern are transferred onto flexible polymer substrate by bi-layer functionalized contact imprinting which can be tunable surface energy interfaces. Different thiol reagents such as Thioglycolic acid (98%), 3-Mercaptopropionic acid (99%), 11-Mercaptoundecanoic acid (95%) and 16-Mercaptohexadecanoic acid (90%) are used. Overcoming the repeatedly usage of the anti-adhesion layer mold which has less uniformity and not washable interface, contact printing method using bi-layer gold array are not only expedient access to fabrication but also have distinctive properties including anti-adhesion layer free, functionalized bottom of the gold nano disk, repeatedly replicate the pattern on the flexible substrate. As a result we demonstrate the feasibility of flexible plasmonic sensing interface and anticipate that the method can be extended to variable application including the portable bio sensor via mass production of stable nanostructure array and other nanophotonic application.

• 한국디자인학회:학술대회논문집
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• 한국디자인학회 2005년도 춘계 학술발표대회 논문집
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• pp.276-277
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• 2005

• KIEAE Journal
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• 제8권3호
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• pp.37-42
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• 2008

The purpose of this study was to comprehend specific characteristic of interface and present the standardized interface of Long Life Housing, which could be obtained by the total and various approaches. With this in mind we analyzed related studies of interface through previous studies, and based on the analysis we created standardized factors of categorization in view of characteristic of interface. Using these factors, we can determine whether the interface could be used systematically in Long Life Housing. And as these were presented in the form of Key Map for expedite the synthetic understanding of interface, we could easily reconize types of interface. Especially, we only dealt the wall of flexible interface of Long Life Housing. Throughout systemizing and standardizing works, we can expedite the understanding of interface of Long Life Housing and finally, we want to make basic data used for date base of interface which can be available for Long Life Housing.

• 세라미스트
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• 제21권1호
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• pp.4-11
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• 2018

Display is an essence in human-machine communication interface. As mobile environment such as internet of things (IOT) and Artificial Intelligence (AI) progress, importance of display increases. Here we review research trend in flexible organic light emitting displays (OLEDs). This review article covers all the components consisting of flexible OELDs and shows direction of the recent research. This paper would be helpful for readers and researchers working in this field and provide perspective for future displays.