• 한국정보디스플레이학회:학술대회논문집
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• 2003.07a
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• pp.1005-1008
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• 2003

We report a new FCOG (flip chip on glass) technique using solder bumps for display packaging applications. The In and Sn solder bumps of 40 ${\mu}m$ pitches were formed on Si and glass substrate. The In and Sn bumps were bonded at 125 at the pressure of 3 mN/bump. The metallurgical bonding was confirmed using cross-sectional SEM. The contact resistance of the solder joint was 65 $m{\Omega}$ which was much lower than that of the joint made using the conventional ACF bonding technique. We demonstrate that the new COG technique using solder bump to bump direct bonding can be applied to advanced LCDs that lead to require higher quality, better resolution, and lower power consumption.

• Journal of the Semiconductor & Display Technology
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• v.8 no.4
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• pp.71-76
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• 2009

The clean non-contact type conveyor system for vertical transfer of large size FPD(Flat Panel Display) glasses has been installed at FPD production line just since a few years ago. The most important part of the conveyor is the 3 axis permanent magnet rollers faced orthogonally in pairs. However, the systematic design method about it has not been proposed yet. In this paper, we studied a design analysis for determining geometrical parameters of the magnetic roller by using a commercial FEM tool of the 3D Maxwell. Through a series of simulation, we obtained the relationship of several geometrical parameters affecting the torque of the conveyor.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07a
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• pp.692-696
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• 2005

In an attempt to fabricate all inclusive display systems we are presenting a study on several elements that would be used as building blocks for all-on-board integrated applications on stainless steel foils. These systems would include in the same substrate all or many of the components needed to drive a flat panel OLED display. We are reporting results on both digital and analog circuits on stainless steel foils. Shift registers running at speeds greater than 1.0MHz are shown as well as oscillators operating at over 40MHz. Pixel circuits for driving organic light emitting diodes are presented. The device technology of choice is that based on poly-silicon TFT technology as it has the potential of producing circuits with good performance and considerable cost savings over the established processes on quartz or glass substrates (amorphous Silicon a-Si:H or silicon on Insulator SOI).

• Journal of the Semiconductor & Display Technology
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• v.7 no.2
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• pp.35-38
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• 2008

This study shows the improvement of PR-Ashing rates in semi-conductor process using Atmospheric Plasma. Taguchi method is used to improve Ashing rates of photo-resist that is spread on the surface of a wafer. Improvement of Ashing rates is acquired through the decision of the effective factors and suitable combination of the factors. The results show the contribution rate of each factor and the effectiveness of Plasma for PR-Ashing process in this system.

• Journal of Information Display
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• v.12 no.2
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• pp.89-92
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• 2011

Advanced static DC magnetron sputtering methods based on the magnet wobbling technique were investigated to achieve highly uniform and homogeneous metallization layers. The novel split sputter mode (SSM) method, wherein the deposition process is divided into two distinct steps, enables the AKT rotary cathode technology to provide excellent layer properties, while keeping a high production throughput. The effectiveness of theSSMtechnique was demonstrated through copper-coated large-area substrates.

• Journal of the Semiconductor & Display Technology
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• v.18 no.4
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• pp.25-29
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• 2019

Microstructure pattern generation on light guides in backlight unit (BLU) is an essential process for designing flat panel display, but efficient designing algorithm is still limited to achieve uniform luminescence while maintaining fully random distribution to avoid interference effects. In this study, a molecular dynamics model based pattern generation algorithm has been developed. The proposed algorithm allows a fast and efficient distribution of patterns at specified density within the user-defined computational cells, and its efficiency and performance has been demonstrated with sample cases.

• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.277-280
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• 2004

Thin-film photosensors on organic light emitting diode (OLED) glass substrates using active-matrix OLED TFT manufacturing processes have been constructed and optimized, and their performance has been characterized. Suitable control circuitry and applications are proposed. The photosensors may be integrated into OLED displays for detection of ambient illumination and for detection of OLED light emission, thereby enabling output, uniformity, and aging compensation.

• Proceedings of the IEEK Conference
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• 1998.10a
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• pp.457-460
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• 1998

Recently, the research of the FPD(Flat Panel Display)which is substituted for CRT(Cathode Ray Tube) has been widely progressed. But most equipment that are used for production of FPD are expensive and we must import these equipment. Among these equipment, most important one is a auto-alignment system. In this paper, we present a high speed, high precision auto-alignment system, in which a PLD auto tuning algorithm, 1-dimensional CCD(Dcharge Coupled Device) camera, vision board, and vision data processing algorithm are included.

• The Proceedings of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.8 no.5
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• pp.49-55
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• 1994

평판 디스플레이용 비정질 실리콘 박막 트랜지스터의 전기적인 특성과 수학적인 모델에 대하여 연구되었고 이론적인 모델은 실험을 통하여 그 타당성을 입증하였다. 게이트전압이 고정된 상태에서 드레인 전압 증가에 따른 드레인 포화전류는 증가되었고 디바이스의 포화는 드레인 전압이 증가될수록 더 증가되었으며 문턱전압은 감소되었다. 세 개의 변수로 구성된 디바이스의 전달특성과 출력특성에 대한 실험 결과값에 대한 모델식이 제시되었는데 이 모델은 디비이스의 기하학적인 구조를 간단화 하기위한 모델식이다.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1666-1669
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• 2006

Plextronics develops conductive polymer technology (trademarked $Plexcore^{TM}$) that will enable the broad market commercialization of printed electronic devices. This talk will emphasize advances to our $Plexcore^{TM}$ HIL technology - a soluble non-acidic hole injection layer (HIL) technology for OLEDs . which is designed to dramatically improve device efficiency and lifetime of flat panel displays and solid state white-lighting.