• Structural Engineering and Mechanics
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• v.62 no.6
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• pp.739-748
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• 2017

Notches such as slots are typical geometric features on mechanical components that promote fatigue crack initiation. Unlike for components with open hole type notches, there are no conventional treatments to enhance fatigue behavior of components with slots. In this work we evaluate the viability of applying laser shock peening (LSP) to extend the fatigue life of 6061-T6 aluminum components with slots. The feasibility of using LSP is evaluated not only on damage free notched specimens, but also on samples with previous fatigue damage. For the LSP treatment a convergent lens was used to deliver 0.85 J and 6 ns laser pulses 1.5 mm in diameter by a Q-switch Nd: YAG laser, operating at 10 Hz with 1064 nm of wavelength. Residual stress distribution was assessed by the hole drilling method. A fatigue analysis of the notched specimens was conducted using the commercial code FE-Safe and different multiaxial fatigue criteria to predict fatigue lives of samples with and without LSP. The residual stress field produced by the LSP process was estimated by a finite element simulation of the process. A good comparison of the predicted and experimental fatigue lives was observed. The beneficial effect of LSP in extending fatigue life of notched components with and without previous damage is demonstrated.

• Proceedings of the KSR Conference
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• 1999.05a
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• pp.344-351
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• 1999

Stress analysis of bogie frame by using the finite element method has been performed for the various loading conditions according to the UIC (International Union of Railways) Code 615-4. Multiaxial fatigue damage models such as signed von Mises method and typical critical plane theories were reviewed, and multiaxial fatigue analysis program (MUFAP) has been developed. Fatigue analysis of bogie frame under multiaxial loading was performed by using MUFAP and finite element analysis results. The procedure developed in this study is considered to be useful for the life prediction in preliminary design stage of railway components under multiaxial loading conditions. 3-dimensional surface modeling, mesh generation and finite element analysis were performed by Pro-Engineer, MSC/PATRAN and MSC/NASTRAN, respectively, which were installed in engineering workstation.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.11a
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• pp.485-488
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• 2000

In this study, the fatigue characteristic of spot weld specimen was studied by using the various specimen. The specimen types were tensile shear specimen welded one spot and two spot, and cross tension. The tensile tests and fatigue tests were executed to know the mechanical properties under static and fatigue load condition. In addition, the relationship was illustrated by finite element method.

• Journal of the Korean Society for Railway
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• v.7 no.2
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• pp.85-92
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• 2004

This paper consists of two parts. One is finite element analysis of the redistribution of residual stresses of weld specimen by cutting. This work is necessary to predict the actual residual stress distribution of weld specimens used in fatigue test. The other subject is to calculate the relaxation of residual stress and the strain field induced by cyclic loading. To obtain fatigue life of weldment, the value of strain amplitude at each position is necessary, for example in the strain-life approach, and the numerical results can be used to verify experimental strain measurements. Thermo mechanical finite element analyses were conducted on the commercial package ABAQUS.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.20 no.5
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• pp.1392-1400
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• 1996

The need of companies shorten the design-to-manufacturing process for new products with improved quality in cost effective manner places increasing demends on engineers to simulate the performance characteristics of a design before it is built of a prototype is developed. For theses demands CAE(Computer-Aided Engineering) offers engineers not only giving confidence of their design but also eliminating potential errors due totesting prototypes in small numbers. This paper present the method to predict the fatigue life using dynamics simulation and FEA(Finite Element Analysis) for construciton equipment in the computer before building prototype. The dynamicsimulatio is to get the load-time history corresponding to the maneuvering and driving of the construction equipment. The FEA is to build a model of the structure and then analyse to define the local stress response to applied loadings using linear static analysis.

• Transactions of the Korean Society of Automotive Engineers
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• v.16 no.4
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• pp.179-185
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• 2008

The purpose of this paper is to propose a systematic method on the weld pitch design of a vehicle sub-frame considering the fatigue life of spot welding points. The input data, which perform the fatigue analysis on the spot welding nuggets, are obtained by both the dynamic analysis of the multi-body vehicle model passing through the virtual proving ground of a typical Belgian road and the quasi-static analysis with the finite element model of the vehicle sub-frame. By utilizing the life cycle data obtained from the fatigue analysis, the welding points to perform the pitch change are determined. The sensitivity analysis on the fatigue life of the welding points is carried out by using the three-level orthogonal array design, and through the results of the sensitivity analysis, the best combination on the welding pitch is determined. This study shows that as compared with the baseline design, the sub-frame redesigned by the proposed technique improves the fatigue life about 7 percent while reducing the number of welding points about 19 percent.

