• Journal of Information Display
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• 제12권2호
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• pp.109-113
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• 2011

This paper summarizes the recent fabrication and characterizations of flexible high-speed radio frequency (RF) transistors, PIN-diode single-pole single-throw switches, as well as flexible inductors and capacitors, based on single-crystalline Si nanomembranes transferred on polyethylene terephthalate substrates. Flexible thin-film transistors (TFTs) on plastic substrates have reached RF operation speed with a record cut-off/maximum oscillation frequency ($f_T/f_{max}$) values of 3.8/12 GHz. PIN diode switches exhibit excellent ON/OFF behaviors at high RF frequencies. Flexible inductors and capacitors compatible with high-speed TFT fabrication show resonance frequencies ($f_{res}$) up to 9.1 and 13.5 GHz, respectively. Robust mechanical characteristics were also demonstrated with these high-frequency passives components.

• Electronic Materials Letters
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• 제14권6호
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• pp.657-668
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• 2018

Organic-inorganic hybrid lead halide perovskites have been extensively investigated for various optoelectronic applications. Particularly, owing to their ability to form highly crystalline and homogeneous films utilizing low-temperature solution processes (< $150^{\circ}C$), perovskites have become promising photoactive materials for realizing high-performance flexible solar cells. However, the current use of mesoporous $TiO_2$ scaff olds, which require high-temperature sintering processes (> $400^{\circ}C$), has limited the fabrication of perovskite solar cells on flexible substrates. Therefore, the development of a low-temperature processable charge-transporting layer has emerged as an urgent task for achieving flexible perovskite solar cells. This review summarizes the recent progress in low-temperature processable electron- and hole-transporting layer materials, which contribute to improved device performance in flexible perovskite solar cells.

• 마이크로전자및패키징학회지
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• 제29권2호
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• pp.33-41
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• 2022

최근 플렉시블 전자소자의 안정적인 전기적 연결을 위한 유연전도성 접합 기술의 연구 필요성이 대두되고 있다. 기존의 금속 납땜 접합에서 발생하는 기계적 파손 문제는 탄성 계수가 작거나 두께가 얇은 재료를 기반으로 제작된 유연전도성 접합을 통해 해결할 수 있다. 기계적 특성을 향상시키는 동시에 안정적인 전기적 연결이 가능하도록 높은 전기전도도를 가진 물질을 박막화하거나, 작은 탄성 계수를 가진 물질에 혼합하는 방식 등으로 형성된다. 대표적인 유연전도성 접합 기술로는 박막 증착을 통한 유연전도성 접합, 유연 전도성 접착제 기반 접합, 그리고 액체 금속 기반의 전도성 접합 형성 방법 등이 있으며 본 논문에서는 각 방법들의 기계적/전기적 특성 향상 전략과 그 쓰임을 소개한다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.470-470
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• 2013

Recently, active materials such as amorphous silicon (a-Si), poly crystalline silicon (poly-Si), transition metal oxide semiconductors (TMO), and organic semiconductors have been demonstrated for flexible electronics. In order to apply flexible devices on the polymer substrates, all layers should require the characteristic of flexibility as well as the low temperature process. Especially, pentacene thin film transistors (TFTs) have been investigated for probable use in low-cost, large-area, flexible electronic applications such as radio frequency identification (RFID) tags, smart cards, display backplane driver circuits, and sensors. Since pentacene TFTs were studied, their electrical characteristics with varying single variable such as strain, humidity, and temperature have been reported by various groups, which must preferentially be performed in the flexible electronics. For example, the channel mobility of pentacene organic TFTs mainly led to change in device performance under mechanical deformation. While some electrical characteristics like carrier mobility and concentration of organic TFTs were significantly changed at the different temperature. However, there is no study concerning multivariable. Devices actually worked in many different kinds of the environment such as thermal, light, mechanical bending, humidity and various gases. For commercialization, not fewer than two variables of mechanism analysis have to be investigated. Analyzing the phenomenon of shifted characteristics under the change of multivariable may be able to be the importance with developing improved dielectric and encapsulation layer materials. In this study, we have fabricated flexible pentacene TFTs on polymer substrates and observed electrical characteristics of pentacene TFTs exposed to tensile and compressive strains at the different values of temperature like room temperature (RT), 40, 50, $60^{\circ}C$. Effects of bending and heating on the device performance of pentacene TFT will be discussed in detail.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.178-178
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• 2009

