• Korean Journal of Materials Research
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• v.19 no.9
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• pp.462-467
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• 2009

The Charge Trap Flash (CTF) memory device is a replacement candidate for the NAND Flash device. In this study, Pt/$Al_2O_3/La_2O_3/SiO_2$/Si multilayer structures with lanthanum oxide charge trap layers were fabricated for nonvolatile memory device applications. Aluminum oxide films were used as blocking oxides for low power consumption in program/erase operations and reduced charge transports through blocking oxide layers. The thicknesses of $SiO_2$ were from 30 $\AA$ to 50 $\AA$. From the C-V measurement, the largest memory window of 1.3V was obtained in the 40 $\AA$ tunnel oxide specimen, and the 50 $\AA$ tunnel oxide specimen showed the smallest memory window. In the cycling test for reliability, the 30 $\AA$ tunnel oxide sample showed an abrupt memory window reduction due to a high electric field of 9$\sim$10MV/cm through the tunnel oxide while the other samples showed less than a 10% loss of memory window for $10^4$ cycles of program/erase operation. The I-V measurement data of the capacitor structures indicated leakage current values in the order of $10^{-4}A/cm^2$ at 1V. These values are small enough to be used in nonvolatile memory devices, and the sample with tunnel oxide formed at $850^{\circ}C$ showed superior memory characteristics compared to the sample with $750^{\circ}C$ tunnel oxide due to higher concentration of trap sites at the interface region originating from the rough interface.

• Proceedings of the Korean Society of Computer Information Conference
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• 2018.07a
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• pp.357-359
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• 2018

최근 메모리 반도체 시장은 SD(Secure Digital) 메모리 카드, SSD(Solid State Drive)등의 보급률 증가로 메모리 반도체의 시장이 대규모로 증가하고 있다. 메모리 반도체는 개인용 컴퓨터 뿐만 아니라 스마프폰, 테플릿 PC, 교육용 임베디드 보드 등 다양한 산업에서 이용 되고 있다. 또한 메모리 반도체 생산 업체가 대규모로 메모리 반도체 산업에 투자하면서 메모리 반도체 시장은 대규모로 성장되었다. 플래시 메모리는 크게 NAND-Type과 NOR-Type으로 나뉘며 플로팅 게이트 셀의 전압의 따라 SLC(Single Level Cell)과 MLC(Multi Level Cell) 그리고 TLC(Triple Level Cell)로 구분 된다. SLC 및 MLC NAND-Type 플래시 메모리는 많은 연구가 진행되고 이용되고 있지만, TLC NAND-Tpye 플래시 메모리는 많은 연구가 진행되고 있지 않다. 본 논문에서는 기존에 제안된 SLC 및 MLC NAND-Type 플래시 메모리에서 제안된 큐브 패턴을 TLC NAND-Type 플래시 메모리에서 적용 가능한 큐브 패턴 및 알고리즘을 제안한다.

• Transactions on Electrical and Electronic Materials
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• v.16 no.4
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• pp.183-186
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• 2015

This research investigates the impact of charge spreading on the data retention of three-dimensional (3D) silicon-oxide-nitride-oxide-silicon (SONOS) flash memory where the charge trapping layer is shared along the cell string. In order to do so, this study conducts an electrical analysis of the planar SONOS test pattern where the silicon nitride charge storage layer is not isolated but extends beyond the gate electrode. Experimental results from the test pattern show larger retention loss in the devices with extended storage layers compared to isolated devices. This retention degradation is thought to be the result of an additional charge spreading through the extended silicon nitride layer along the width of the memory cell, which should be improved for the successful 3-D application of SONOS flash devices.

• Journal of the Korea Society of Computer and Information
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• v.13 no.3
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• pp.57-63
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• 2008

As diverse memory cards based on NAND flash memory are getting popularity with consumer electronics such as digital camera, camcorder and MP3 player the compatibility problems between a newly developed memory card and existent host systems have become a main obstacle to time-to-market delivery of product. The common practice for memory card compatibility test is to use a real host system as a test bed. As an improved solution, an FPGA-based prototyping board can be used for emulating host systems. However, the above approaches require a long set-up time and have limitations in representing various host and device systems. In this paper, we propose a co-validation environment for compatibility test between memory card and host system using formal modeling based on Esterel language and co-simulation methodology. Finally, we demonstrate the usefulness of the proposed environment with a case study of real memory card development.

