• 산업공학
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• 제7권2호
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• pp.145-155
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• 1994

In this paper, we analyzed weak points of press process with the rolled thin flexible plate. The problems which are caused by the adhesion of blank on the surface of die and the separation of blank from scrap during its transportation after blanking were solved by the redesign of the structure of die and the development of special equipment for material handling. It is our purpose to make better the automation of blanking process and the safety for worker by the improvement of flexible material handling.

• International Journal of Precision Engineering and Manufacturing
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• 제6권4호
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• pp.31-36
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• 2005

This paper describes a research work on the die design for the deep drawing & ironing(D. D. I) of high pressure gas cylinder. D. D. I die set is large-sized die used in horizontal press, which is usually composed of a drawing, and an ironing die. Design method of D. D. I die set is very different from that of conventional cold forging die set. Outer diameter of the die set is fixed because of press specification and that of the insert should be as small as possible for saving material cost. In this study, D. D. I die set has been designed to consider those characteristics, and the feasibility of the designed die has been verified by FE-analysis. In addition, the automated system of die design has been developed in AutoCAD R14 by formulating the applied methods to the regular rules.

• 소성∙가공
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• 제22권5호
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• pp.243-249
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• 2013

The multi-point forming (MPF) process for three-dimensional curved sheet metal has been developed as an alternative to the conventional die forming process since MPF allows the manufacturing of various shapes using one die set and reduce the cost of production. However, the MPF process cannot provide high quality products yet due to defects occurring in the sheet such as dimples and wrinkles. It can also lead to economic loss because of long tool setup time and additional machining required outside of the sheet formed area. In this study, a new sheet metal forming method, called flexible roll forming (FRF), is proposed to solve the problems of existing processes for three-dimensional curved sheet metal. This progressive process utilizes adjusting rods, as well as upper and lower flexible rollers as forming tools. In contrast with the existing processes, FRF can reduce the additional production costs because of the possible blank size for the part longitudinal direction, which is unrestricted. In this research, methods and procedures of the flexible roll forming technology are described. Numerical forming simulations of representative three-dimensional curved sheet products are also carried out to demonstrate the feasibility of this technology.

• 대한금속재료학회지
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• 제48권4호
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• pp.363-368
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• 2010

N,N'-diphenyl-N,N'-bis(3-methylphenyl)1-1' biphenyl-4,4'-diamine (TPD) hole-transporting layers were deposited using a continuous slot-die coating method on ITO/PET flexible substrates. It is crucial that the substrates have a very smooth surface with a RMS roughness of less than 2 nm for the deposition of semiconductor nanocrystals or Quantum Dots. The parameters of the slot-die coating, including the solution concentration of the TPD, the gap between the slot-die and the substrates, and the coating speed were controlled in these experiments. To obtain full coverage of the TPD films on the ITO/PET substrates (40 mm wide and several meters long), the injection rates of the TPD solution were increased proportional to the coating speed of the flexible substrates. Additionally, the injection rates must be increased as the gap distance changes from 400 to 600 ${\mu}m$ at the same coating speed. A RMS surface roughness of less than 2 nm was obtained, in contrast to bare ITO/PET substrates, at 13 nm, as the coating speed and gap distance increased.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2004년도 추계학술대회 논문집
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• pp.1307-1311
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• 2004

This paper deals with an automated computer-aided process planning and die design system by which designer can determine operation sequences even if they have a little experience in process planning and die design for axisymmetric products. An attempt is made to link programs incorporating a number of expert design rules with the process variables obtained by commercial FEM softwares, DEFORM and ANSYS, to form a useful package. They can provide a flexible process based on either the reduction in the number of forming sequences by combining the possible two processes in sequence, or the reduction of deviation of the distribution on the level of the required forming loads by controlling the forming ratios. Especially in die design module an optimal design technique and horizontal split die were investigated for determining appropriate dimensions of components of multi-former die set. It is constructed that the proposed method can be beneficial for improving the tool life of die set at practice.