전자제품의 고속화, 고집적화, 고성능이 요구되어짐에 따라 IC's 성능 향상을 통해 패키징 기술의 소형화를 필요로 하고 있어 소재나 칩 부품을 이용해 커패시터나 저항을 구현하여 내장시키는 임베디드 패시브 기술에 대한 연구가 많이 진행되어 지고 있다. 본 연구에서는 3D 패키징이 가능한 flexible 소재에 능, 수동 소자를 내장하기 위한 다층 flexible 기판 공정 기술에 대한 연구를 수행하였다. 기판제작을 위해 flexible 소재에 미세 형성이 가능한 폴리머 필름을 접착하였고 flexible 위에 후막 저항체 패턴을 퍼|이스트를 이용하여 형성하였다. 또한, 능동소자 내장을 위해 test chip을 제작하여 플립칩 본더를 이용해 flexible 기판에 접합한 후에 bonding film을 이용한 build up 공정을 통해 via를 형성하고 무전해 도금 공정을 거쳐 전기적인 연결을 하였다. 위의 공정을 통해 앓고 가벼울 뿐만 아니라 자유롭게 구부러지는 특성을 갖고 있는 능, 수동 소자 내장형 flexible 기판의 변형에 따른 전기적 특성을 평가하였다.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2004년도 ICCAS
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• pp.1136-1141
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• 2004

This paper presents a control method for time-delay systems and verifies the performance of the designed control system via real experiments. Specifically, the control method is applied to a flexible-link system with time delays. The method combines time- and frequency-domain controllers: linear quadratic optimal controller (or LQR) and lag compensator. The LQR is used to stabilize the system in optimal fashion, whereas the lag compensator is used to compensate time-delay effects by increasing the delay margin of the system. With this methodology, the maximum allowable time delay can be increased significantly. The proposed method is simple but quite practical for time-delay system control as it is based on the conventional loop-shaping method, which gives practical insights on delay-phase relationship. Simulation and experiment results show that the method presented in this paper is feasible and practical.

• 한국분말재료학회지
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• 제19권5호
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• pp.343-347
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• 2012

In this study, an oxygen plasma treatment was used as a low temperature debinding method to form a conductive copper feature on a flexible substrate using a direct printing process. To demonstrate this concept, conductive copper patterns were formed on polyimide films using a copper nanoparticle-based paste with polymeric binders and dispersing agents and a screen printing method. Thermal and oxygen plasma treatments were utilized to remove the polymeric vehicle before a sintering of copper nanoparticles. The effect of the debinding methods on the phase, microstructure and electrical conductivity of the screen-printed patterns was systematically investigated by FE-SEM, TGA, XRD and four-point probe analysis. The patterns formed using oxygen plasma debinding showed the well-developed microstructure and the superior electrical conductivity compared with those of using thermal debinding.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2010년도 하계학술대회 논문집
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• pp.187-187
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• 2010

현대의 전기전자 기술의 발전속도가 급격히 빨라짐에 따라서 디지털 전자기기는 많은 데이터와 빠른 전송속도가 요구되어지고 있으며 이로 인해 예상치 못한 고주파 노이즈 신호의 문제가 심각해지고 있다. 최근 디지털 전자기기 중 디스플레이 표시장치에서 구동전압 인가 시 발생하는 근역장 방사노이즈가 문제가 되고 있고, 정전용량방식 (Capacitive Overlay)Touch Pannel에서 터치 시 오작동을 일으키는 EL 면광원의 EMI(Electro-Magnetic Interference, 전자방해)가 본 연구에서 해결하고자 하는 문제이다. EL 면광원의 구동전압이 증가함에 따라서 Touch Panel에 인가되는 근역장 방사노이즈의 세기를 측정하였고 근역장 방사노이즈를 감쇄할 수 있는 Flexible한 자성복합시트에 대해서 연구하였다. EL Display Pannel에 Flexible한 자성 복합시트를 채용하여 Flexible Display 장비의 근역장 방사노이즈 감쇄에 효과가 있음을 확인하였다.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.I
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• pp.227-230
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• 2005

The concepts of flexible displays and plastic electronics have become some of the most talked about new product opportunities for direct view flat panel displays in recent years. The potential advantages are frequently cited, but the achievement of commercially viable products will require many significant technological innovations in new materials and manufacturing technology. This paper will provide a very broad overview of the rationale for developing flexible displays, the market drivers, the applicable display technologies, the major hurdles that must be overcome and the required evolution of new manufacturing technologies that are essential for successful commercialization. This is intended to provide the outline and context for the series of presentations on specific aspects in each of these topics that will be delivered and discussed at the Plastic Electronics Special Session of the 2005 IMID conference.

• 전자공학회논문지A
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• 제32A권2호
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• pp.140-150
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• 1995

A symbolic layout generator, called Flexible Module Generator (FMG), has been developed for transgorming a given CMOS circuit netlist into an optimized symbolic layout. Contrary to other conventional module generators which place transistors either in horizontal or in vertical direction, FMG places transittors in any hence can multiples of 90$^{\circ}$. This flexible layout style can maximize the diffusion sharing and hence can reduce the wire-length for both of area minimization and performance improvement. In FMG, transistors are initially randomly placed and then selected transistors are iteratively replaced using an optimization technique based on simulated evolution. Whenever a transistor is replaced, the affected nets are rerouted. Constraints on the shape, aspect ratio, and critical path delays are considered during the optimization process. Routing is performed by using a modified maze router on polysilicon, metal 1, and metal 2 interconnection layers. additional routing grids are added, if necessary, for complete routing. Unused rows or columns are removed after routing for area minimization. Experimental reasults show that FMG synthesizes satisfactory layouts.