• The Journal of the Korea institute of electronic communication sciences
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• v.9 no.1
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• pp.77-82
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• 2014

SD memory cards are widely used in portable digital devices, and most of them exploit NAND flash memory as their storage, so that they have a feature of storing users' important data safely with low costs. In case of using NAND flash memory as storage, however, there is no method to store users' data if memory capacity is insufficient when transferring a large volume of data. This paper proposes a virtual SD memory card system. It used a SD memory card device driver to process data requested from a host by exploiting external storage rather than by exploiting flash memory as a memory core for storing data to the SD memory card. For experiment, it used the FPGA-based SD card slave controller IP on the SMC controller with a S3C2450 ARM CPU to test.

• Journal of the Korea Society of Computer and Information
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• v.26 no.11
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• pp.1-9
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• 2021

3D-NAND flash memory provides high capacity per unit area by stacking 2D-NAND cells having a planar structure. However, due to the nature of the lamination process, there is a problem that the frequency of error occurrence may vary depending on each layer or physical cell location. This phenomenon becomes more pronounced as the number of write/erase(P/E) operations of the flash memory increases. Most flash-based storage devices such as SSDs use ECC for error correction. Since this method provides a fixed strength of data protection for all flash memory pages, it has limitations in 3D NAND flash memory, where the error rate varies depending on the physical location. Therefore, in this paper, pages and layers with different error rates are classified into clusters through the K-means machine learning algorithm, and differentiated data protection strength is applied to each cluster. We classify pages and layers based on the number of errors measured after endurance test, where the error rate varies significantly for each page and layer, and add parity data to stripes for areas vulnerable to errors to provides differentiate data protection strength. We show the possibility that this differentiated data protection policy can contribute to the improvement of reliability and lifespan of 3D NAND flash memory compared to the protection techniques using RAID-like or ECC alone.

• IEMEK Journal of Embedded Systems and Applications
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• v.6 no.1
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• pp.32-40
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• 2011

For a NAND booting based embedded system, an application program on the NAND flash memory is downloaded to the RAM when the system is booted. In this case, the application program exists in both the RAM and the NAND flash so the RAM usage is increased. In this paper, we suggested the demand paging technique for the decreasing of the RAM usage for OS-less NAND booting based embedded systems. As a result of a benchmark test, 40~80% of the code memory usage was reduced with below 5% of execution time delay.

• Journal of the Institute of Electronics and Information Engineers
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• v.50 no.4
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• pp.239-245
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• 2013

The data retention characteristics depending on neighbor cell's threshold voltage (Vt) in a multilevel NAND flash memory is studied. It is found that a Vt shift (${\Delta}Vt$) of the noted cell during a thermal retention test is increased as the number of erase-state (lowest Vt state) cells surrounding the noted cell increases. It is because a charge loss from a floating gate is originated from not only intrinsic mechanism but also lateral electric field between the neighboring cells. From the electric field simulation, we can find that the electric field is increased and it results in the increased charge loss as the device is scaled down.

• Journal of the Korea Institute of Military Science and Technology
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• v.14 no.4
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• pp.607-614
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• 2011

This paper describes the development of pulse code modulation(PCM) data recorder with design, implementation and environmental test. PCM serial data that diverged from telemetry encoder output is used as the input and is reformed to parallel signal through FPGA processing. Controllers construct the packet by the sector and record it into non-volatile memory. Compact flash(CF) memory for data storage media, USB interface for data downloading, and a software for operating status diagnosis and file format conversion are used.

• Transactions on Electrical and Electronic Materials
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• v.17 no.1
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• pp.25-28
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• 2016

We investigate the effect of interface states on the endurance of a charge trap flash (CTF) NOR array using charge pumping methods. The endurance test was completed from one cell selected randomly from 128 bit cells, where the memory window value after 10² program/erase (P/E) cycles decreased slightly from 2.2 V to 1.7 V. However, the memory window closure abruptly accelerated after 10³ P/E cycles or more (i.e. 0.97 V or 0.7 V) due to a degraded programming speed. On the other hand, the interface trap density (Nit) gradually increased from 3.13×10¹¹ cm⁻² for the initial state to 4×10¹² cm⁻² for 10² P/E cycles. Over 10³ P/E cycles, the Nit increased dramatically from 5.51×10¹² cm⁻² for 10³ P/E cycles to 5.79×10¹² cm⁻² for 10⁴ P/E cycles due to tunnel oxide damages. These results show good correlation between the interface traps and endurance degradation of CTF devices in actual flash cell arrays.