A Study on |
Shin, Young-Eui
(Department of Mechanical Engineering, Chung-Ang University)
Lee, Jun-Hwan (Department of Mechanical Engineering, Chung-Ang University) Kon, Young-Wook (Department of Mechanical Engineering, Chung-Ang University) Lee, Chong-Won (Department of Mechanical Engineering, Chung-Ang University) Yun, Jun-Ho (Department of Automobiles, yeojoo Institute of Technology University) Jung, Seug-Boo (Department of Metallurgical Engineering, Sungkyunkwan University) |
1 | Habu, K., 1999, 'Development of New Pb-free Solder Alloy of Sn-Ag-Bi System,' Proceeding of the 1999 IEEE International Symposium on Electronics and the Environment, pp. 21-24 DOI |
2 | Kariya, Y., Kagawa, H. and Otsuka, M., 1998, 'Effect of Strain Rate, Hold Time and Third Element on the Fatigue Damage of Sn-3.5mass% Ag Alloy,' Microjoining and Assembly Technology in Electronics 98, pp. 259-264 |
3 | Lau, John H. and Pao, Yi-Hsin, 1998, Solder Joint Reliability of BGA, CSP, Flip Chip and Fine Pithch SMT Assemblies, McGraw-Hill, p. 118 |
4 | Lee, W. W., Nguyen, L. T. and Selvaduray, G. S., 2000, 'Solder Joint Fatigue Models : Review and Applicability to Chip Scale Package,' Microelectronis & Reliability, Vol. 40, pp. 231-244 DOI ScienceOn |
5 | Shin, Y. E. and Kim, J. M., 1999, 'A Study on the Life Prediction and Quality Improvement of Solder Joint in IC Package,' Journal of KWS, Vol. 17, No. 1, pp. 124-132 과학기술학회마을 |
6 | Oguchi, Y., Kariya, Y. and Otsuka, M., 1998, 'Shear Fatigue Characteristics of Sn-Ag-Bi, Sn-Ag-Cu and Sn-Ag-In Solder Joint,' Microjoining and Assembly Technology in Electronics98, pp. 253-258 |
7 | Lau, John H., Suresh Golwalkar and Steve Erasmus, 1993, 'Advatages and Disadvantages of TSOP with Copper Gull-Wing Leads,' Advanced in Electronic Packaging ASME, EEP-Vol. 4-2, pp. 1119-1126 |
8 | Maeda, K., 1999, 'Creep Effects on Solder Fatigue and Life time Prediction,' Microjoining and Assembly Technology in Electronics '99, pp. 57-62 |
9 | Partridge, J. and Boysan, P., 1998, 'Influence of Process Variables on the Reliability of Micro BGA package Assemblies,' IEEE, pp. 451-457 |
10 | Robert Darveaux, 1995, 'Optimizing the Reliability of Thin Small Outline Package (TSOP) Solder Joints,' Advanced in Electronic Packaging ASME, EEP-Vol. 10-2, pp. 675-685 |
11 | Yao, Q., Qu, J. and Wu, S. X., 1999, 'Estimate the Thermomechanical Fatigue Life of Two Chip Scale Packages,' IEEE Proceedings of the 49th Electronic Components & Technology Conference, pp. 797-802 DOI |
12 | Engelmeier, W., 1983, 'Fatigue Life of Leadless Chip Carrier Solder Joints During Power Cycling,' IEEE Transactions on Components, Hybrids and Manufacturing Technology, Vol. CHMT-6, No. 3, pp. 232-237 |
13 | Yao, Q. and Qu, J., 1999, 'Three-Dimensional Versus Two Dimensional Finite Element Modeling of Flip-Chip Packages,' Transactions of the ASME, Vol. 121, pp. 196-201 |
14 | Amagai, M., 1999, 'Characterization of Chip Scale Packaging Materials,' Microelectronics & Reliability, Vol. 39, pp. 1365-1377 DOI ScienceOn |
15 | Coffin, L. F., Jr. and Schenectady, N. Y., 1954, 'A Study of the Effect of Cyclic Thermal Stress on a Ductile Metal,' Transactions of the ASME, Vol. 76, pp. 932-950 |
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