Browse > Article
http://dx.doi.org/10.6117/kmeps.2022.29.2.033

Soft Interconnection Technologies in Flexible Electronics  

Lee, Woo-Jin (Department of Materials Science and Engineering, Seoul National University)
Lee, Seung-Min (Department of Materials Science and Engineering, Seoul National University)
Kang, Seung-Kyun (Department of Materials Science and Engineering, Seoul National University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.29, no.2, 2022 , pp. 33-41 More about this Journal
Abstract
Recent necessities of research have emerged about soft interconnection technologies for stable electric connections in flexible electronics. Mechanical failure in conventional metal solder interconnection can be solved as soft interconnections based on a small elastic modulus and a thin thickness. To enable stable electric connection while improving mechanical properties, highly conductive materials be thinned or mixed with a material that has a small elastic modulus. Representative soft interconnection technologies such as thin-film metallization, flexible conductive adhesives, and liquid metal interconnections are presented in this paper, and be focused on mechanical/electric properties improving strategies and their applications.
Keywords
Soft interconnections; Flexible electronics; Thin-film metallization; Flexible conductive adhesives; Liquid metal interconnections;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
연도 인용수 순위
1 C. Kwon, D. Seong, J. Ha, D. Chun, J. H. Bae, K. Yoon, M. Lee, J. W, C. W, S. Lee, Y. M, K. I. J, D. S, T. Lee, "Self-Bondable and Stretchable Conductive Composite Fibers with Spatially Controlled Percolated Ag Nanoparticle Networks: Novel Integration Strategy for Wearable Electronics", Advanced Functional Materials, 30(49), 2005447 (2020).   DOI
2 Y. Yin, O. Yamada, K. Tanaka, K. I. Okamoto, "On the Development of Naphthalene-Based Sulfonated Polyimide Membranes for Fuel Cell Applications", Polymer Journal, 38, 197-219 (2006).   DOI
3 P. Vijayan P., D. Puglia, M. A. S. A. Al-Maadeed, J. M. Kenny, S. Thomas, "Elastomer/thermoplastic modified epoxy nanocomposites: The hybrid effect of 'micro' and 'nano' scale", Materials Science and Engineering: R: Reports, 116, 1-29 (2017).   DOI
4 J. Oh, K. Lee, T. Hughes, S. Forrest, K. Sarabandi, "Flexible Antenna Integrated with an Epitaxial Lift-Off Solar Cell Array for Flapping-Wing Robots", IEEE Transactions on Antennas and Propagation, 62(8), 4356-4361 (2014).   DOI
5 T. Fukushima, Y. Susumago, H. Kino, T. Tanaka, A. Alam, A. Hanna, S. S. Iyer, "Process Integration for FlexTrateTM", 2018 International Flexible Electronics Technology Conference (IFETC), 1-2 (2018).
6 Y. J. Fu, H. Z. Qui, K. S. Liao, S. J. Lue, C. C. Hu, K. R. Lee, J. Y. Lai, "Effect of UV-Ozone Treatment on Poly(dimethylsiloxane) Membranes: Surface Characterization and Gas Separation Performance", Langmuir, 26(6), 4392-4399 (2010).   DOI
7 X. Liu, G. Gao, L. Dong, G. Ye, Y. Gu, "Correlation between hydrogen-bonding interaction and mechanical properties of polyimide fibers", Polymers for Advanced Technologies, 20(4), 362-366 (2009).   DOI
8 M. V. C. Morais, A. I. Oliva-Aviles, M. A. S. Matos, V. L. Tagarielli, S. T. Pinho, C. Hubner, F. Henning, "On the effect of electric field application during the curing process on the electrical conductivity of single-walled carbon nanotubes-epoxy composites", Carbon, 150, 153-167 (2019).   DOI
9 M. J. Kim, Y. S. Cho, Y. D. Huh, "Synthesis of Silver Nanowires by Reduction of Silver-Pyridine Complexes", Bulletin of the Korean Chemical Society, 33(5), 1762-1764 (2012).   DOI
10 W. J. Plumbridge, "Solders in electronics", Journal of Materials Science", 31, 2501-2514 (1996).   DOI
11 D. W. K. Eikelboom, J. H. Bultman, A. Schonecker, M. H. H. Meuwissen, M. A. J. C. van den Nieuwenhof, D. L. Meier, "Conductive adhesives for low-stress interconnection of thin back-contact solar cells", Conference Record of the Twenty-Ninth IEEE Photovoltaic Specialists Conference, 2002., 403-406 (2002)
