• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회A
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• pp.1254-1258
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• 2007

Electro-active polymer (EAP), one of the smart materials, is a new alternative offering ultra-precise movements and bio-compatibility. We present the results of the design, fabrication, and performance evaluation of a fabricated diaphragm-type polymer actuator using segmented polyurethane(SPU). This paper illustrates the relationship between the elastic modulus and maximum deflection as a key property of the Maxwell stress effect and also presents the relationship between the dielectric constant and maximum deflection as a key property of the electrostriction effect, especially in polymer actuators using SPU. A diaphragm-type actuator was used to induce an equation of the vertically distributed load by using a fully clamped circular plate as the boundary condition. To verify the equation, the results were compared to the data measured from load cell. In the near future, a low-cost check valves and bio-robot can be applied by its actuators.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회A
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• pp.1277-1281
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• 2007

A Nano-tip as a cold field emitter for inducing a field emission current has manufactured in many ways. In the paper, the electrochemical etching method is used. Thus, in order to optimize the final shape as the field emitter, the reliable fabrication system for electrochemical etching was constructed. In addition, the effective parameters such as applied voltage, submerged length, meniscus height, electrolyte concentration and environmental condition(vibration, humidity, cut-off time) have investigated in detail. By controlling the parameters, reliable tungsten tip for field emitter was fabricated. And the fabricated tungsten tip was evaluated optically. Finally, the very sharp apex of the tungsten tip was observed with scanning electron microscope.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.741-744
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• 2001

This paper described on the fabrication of microstructures by DRIE(Deep Reactive Ion Etching). SOI(Si-on-insulator) electric devices with buried cavities are fabricated by SDB technology and electrochemical etch-stop. The cavity was fabricated the upper handling wafer by Si anisotropic etch technique. SDB process was performed to seal the fabricated cavity under vacuum condition at -760 mm Hg. In the SDB process, captured air and moisture inside of the cavities were removed by making channels towards outside. After annealing(1000$^{\circ}C$, 60 min.), the SDB SOI structure was thinned by electrochemical etch-stop. Finally, it was fabricated microstructures by DRIE as well as a accurate thickness control and a good flatness.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집 Vol.3 No.2
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• pp.739-742
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• 2002

This paper described on the fabrication of microstructures by DRIE(deep reactive ion etching). SOI(Si-on-insulator) electric devices with buried cavities are fabricated by SDB technology and electrochemical etch-stop. The cavity was fabricated the upper handling wafer by Si anisotropic etch technique. SDB process was performed to seal the fabricated cavity under vacuum condition at -760 mmHg. In the SDB process, captured air and moisture inside of the cavities were removed by making channels towards outside. After annealing($1000^{\circ}C$, 60 min.), The SDB SOI structure was thinned by electrochemical etch-stop. Finally, it was fabricated microstructures by DRIE as well as an accurate thickness control and a good flatness.

• 한국환경과학회지
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• 제13권4호
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• pp.429-434
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• 2004

The purpose of this study was to investigate the possibility of application of microwave energy for the fabrication of polymer/clay nanocomposite. APES/Clay nanocomposites were prepared at 13$0^{\circ}C$ for 30min with various content of clay by melt-intercalation method under classical and microwave heating source. APES/Clay samples were characterized by the means of X-ray diffractometry(XRD), thermal gravimetric analysis(TGA), and rheometric dynamic analysis(RDA). It was found that intercalated or exfoliated state was obtained in the samples according to the condition of organic modification, clay content, and heating source.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2001년도 하계학술대회 논문집 C
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• pp.1890-1892
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• 2001

This paper described on the fabrication of microstructures by DRIE(Deep Reactive Ion Etching). SOI(Si-on-insulator) electric devices with buried cavities are fabricated by SDB technology and electrochemical etch-stop. The cavity was fabricated the upper handling wafer by Si anisotropic etch technique. SDB process was performed to seal the fabricated cavity under vacuum condition at -750 mm Hg. In the SDB process, captured air and moisture inside of the cavities were removed by making channels towards outside. After annealing(1000$^{\circ}C$, 60 min.), the SDB SOI structure was thinned by electrochemical etch-stop. Finally, it was fabricated microstructures by DRIE as well as a accurate thickness control and a good flatness.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1998년도 하계학술대회 논문집 D
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• pp.1500-1502
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• 1998

Electro Discharge Machining (EDM) is a so-call nonconventional machining technique. This paper presents the experimental results of an EDM technique for the fabircation of microholes on #7440 pyrex glass substrates. With various applied voltages and various concentration of NaOH or KOH solution, the glass substrates have been microdrilled using the copper electrodes of which diameters are 250 ${\mu}m$ to 450 ${\mu}m$. The machined throughholes have been observed the top diameter, the bottom diameter and machining time have been measured. EDM in NaOH solution causes the fabrication to have better the surface condition, higher selective of electrode, lower concentration of solution with respect to EDM in KOH solution machined fabrication.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2010년도 하계학술대회 논문집
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• pp.343-343
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• 2010

In this paper, Schottky barrier thin-film-transistors (SB-TFTs) with platinum silicide at source/drain region based on glass substrate were fabricated. Poly-silicon on glass substrates was crystallized by excimer laser annealing (ELA) method. The formation of pt-silicide at source/drain region is the most important process for SB-TFTs fabrication. We study the optimal condition of Pt-silicidation on glass substrate. Also, we propose this device as promising structure in the future.

• 대한치과기공학회지
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• 제32권4호
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• pp.337-340
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• 2010

Purpose: This study was performed to compare sintering conditions for fabrication of porous Ti implant. Methods: The porous Ti implant samples were fabricated by sintering of spherical Ti powders in vacuum and atmosphere conditions. Surface morphology, composition and phase were analyzed by FE-SEM, EDX and XRD. Results: Sintered Ti implant in the vacuum consisted of particles connected in three dimensions by clear necking without excessive oxide layers. However, sintered Ti implant in atmosphere was formed excessive oxide layers with non-stoichiometric compounds. Conclusion: The porous Ti implant can be sintered in vacuum condition preferably.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2003년도 추계학술발표대회 논문집
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• pp.3-6
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• 2003

In this work, poly(ethylene oxide) nanofibers were fabricated by electrospinning to prepare nanofibers-reinforced composites. And the PEO powders-impregnated composites were also prepared to compare with physicochemical properties of nanofibers-reinforced composites. Morphology and fiber diameter of PEO nanofibers were determined by SEM observation. Mechanical interfacial properties of the composites were investigated in fracture toughness tests and interlaminar shear strength (ILSS) test. As a result, the fiber diameter decreased in increasing applied voltage. However the optimum condition for the fiber formation was 15 ㎸, resulting from increasing of jet instability at high voltage and the prepared PEO nanofibers were useful in fiber reinforced composites. The PEO-based nanofibers-reinforced composites showed an improvement of fracture toughness factors ($K_{IC} and G_{ IC}$) and ILSS, compared to the composites impregnated with PEO powders. These results were noted that the nanofibers had higher specific surface area and larger aspect ratio than those of the powder, which played an important role in improving the mechanical interfacial properties of the composites.