• 소성∙가공
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• 제26권4호
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• pp.240-245
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• 2017

Mixed-model production technology is a method of producing multiple products with one production process and production line in order to reduce wasted manpower and adjust to market trends. In other words, mixed-model production is a flexible production system that changes production volume by model according to market demand. This study has developed a progressive laminated stamping die technology to enable flexible production of a motor core consisting of attaching and detaching the Cam on the back of the punch so that two kinds of stator and two kinds of rotor could be produced in one progressive die.

• 한국정밀공학회지
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• 제31권6호
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• pp.491-495
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• 2014

We developed a compact high-precision slot-die coating machine for thin-film deposition on a flexible substrate. For smooth and precise coating, air-bearing and linear motor system were employed to minimize velocity ripple. The gap control mechanism is specially designed to have repeatability of gap between nozzle and substrate under 1 ${\mu}m$. Due to extremely precise gap control, the machine can coat thin-films down to 50 nm with $200mm{\times}100mm$ size. A thin film of Ag nano-particle ink is coated for demonstration.

• International Journal of Precision Engineering and Manufacturing
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• 제7권1호
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• pp.3-8
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• 2006

This paper deals with an automated computer-aided process planning and die design system by which designer can determine operation sequences even if they have a little experience in process planning and die design for axisymmetric products. An attempt is made to link programs incorporating a number of expert design rules with the process variables obtained by commercial FEM softwares, DEFORM and ANSYS, to form a useful package. The system can provide a flexible process based on either the reduction in the number of forming sequences by combining the possible two processes in sequence, or the reduction of deviation of the distribution on the level of the required forming loads by controlling the forming ratios. Especially in die design module optimal design technique and horizontal split of die insert were investigated for determining appropriate dimensions of components of multi-former die set. Results obtained, using the modules, enable the design and manufacture of a die set for a multi-former to be more efficiently performed.

• Structural Engineering and Mechanics
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• 제37권5호
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• pp.475-487
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• 2011

In a flexible multi-body dynamic system the typical topological optimization method for structures cannot be directly applied, as the stiffness varies with position. In this paper, the topological optimization of the flexible multi-body dynamic system is converted into structural optimization using the equivalent static load method. First, the actual boundary conditions of the control system and the approximate stiffness curve of the mechanism are obtained from a flexible multi-body dynamical simulation. Second, the finite element models are built using the absolute nodal coordination for different positions according to the stiffness curve. For efficiency, the static reanalysis method is utilized to solve these finite element equilibrium equations. Specifically, the finite element equilibrium equations of key points in the stiffness curve are fully solved as the initial solution, and the following equilibrium equations are solved using a reanalysis method with an error controlled epsilon algorithm. In order to identify the efficiency of the elements, a non-dimensional measurement is introduced. Finally, an improved evolutional structural optimization (ESO) method is used to solve the optimization problem. The presented method is applied to the optimal design of a die bonder. The numerical results show that the presented method is practical and efficient when optimizing the design of the mechanism.

• Journal of Welding and Joining
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• 제31권3호
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• pp.4-10
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• 2013

In electronic industry, the trend of future electronics will be flexible, bendable, wearable electronics. Until now, there is few study on bonding technology and reliability of bonding joint between chip with micro solder bump and flexible substrate. In this study, we investigated joint properties of Si chip with eutectic Sn-58Bi solder bump on Cu pillar bump bonded on flexible substrate finished with ENIG by flip chip process. After flip chip bonding, we observed microstructure of bump joint by SEM and then evaluated properties of bump joint by die shear test, thermal shock test, and bending test. After thermal shock test, we observed that crack initiated between $Cu_6Sn_5IMC$ and Sn-Bi solder and then propagated within Sn-Bi solder and/or interface between IMC and solder. On the other hands, We observed that fracture propated at interface between Ni3Sn4 IMC and solder and/or in solder matrix after bending test.