12 A. Z. Moshfegh, "PVD Growth Method: Physics and Technology", Physics and Technology of Thin Films, 28-53 (2004).
13 F. Awaja, M. Gilbert, G. Kelly, B. Fox, P. J. Pigram, "Adhesion of polymers", Progress in Polymer Science, 34 (9), 948- 968 (2009).   DOI
14 V. M. Graubner, R. Jordan, O. Nuyken, B. Schnyder, T. Lippert, R. Kotz, A. Wokaun, "Photochemical modification of cross-linked poly (dimethylsiloxane) by irradiation at 172 nm", Macromolecules, 37(16), 5936-5943 (2004).   DOI
15 S. H. Kim, S. Yang, "Low Melting Temperature Solder Materials for Use in Flexible Microelectronic Packaging Applications", Recent Progress in Soldering Materials, 7-37 (2017).
16 A. O. Ogunjimi, O. Boyle, D. C. Whalley, D. J. Williams, "A review of the impact of conductive adhesive technology on interconnection", Journal of Electronics Manufacturing, 2(3), 109-118 (1992).   DOI
17 Y. Fu, M. Willander, J. Liu, "Spatial distribution of metal fillers in isotropically conductive adhesives", Journal of Electronic Materials, 30, 866-871 (2001).   DOI
18 Y. R. Jang, R. Jeong, H. S. Kim, S. S. Park, "Fabrication of solderable intense pulsed light sintered hybrid copper for flexible conductive electrodes", Scientific reports, 11, 14551 (2021).   DOI
19 T. Fukushima, A. Alam, Z. Wan, S. C. Jangam, S. Pal, G. Ezhilarasu, A. Bajwa, S. S. Iyer, "FlexTrateTM"-Scaled Heterogeneous Integration on Flexible Biocompatible Substrates Using FOWLP", 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 649-654 (2017).
20 G. Ezhilarasu, A. Hanna, R. Irwin, A. Alam, S. S. Iyer, "A Flexible, Heterogeneously Integrated Wireless Powered System for Bio-Implantable Applications using Fan-Out Wafer-Level Packaging", 2018 IEEE International Electron Devices Meeting (IEDM), 29-37 (2018).
21 J. Gerth, U. Wiklund, "The influence of metallic interlayers on the adhesion of PVD TiN coatings on high-speed steel", Wear, 264(9-10), 885-892 (2008).   DOI
22 H. S. Lim, S. N. Kim, J. A. Lim, S. D. Park, "Low temperature-cured electrically conductive pastes for interconnection on electronic devices", Journal of Materials Chemistry, 22(38), 20529-20534 (2012).   DOI
23 Y. Li, C. P. Wong, "Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications", Materials Science and Engineering: R: Reports, 51(1-3), 1-35 (2006).   DOI
24 H. Wei, J. Xia, W. Zhou, L. Zhou, G. Hussain, Q. Li, K. K. Ostrikov, "Adhesion and cohesion of epoxy-based industrial composite coatings", Composites Part B: Engineering, 193, 108035 (2020).   DOI
25 J. A. Jofre-Reche, J. Pulpytel, F. Arefi-Khonsari, J. M. MartinMartinez, "Increased adhesion of polydimethylsiloxane (PDMS) to acrylic adhesive tape for medical use by surface treatment with an atmospheric pressure rotating plasma jet", Journal of Physics D: Applied Physics, 49(33), 334001 (2016).   DOI
26 T. Fukushima, Y. Susumago, H. Kino, T. Tanaka, A. Alam, A. Hanna, S. Iyer, "Self-Assembly Technologies for FlexTrateTM", 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1836-1841 (2018).
