• Title/Summary/Keyword: Flexible TFTs

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Effects of thickness of GIZO active layer on device performance in oxide thin-film-transistors

  • Woo, C.H.;Jang, G.J.;Kim, Y.H.;Kong, B.H.;Cho, H.K.
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.06a
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    • pp.137-137
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    • 2009
  • Thin-film transistors (TFTs) that can be prepared at low temperatures have attracted much attention due to the great potential for flexible electronics. One of the mainstreams in this field is the use of organic semiconductors such as pentacene. But device performance of the organic TFTs is still limited by low field effect mobility or rapidly degraded after exposing to air in many cases. Another approach is amorphous oxide semiconductors. Amorphous oxide semiconductors (AOSs) have exactly attracted considerable attention because AOSs were fabricated at room temperature and used lots of application such as flexible display, electronic paper, large solar cells. Among the various AOSs, a-IGZO was considerable material because it has high mobility and uniform surface and good transparent. The high mobility is attributed to the result of the overlap of spherical s-orbital of the heavy pest-transition metal cations. This study is demonstrated the effect of thickness channel layer from 30nm to 200nm. when the thickness was increased, turn on voltage and subthreshold swing were decreased. a-IGZO TFTs have used a shadow mask to deposit channel and source/drain(S/D). a-IGZO were deposited on SiO2 wafer by rf magnetron sputtering. using power is 150W, working pressure is 3m Torr, and an O2/Ar(2/28 SCCM) atmosphere at room temperature. The electrodes were formed with Electron-beam evaporated Ti(30nm) and Au(70nm) structure. Finally, Al(150nm) as a gate metal was evaporated. TFT devices were heat treated in a furnace at $250^{\circ}C$ in nitrogen atmosphere for an hour. The electrical properties of the TFTs were measured using a probe-station to measure I-V characteristic. TFT whose thickness was 150nm exhibits a good subthreshold swing(S) of 0.72 V/decade and high on-off ratio of 1E+08. Field effect mobility, saturation effect mobility, and threshold voltage were evaluated 7.2, 5.8, 8V respectively.

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Wide-QQVGA Flexible Full-Color Active-Matrix OLED Display with an Organic TFT Backplane

  • Nakajima, Yoshiki;Takei, Tatsuya;Tsuzuki, Toshimitsu;Suzuki, Mitsunori;Fukagawa, Hirohiko;Fujisaki, Yoshihide;Yamamoto, Toshihiro;Kikuchi, Hiroshi;Tokito, Shizuo
    • 한국정보디스플레이학회:학술대회논문집
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    • 2008.10a
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    • pp.189-192
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    • 2008
  • A 5.8-inch wide-QQVGA flexible full-color active-matrix OLED display was fabricated on a plastic substrate. Low-voltage-operation organic TFTs and high-efficiency phosphorescent OLEDs were used as the backplane and emissive pixels, respectively. The fabricated display clearly showed color moving images when the driving voltage was below 15 V.

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Design and Fabrication of Flexible OTFTs by using Nanocantact Printing Process (미세접촉프린팅 공정을 이용한 유연성 유기박막소자(OTFT)설계 및 제작)

  • Jo Jeong-Dai;Kim Kwang-Young;Lee Eung-Sug;Choi Byung-Oh;Esashi Masayoshi
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.10a
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    • pp.506-508
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    • 2005
  • In general, organic TFTs are comprised of four components: gate electrode, gate dielectric, organic active semiconductor layer, and source and drain contacts. The TFT current, in turn, is typically determined by channel length and width, carrier field effect mobility, gate dielectric thickness and permittivity, contact resistance, and biasing conditions. More recently, a number of techniques and processes have been introduced to the fabrication of OTFT circuits and displays that aim specifically at reduced fabrication cost. These include microcontact printing for the patterning of metals and dielectrics, the use of photochemically patterned insulating and conducting films, and inkjet printing for the selective deposition of contacts and interconnect pattern. In the fabrication of organic TFTs, microcontact printing has been used to pattern gate electrodes, gate dielectrics, and source and drain contacts with sufficient yield to allow the fabrication of transistors. We were fabricated a pentacene OTFTs on flexible PEN film. Au/Cr was used for the gate electrode, parylene-c was deposited as the gate dielectric, and Au/Cr was chosen for the source and drain contacts; were all deposited by ion-beam sputtering and patterned by microcontact printing and lift-off process. Prior to the deposition of the organic active layer, the gate dielectric surface was treated with octadecyltrichlorosilane(OTS) from the vapor phase. To complete the device, pentacene was deposited by thermal evaporation and patterned using a parylene-c layer. The device was shown that the carrier field effect mobility, the threshold voltage, the subthreshold slope, and the on/off current ratio were improved.

