• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2006년도 춘계학술대회 논문집
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• pp.589-590
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• 2006

Recently, research for the micro printing technology has begun to get into the spotlight. It is due to the superior price competitiveness to existent semi-conductor process for manufacturing some parts of display unit, electronic paper, RF-ID information device, and so on. This paper present screen printing process not for paper publication but for parts of electronics such as PDP wall, LCD CF, and so on. There are two major issues. The first one is how to get a fine and even line pattern. The other one is how to get the same patterns in large area. In this research, we present the design, equipment, and process control of screen printing in order to overcome these issues.

• 한국의상디자인학회지
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• 제5권3호
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• pp.89-97
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• 2003

This study is to review the development of calico printing pattern design for fabric through historical perspective. Calico is a cotton cloth named from Calicut, a city of India. It was first brought to England by the East India company in 1621. Although the name is generally given and plain white cotton cloth, and in America it is applied to small-scale printed cottons, today it applies to indian cotton cloth, coarse or fine, woven with colored geometrical large-scale and small-scale patterns, painted or printed. Therefore this paper proposes the classification and feature extraction of calico printing pattern from the early of 16th century to 21th century. The results of this study can be effectively applied to develop competitive calico pattern design in domestic cotton textile industry.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2006년도 춘계학술대회 논문집
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• pp.587-588
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• 2006

Drop-on-Demand (DOD) inkjet printing technology, especially piezo-typed, has been paid attention by industries due to its inherent nature of unbeatable material usage and low cost manufacturing cost. Despite of these key advantages over any other competing manufacturing technologies, the primary disadvantage has been considered as its limited capability to produce fine resolution patterns with a commercially available DOD inkjet print head. Although the main effort has been focused on the production of a DOD inkjet print head with smaller nozzles to overcome this challenging issue, an alternative approach could be taken and it would enable to expand the employment of DOD inkjet printing technology to applications requiring fine patterns further more.

• 정보저장시스템학회논문집
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• 제1권1호
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• pp.108-114
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• 2005

The generation of fine relics of suspensions is a significant interest as it holds the key to the fabrication of electronic devices. These processes offer opportunities for miniaturization of multilayer circuits, for production of functionally graded materials, ordered composites and far small complex-shaped components. Some novel printing methods of depositing ceramic and metal droplets were suggested in recent years. In an electro-hydrodynamic printing, the metallic capillary nozzle can be raised to several kilovolts with respect to the infinite ground plate or pin-type electrode positioned a few millimeters from the nozzle tip. Depending on the electrical and physical properties of the liquid, for a given geometry, it Is possible to generate droplets in any one of three modes, dripping, cone-jet and multi-jet. In this experiment, an alumina suspension flowing through a nozzle was subjected to electro-hydrodynamic printing using pin-type electrodes in the cone-jet mode at different applied voltages. The pin-type electrodes of 1, 100, 1000${\mu}m$ in diameter were used to form fine ceramic patterns onto the substrates. Various feature sizes with applied voltages and electrode diameters were measured. The feature sizes increased with the electrode diameter and applied voltages. The feature size was as fine as $30 {\mu}m$.

• ETRI Journal
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• 제35권6호
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• pp.1152-1155
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• 2013

A cost-effective and simple solder on pad (SoP) process is proposed for a fine-pitch microbump interconnection. A novel solder bump maker (SBM) material is applied to form a 60-${\mu}m$ pitch SoP. SBM, which is composed of ternary Sn3.0Ag0.5Cu (SAC305) solder powder and a polymer resin, is a paste material used to perform a fine-pitch SoP through a screen printing method. By optimizing the volumetric ratio of the resin, deoxidizing agent, and SAC305 solder powder, the oxide layers on the solder powder and Cu pads are successfully removed during the bumping process without additional treatment or equipment. Test vehicles with a daisy chain pattern are fabricated to develop the fine-pitch SoP process and evaluate the fine-pitch interconnection. The fabricated Si chip has 6,724 bumps with a 45-${\mu}m$ diameter and 60-${\mu}m$ pitch. The chip is flip chip bonded with a Si substrate using an underfill material with fluxing features. Using the fluxing underfill material is advantageous since it eliminates the flux cleaning process and capillary flow process of the underfill. The optimized bonding process is validated through an electrical characterization of the daisy chain pattern. This work is the first report on a successful operation of a fine-pitch SoP and microbump interconnection using a screen printing process.

• 한국정밀공학회지
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• 제28권10호
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• pp.1141-1145
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• 2011

Recently, there are many issues about R2R printing technique for mass production of electronic devices. Among the various Roll-to-roll based printing techniques such as gravure, off-set, flexo and so on, "Gravure off-set printing technique" has an advantage of higher printing resolution. The printing unit of gravure off-set printing technique usually consists of plate roll, blanket roll and impressure roll whose. Linear velocities should be synchronized each other for fine pattern printing. However, roller's manufacturing error and printing variations such as pringting pressure, printing speed, roll stroke and so on actually affected their synchronization anf thus the quality of fine fattern. In this paper, we analyzed the effective of synchronization error on printing quality. Also, this paper reviews the relative motion with each roll. And, this paper studys the synchronization error about its generation problem.

• 한국인쇄학회지
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• 제11권1호
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• pp.1-16
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• 1993

In screen printing process, printers are stretching screen meshs of an angle of 45deg. This angle need much more screen mesh’s quantity of 15% than 22.5deg. To search mesh angles have affect on reproducting fine line pattern, we modeled the expecting image according on screen angles change and reconfirmed it’s useful and valid from experimentation.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2000년도 제1회 학술대회 논문집
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• pp.107-108
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• 2000

We propose the method which is possible to fabricate the electrodes with the fine pattern and low resistance by photolithography and electroplating. The widths of pattern fabricated were 30, 50, 70 and 100um and the thickness could be up to $10{\mu}m$. The resistivity of the copper electrode electroplated was below $2.0{\mu}{\Omega}$ cm which is about half of photosensitive silver electrode. Dielectric layer was coated on the electrodes by screen printing and the pores harmful to the discharge were not formed after heat treatment. In the viewpoint of resistance and patterning, this method has much higher potential for large area display than other methods like screen printing, photosensitive conductive paste method and sputtering.

• 월간포장계
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• 통권209호
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• pp.58-63
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• 2010

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 춘계학술대회 논문집
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• pp.597-598
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• 2010