27 F. L. Jin, X. Li, S. J. Park, "Synthesis and application of epoxy resins: A review", Journal of Industrial and Engineering Chemistry, 29, 1-11 (2015).   DOI
28 D. S. Melchert, R. R. Collino, T. R. Ray, N. D. Dolinski, L. Friedrich, M. R. Begley, D. S. Gianola, "Flexible Conductive Composites with Programmed Electrical Anisotropy Using Acoustophoresis", Advanced Materials Technologies, 4(12), 1900586 (2019).   DOI
29 T. Y. Kuo, Y. C. Shih, Y. C. Lee, H. H. Chang, Z. C. Hsiao, C. W. Chiang, S. M. Li, Y. J. Hwang, C. T. Ko, Y. H. Chen, "Flexible and ultra-thin embedded chip package", IEEE 2009 59th Electronic Components and Technology Conference, 1749-1753 (2009)
30 H. M. Jeong, J. B. Lee, S. Y. Lee, B. K. Kim, "Shape memory polyurethane containing mesogenic moiety", Journal of Materials Science, 35, 279-283 (2000).   DOI
31 D. Dasgupta, F. Demichelis, A. Tagliaferro, "Electrical conductivity of amorphous carbon and amorphous hydrogenated carbon", Philosophical Magazine B, 63(6), 1255-1266 (1991).   DOI
32 W. Luft, "Solar Cell Interconnector Design", IEEE Transactions on Aerospace and Electronic Systems, AES-7(5), 781-791 (1971).   DOI
33 E. E. de Kluizenaar, "Reliability of Soldered Joints: A Description of the State of the Art: Part 1", Soldering & Surface Mount Technology, 2(1), 27-38 (1990).   DOI
34 W. Xu, T. J. Lu, F. Wang, "Effects of interfacial properties on the ductility of polymer-supported metal films for flexible electronics", International Journal of Solids and Structures, 47(14-15), 1830-1837 (2010).   DOI
35 N. Palavesam, W. Hell, A. Drost, C. Landesberger, C. Kutter, K. Bock, "Influence of Flexibility of the Interconnects on the Dynamic Bending Reliability of Flexible Hybrid Electronics", Electronics, 9(2), 238 (2020).   DOI
36 S. M. Yi, I. S. Choi, B. J. Kim, Y. C. Joo, "Reliability Issues and Solutions in Flexible Electronics Under Mechanical Fatigue", Electronic Materials Letters, 14, 387-404 (2018).   DOI
37 M. I. Talukdar, E. H. Baker, "Conductivity studies on silver oxide", Solid State Communications, 7(2), 309-310 (1969).   DOI
38 X. Luo, B. Zhang, G. Zhang, "Fatigue of metals at nanoscale: Metal thin films and conductive interconnects for flexible device application", Nano Materials Science, 1(3), 198-207 (2019).   DOI
39 B. Y. Kim, S. H. Lee, S. G. Park, K. Y. Oh, J. Song, D. H. Kim, "Comparison Study for TiN Films Deposited from Different Method: Chemical Vapor Deposition and Atomic Layer Deposition", MRS Online Proceedings Library (OPL), 672, 78 (2001).