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Investigation of Low-Temperature Processed Amorphous ZnO TFTs Using a Sol-Gel Method

  • Chae, Seong Won;Yun, Ho Jin;Yang, Seung Dong;Jeong, Jun Kyo;Park, Jung Hyun;Kim, Yu Jeong;Kim, Hyo Jin;Lee, Ga-Won
    • Transactions on Electrical and Electronic Materials
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    • v.18 no.3
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    • pp.155-158
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    • 2017
  • In this paper, ZnO Thin Film Transistors (TFTs) were fabricated by a sol-gel method using a low-temperature process, and their physical and electrical characteristics were analyzed. To lower the process temperature to $200^{\circ}C$, we used a zinc nitrate hydrate ($Zn(NO_3)_2{\cdot}xH_2O$) precursor. Thermo Gravimetric Analyzer (TGA) analysis showed that the zinc nitrate hydrate precursor solution had 1.5% residual organics, much less than the 6.5% of zinc acetate dihydrate at $200^{\circ}C$. In the sol-gel method, organic materials in the precursor disrupt formation of a high-quality film, and high-temperature annealing is needed to remove the organic residuals, which implies that, by using zinc nitrate hydrate, ZnO devices can be fabricated at a much lower temperature. Using an X-Ray Diffractometer (XRD) and an X-ray Photoelectron Spectrometer (XPS), $200^{\circ}C$ annealed ZnO film with zinc nitrate hydrate (ZnO (N)) was found to have an amorphous phase and much more oxygen vacancy ($V_o$) than Zn-O bonds. Despite no crystallinity, the ZnO (N) had conductance comparable to that of ZnO with zinc acetate dihydrate (ZnO (A)) annealed at $500^{\circ}C$ as in TFTs. These results show that sol-gel could be made a potent process for low-cost and flexible device applications by optimizing the precursors.

Fabrication of thin Film Transistor on Plastic Substrate for Application to Flexible Display (Flexible 디스플레이로의 응용을 위한 플라스틱 기판 위의 박막트랜지스터의 제조)

  • 배성찬;오순택;최시영
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.40 no.7
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    • pp.481-485
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    • 2003
  • Amorphous silicon (a-Si:H) based TFT process has been studied at the maximum temperature of 15$0^{\circ}C$ with 25${\mu}{\textrm}{m}$ thick flexible and adhesive tape type polyimide foil substrate, which has benefit on handling a rugged, flexible plastic substrate trough sticking simply it to glass. This paper summarize the process procedure of the TFT on the plastic substrate and shows its electrical characteristics in comparison with glass substrate using primarily the ON/OFF current ratio and the field effect mobility as the quality criterion. The a-SiN:H coating layer played an important role in decreasing surface roughness of plastic substrate, so leakage current of TFT was decreased and mobility was increased. The results show that high quality a-Si:H TFTs can be fabricated on the plastic substrates through coating a rough plastic surface with a-SiN:H.