• Journal of Mechanical Science and Technology
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• v.16 no.7
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• pp.919-926
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• 2002

In this study, the numerical prediction of the thermal fatigue lie? of a $\mu$BGA (Micro Ball Grid Array) solder joint was focused. Numerical method was performed using the three-dimensional finite element analysis for various solder alloys such as Sn-37%Pb, Sn-3.5%Ag, Sn-3.5%Ag-0.7%Cu and Sn-3.5%Ag-3%In-0.5%Bi during a given thermal cycling. Strain values obtained by the result of mechanical fatigue tests for solder alloys, were used to predict the solder joint fatigue life using the Coffin-Manson equation. The numerical results showed that Sn-3.5%Ag with the 50-degree ball shape geometry had the longest thermal fatigue life in low cycle fatigue. A practical correlation for the prediction of the thermal fatigue life was also suggested by using the dimensionless variable γ. Additionally Sn-3.5Ag-0.75Cu and Sn-2.0Ag-0.5Cu-2.0Bi were applied to 6$\times$8$\mu$BGA obtained from the 63Sn-37Pb Solder. This 6$\times$8$\mu$BGA were tested at different aging conditions at 130$\^{C}$, 150$\^{C}$, 170$\^{C}$ for 300, 600 and 900 hours. Thickness of the intermetallic compound layer was measured thor each condition and the activation energy thor their growth was computed. The fracture surfaces were analyzed using SEM (Scanning Electron Microscope) with EDS ( Energy Dispersive Spectroscopy).

• Journal of the Korean Society for Precision Engineering
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• v.18 no.1
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• pp.201-212
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• 2001

If defects are located far apart, fatigue cracks are independently initiated from them and gradually approach other cracks so that the fatigue life becomes influenced by the crack growth behavior of those interacting cracks. In this study, the effect of the stress interaction between defects on the fatigue crack propagation behavior is investigated experimentally and these results are verified by finite element method. In addition, fatigue crack propagation behaviors under micro hole interaction field are studied.

• Journal of Welding and Joining
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• v.16 no.4
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• pp.92-97
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• 1998

Because of the low melting temperature of solder, each temperature cycle initiates an irrecoverable creep deformation at the solder interconnection which connects the package body with the PCB. The crack starts and propagates from the position where the creep deformation is maximized. This work has tried to compare and analyze the thermal fatigue life of solder interconnection which is affected by the lead material, the size of die pad, chip thickness, and interface delamination of 48-Pin TSOP under the temperature cycle ($0^{\circ}C$~1$25^{\circ}C$). The crack initiation position and thermal fatigue life which are calculated by using FEA method are well matched with the results of experiments. The thermal Fatigue life of copper lead frame is extended around 3.6 times longer than that of alloy 42 lead frame. It is maximized when the chip size is matched with the length of the lead. It tends to be extended as the thickness of chip got thinner. As the interfacial delamination between die pad and EMC is increased, the thermal fatigue life tends to decrease in the beginning of delamination, and increase after the delamination grew after 45% of the length of die pad.

• Journal of Power Electronics
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• v.16 no.5
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• pp.1843-1850
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• 2016

This study focused on predicting the fatigue life of an insulated gate bipolar transistor (IGBT) power module for electric locomotives. The effects of different wiring technologies, including aluminum wires, copper wires, aluminum ribbons, and copper ribbons, on solder fatigue life were investigated to meet the high power requirement of the IGBT module. The module's temperature distribution and solder fatigue behavior were investigated through coupled electro-thermo-mechanical analysis based on the finite element method. The ribbons attained a chip junction temperature that was 30℃ lower than that attained with conventional round wires. The ribbons also exhibited a lower plastic strain in comparison with the wires. However, the difference in plastic strain and junction temperature among the different ribbon materials was relatively small. The ribbons also exhibited different crack propagation behaviors relative to the wires. For the wires, the cracks initiated at the outmost edge of the solder, whereas for the ribbons, the cracks grew in the solder layer beneath the ribbons. Comparison of fatigue failure areas indicated that ribbon bonding technology could substantially enhance the fatigue life of IGBT modules and be a potential candidate for high power modules.