40 M. J. Yim, Y. Li, K. S. Moon, K. W. Paik, C. P. Wong, "Review of Recent Advances in Electrically Conductive Adhesive Materials and Technologies in Electronic Packaging", Journal of Adhesion Science and Technology, 22(14), 1593-1630 (2008).   DOI
41 S. J. Raab, R. Guschlbauer, M. A. Lodes, C. Korner, "Thermal and Electrical Conductivity of 99.9% Pure Copper Processed via Selective Electron Beam Melting", Advanced Engineering Materials, 18(9), 1661-1666 (2016).   DOI
42 C. W. Corti, R. J. Holliday, "Commercial aspects of gold applications: from materials science to chemical science", Gold Bulletin, 37, 20- 26 (2004).   DOI
43 R. Niu, M. Jin, J. Cao, Z. Yan, J. Gao, H. Wu, G. Zhou, L. Shui, "Self-Healing Flexible Conductive Film by Repairing Defects via Flowable Liquid Metal Droplets", Micromachines (Basel), 10(2), 113 (2019).   DOI
44 F. H. Gojny, M. H. Wichmann, B. Fiedler, I. A. Kinloch, W. Bauhofer, A. H. Windle, K. Schulte, "Evaluation and identification of electrical and thermal conduction mechanisms in carbon nanotube/epoxy composites", Polymer, 47(6), 2036-2045 (2006).   DOI
45 M. J. Rizvi, Y. C. Chan, C. Bailey, H. Lu, A. Sharif, "The effect of curing on the performance of ACF bonded chip-on- flex assemblies after thermal ageing", Soldering & Surface Mount Technology, 17(2), 40-48 (2005).   DOI
46 W. Xu, J. S. Yang, T. J. Lu, "Ductility of thin copper films on rough polymer substrates", Materials & Design, 32(1), 154-161 (2011).   DOI
47 V. E. Ogbonna, A. P. I. Popoola, O. M. Popoola, S. O. Adeosun, "A review on polyimide reinforced nanocomposites for mechanical, thermal, and electrical insulation application: Challenges and recommendations for future improvement", Polymer Bulletin, 79, 663-695 (2022).   DOI
48 A. Tolvgard, J. Malmodin, J. Liu, Z. Lai, "A reliable and environmentally friendly packaging technology-flip chip joining using anisotropically conductive adhesive", Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, 19-26 (1998).
49 M. Catchpole, "E-Textile Seam Crossing with Screen Printed Circuits and Anisotropic Conductive Film", Multidisciplinary Digital Publishing Institute Proceedings, 32(1), 16 (2019).
50 J. H. Byeon, D. J. Yoon, K. W. Paik, "A Study on the Magnetic Dispersion of the Conductive Particles of Anchoring-Polymer-Layer Anisotropic Conductive Films and Its Fine-Pitch Interconnection Properties", IEEE Transactions on Components, Packaging and Manufacturing Technology, 9(7), 1235-1243 (2019).   DOI
51 M. Takeichi, "19.2: Invited Paper: History of ACF Development and New Solutions", SID Symposium Digest of Technical Papers, 39(1), 244-248 (2008).   DOI
52 F. Yakuphanoglu, A. A. Al-Ghamdi, F. El-Tantawy, "Electromagnetic interference shielding properties of nanocomposites for commercial electronic devices", Microsystem Technologies, 21, 2397-2405 (2015).   DOI
53 F. M. Kelly, W. B. Pearson, "The Rubidium Transition at ~ 180 ° K", Canadian Journal of Physics, 33(1), 17-24 (1955).   DOI
54 S. Cheng, Z. Wu, "Microfluidic Electronics", Lab on a Chip, 12(16), 2782-2791 (2012).   DOI
55 S. W. Youn, A. Ueno, M. Takahashi, R. Maeda, "Metallization of Cu on Parylene-C Film Micro-patterned by Hot-embossing", Polytronic 2007 - 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics, 45-50 (2007).
56 M. D. Damaceanu, R. D. Rusu, M. Bruma, A. Muller, "Thin polyimide films for dielectric interlayer application", IEEE 2009 International Semiconductor Conference, 351-354 (2009).