Printed organic transistors for large-area electronics

  • Someya, Takao;Sakurai, Takayasu;Sekitani, Tsuyoshi
    • 한국정보디스플레이학회:학술대회논문집
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    • 2006.08a
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    • pp.205-208
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    • 2006
  • We report the recent progress and future prospects of flexible, large-area sensors and actuator using organic thin-film transistors (TFTs). In particular, we describe printing technologies to manufacture electronic artificial skins (e-skins) for robots, sheet image scanners suitable for mobile applications, and Braille sheet display with plastic actuator arrays. We also present recent progress of reliability and stability issues.

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Possibility of Si TFT Technology

  • Noguchi, Takashi
    • 한국정보디스플레이학회:학술대회논문집
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    • 2002.08a
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    • pp.31-33
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    • 2002
  • Si TFTs are applied not only to stacked SRAM but also to FPD. Improvement of device characteristic such as an enhancement of carrier mobility or a reduction of leakage current is studied intensively. The TFT technology is developing based on conventional Si LSI technology. By establishing a stable fabrication process on flexible substrate and high performance characteristic uniformly and reliably, TFT technology has a possibility to develop to SOP or other highly functional applications similar to or beyond the conventional Si LSI in the era of information and telecommunication.

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Non volatile memory device using mobile proton in gate insulator by hydrogen neutral beam treatment

  • Yun, Jang-Won;Jang, Jin-Nyeong;Hong, Mun-Pyo
    • Proceedings of the Korean Vacuum Society Conference
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    • 2015.08a
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    • pp.192.1-192.1
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    • 2015
  • We demonstrated the nonvolatile memory functionality of nano-crystalline silicon (nc-Si) and InGaZnOxide (IGZO) thin film transistors (TFTs) using mobile protons that are generated by very short time hydrogen neutral beam (H-NB) treatment in gate insulator (SiO2). The whole memory fabrication process kept under $50^{\circ}C$ (except SiO2 deposition process; $300^{\circ}C$). These devices exhibited reproducible hysteresis, reversible switching, and nonvolatile memory behaviors in comparison with those of the conventional FET devices. We also executed hydrogen treatment in order to figure out the difference of mobile proton generation between PECVD and H-NB CVD that we modified. Our study will further provide a vision of creating memory functionality and incorporating proton-based storage elements onto a probability of next generation flexible memorable electronics such as low power consumption flexible display panel.

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Printed Polymer and a-Si TFT Backplanes for Flexible Displays

  • Street, R.A.;Wong, W.S.;Ready, S.E.;Chabinyc, M.L.;Arias, A.C.;Daniel, J.H.;Apte, R.B.;Salleo, A.;Lujan, R.;Ong, Beng;Wu, Yiliang
    • Journal of Information Display
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    • v.6 no.3
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    • pp.12-17
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    • 2005
  • The need for low cost, flexible, thin film transistor (TFT) display backplanes has focused attention on new processing techniques and materials. We report the development of TFT backplane technology based entirely on jet-printing, using a combination of additive and subtractive processing, to print active materials or etch masks. The technique eliminates the use of photolithography and has the potential to reduce the array manufacturing cost. The printing technique is demonstrated with both amorphous silicon and polymer semiconductor TFT arrays, and we show results of small prototype displays.

Roll-to-Roll Fabrication of Active-Matrix Backplanes Using Self-Aligned Imprint Lithography (SAIL)

  • Kim, Han-Jun;Almanza-Workman, Marcia;Chaiken, Alison;Jackson, Warren;Jeans, Albert;Kwon, Oh-Seung;Luo, Hao;Mei, Ping;Perlov, Craig;Taussig, Carl;Jeffrey, Frank;Braymen, Steve;Hauschildt, Jason
    • 한국정보디스플레이학회:학술대회논문집
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    • 2006.08a
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    • pp.1539-1543
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    • 2006
  • We have developed self-aligned imprint lithography (SAIL) technology, an innovative method for roll-to-roll (R2R) fabrication of electronic devices on flexible plastic substrates. In this paper, we present the first R2R-produced ${\alpha}$-Si TFTs built on a polyimide substrate using the SAIL process, and prove the feasibility of this technology to enable R2R fabrication of flexible display active matrix (AM) backplanes with high precision and throughput.

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