57 J. S. Park, T. W. Kim, D. Stryakhilev, J. S. Lee, S. G. An, Y. S. Pyo, D. B. Lee, Y. G. Mo, D. U. Jin, H. K. Chung, "Flexible full color organic light-emitting diode display on polyimide plastic substrate driven by amorphous indium gallium zinc oxide thin-film transistors", Applied Physics Letters, 95, 013503 (2009).   DOI
58 J. G. Cook, M. P. van der Meer, "The thermal conductivity and electrical resistivity of gold from 80 to 340 K", Canadian Journal of Physics, 48(3), 254-263 (1970).   DOI
59 S. Cheng, Z. Wu, "Microfluidic stretchable RF electronics", Lab on a Chip, 10(23), 3227-3234 (2010).   DOI
60 Q. Xu, N. Oudalov, Q. Guo, H. M. Jaeger, E. Brown, "Effect of oxidation on the mechanical properties of liquid gallium and eutectic gallium-indium", Physics of Fluids, 24(6), 063101 (2012).   DOI
61 V. Zardetto, T. M. Brown, A. Reale, A. Di Carlo, "Substrates for flexible electronics: A practical investigation on the electrical, film flexibility, optical, temperature, and solvent resistance properties", Journal of Polymer Science Part B: Polymer Physics, 49(9), 638-648 (2011).   DOI
62 S. Simaafrookhteh, R. Taherian, M. Shakeri, "Stochastic Microstructure Reconstruction of a Binder/Carbon Fiber/Expanded Graphite Carbon Fiber Paper for PEMFCs Applications: Mass Transport and Conductivity Properties", Journal of The Electrochemical Society, 166(7), F3287 (2019).   DOI
63 Y. H. Lai, W. T. Wang, C. H. Tu, K. L. Hwu, H. H. Lu, L. H. Chang, Y. H. Lin, "4.2: Study of ACF Bonding Technology in Flexible Display Module Packages", SID Symposium Digest of Technical Papers, 46(1), 12-15 (2015).   DOI
64 J. H. Ahn, J. H. Choi, C. Y. Lee, "Electrical evaluations of anisotropic conductive film manufactured by electrohydrodynamic ink jet printing technology", Organic Electronics, 78, 105561 (2020).   DOI
65 S. Carnevali, C. Proust, M. Soucille, "Unsteady aspects of sodium-water-air reaction", Chemical Engineering Research and Design, 91(4), 633-639 (2013).   DOI
66 J. H. Choi, M. G. Shin, Y. Jung, D. H. Kim, J. S. Ko, "Fabrication and Performance Evaluation of Highly Sensitive Flexible Strain Sensors with Aligned Silver Nanowires", Micromachines (Basel), 11(2), 156 (2020).   DOI
67 H. P. Wu, J. F. Liu, X. J. Wu, M. Y. Ge, Y. W. Wang, G. Q. Zhang, J. Z. Jiang, "High conductivity of isotropic conductive adhesives filled with silver nanowires", International journal of adhesion and adhesives, 26(8), 617-621 (2006).   DOI
68 M. Hoppe, A. Thaer, "Scanning Acoustic Microscopy", Microscopic Methods in Metals, 7-28 (1986).
69 M. T. S. Nair, L. Guerrero, O. L. Arenas, P. K. Nair, "Chemically deposited copper oxide thin films: structural, optical and electrical characteristics", Applied Surface Science, 150(1-4), 143-151 (1999).   DOI
70 E. L. Warrick, "Crystallinity and orientation in silicone rubber. II. Physical measurements", Journal of Polymer Science, 27(115), 19-38 (1958).   DOI
71 W. Zhou, S. Qi, C. Tu, H. Zhao, "Novel heat-conductive composite silicone rubber", Journal of Applied Polymer Science, 104(4), 2478-2483 (2007).   DOI
72 T. K. Chen, J. Y. Chui, T. S. Shieh, "Glass Transition Behaviors of a Polyurethane Hard Segment based on 4,4'-Diisocyanatodiphenylmethane and 1,4-Butanediol and the Calculation of Microdomain Composition", Macromolecules, 30(17), 5068-5074 (1997).   DOI
73 S. Iwamori, "Adhesion and Friction Properties of Fluorocarbon Polymer Thin Films Coated onto Metal Substrates", Key Engineering Materials, 384, 311-320 (2008).   DOI
74 N. Selvakumar, H. C. Barshilia, "Review of physical vapor deposited (PVD) spectrally selective coatings for mid-and high-temperature solar thermal applications", Solar Energy Materials and Solar Cells, 98, 1-23 (2012).   DOI
75 R. Morent, N. De Geyter, F. Axisa, N. De Smet, L. Gengembre, E. De Leersnyder, C. Leys, J. Vanfleteren, M. R. Machal, E. Schacht, E. Payen, "Adhesion enhancement by a dielectric barrier discharge of PDMS used for flexible and stretchable electronics", Journal of Physics D: Applied Physics, 40(23), 7392 (2007).   DOI