• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07b
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• pp.703-706
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• 2002

Piezoelectric thin film such as ZnO and AlN can be applicable to FBAR (Film Bulk Acoustic Resonator) device of thin film type and FBAR can be applicable to MMIC. The characteristic of FBAR device is variable according to the deposition conditions of piezoelectric thin film when preparation of thin film by sputtering method. In this study, we prepared ZnO thin film for FBAR using Facing Targets Sputtering apparatus which can be deposited fine Quality thin film because temperature increase of substrate due to the bombardment of high-energy particles can be restrained. And crystalline and c-axis preferred orientation of ZnO thin film with deposition conditions was investigated by XRD.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2006.10a
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• pp.56-59
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• 2006

The ITO thin films were prepared by FTS (Facing Targets Sputtering) system on polycarbonate (PC) substrate. The ITO thin films were deposited with a film thickness of 100nm at room temperature. As a function of sputtering conditions, electrical and optical properties of prepared ITO thin films were measured. The electrical and optical characteristics of the ITO thin films were evaluated by Hall Effect Measurement (EGK) and UV-VIS spectrometer (HP), respectively. From the results, the ITO thin film was deposited with a resistivity $8{\times}10^{-4}[{\Omega}-cm]$ and transmittance over 80%.

• Proceedings of the KIEE Conference
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• 2006.10a
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• pp.69-70
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• 2006

The ITO thin films were prepared by Facing Targets Sputtering(FTS) method on polyethersulfon(PES) substrate. The ITO thin films were deposited with the film thickness of 100nm at room temperature and working gas pressure of 1 mTorr. As a function of sputtering conditions, electrical and optical properties of prepared ITO thin films were evaluated by Hall Effect Measurement(EGK) and UV-VIS spectrometer(HP), respectively. From the results, the ITO thin films was deposited was with a resistivity $8.3{\times}10^{-4}[{\Omega}-cm]$ and transmittance over 80% in the visible range.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.406-407
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• 2007

We prepared indium zinc oxide (IZO) thin film for cathode electrode such as an application of flat panel display by using the facing targets sputtering (FTS) method at room temperature. The effects of input power and film thickness were investigated with respect to physical and optical properties of films such as deposition rate, electrical properties, microstructure and transmittance. We could obtain properties of IZO thin films of under $10^{-3}\;{\Omega}-cm$ in resistivity and the thin films of over 90% in transmittance. Also, we obtained IZO thin films which were an amorphous structure.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.04a
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• pp.39-40
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• 2006

We prepared ZnO:Al (AZO) thin films on polycarbonate (Pc) and polyethersulfon (PES). Because the polymer substrate has weak thermal resistance. The AZO thin films were deposited at room temperature by facing targets sputtering (FTS) method In the work, AZO thin films were deposited with different thickness in 1mTorr and $O_2$ gas flow rate 0.05. The electrical, optical and crystallographic properties were measured From the results, the resistivity of $7.3{\times}10^{-4}{\Omega}cm$ and transmittance of over 80% in visible range were obtained.

• Journal of the Korean institute of surface engineering
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• v.40 no.3
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• pp.144-148
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• 2007

To prepare the transparent electrode for electronic devices such as flat panel or flexible displays, solar cells, and touch panels; tin doped $In_2O_3$ (ITO) films with low resistivity and a high transparency were fabricated using a facing target sputtering (FTS) system at the various oxygen gas flow rate. The carrier concentration and mobility of ITO films were measured by Hall Effect measurement. And the transmittance was measured using the UV-VIS spectrometer. As a result, we can obtain the ITO thin films prepared at 10% oxygen gas flow ratio, thickness 150 nm with transmittance 85% and resistivity $8.1{\times}10^{-4}{\Omega}cm$ and surface roughness 5.01 nm.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.41-41
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• 2009

본 연구에서 사용한 대향 타겟식 스퍼터링(Facing Targets Sputtering) 법은 일반 스퍼터링 법의 단점을 보완한 고밀도 저온 고속성막이 가능한 장점을 가지고 있기 때문에 플랙시블 디스플레이의 기체 투과 방지막으로 많이 쓰이고 있는 SiOxNy, SiOx, SiNx의 박막을 다층으로 증착하여 polymer 기판 위에 조건에 따라 증착 후 박막의 특성을 연구하였다. 제작된 박막의 광학적 특성을 UV-VIS spectrophotometer(Shimadzu Co.)를 사용하여 200~1100nm의 파장 영역에서 광 투과도를 측정하였으며 박막의 두께와 균일도는 $\alpha$-step(Veeco Co.)을 사용하여 측정하였고, 절대 정량이 가능하고 비파괴 분석법인 RBS(KOBE STEEL LTD.)를 이용하여 표면의 성질을 규명하고 XRR(PANalytical X'Pert PRO)을 분석하여 박막의 계면영역에 대한 물성 변화를 평가하고 박막의 밀도를 측정하였다. SEM(Digital Instrument Co.) 사진을 통해 단면과 표면을 관찰하였고 구조적 특성은 AFM(Digital Instrument Co.)와 XRD(Rigaku Co.) 통해 측정하였고 박막의 성분비는 EDS(JEOL Co.)를 사용하였으며 투습률 측정장치 (MOCON)을 이용하여 WVTR를 측정하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.260-261
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• 2008

In this study, we investigated the properties of Indium Zinc Oxide (IZO) films prepared in facing targets sputtering (FTS) system at room temperature as function of oxygen contents. As as-deposited films were rapidly thermal annealing on air atmosphere of $400^{\circ}C$ for 30s. As a result, the transmittance of IZO films increased with increasing oxygen flow in the visible range. After rapidly thermal annealing to films, the optical properties of films improved than films deposited at R.T, but the electrical properties decreased. Before RTA treatment, the lowest resistivity IZO is $5.4\times10^{-4}[\Omega{\cdot}cm]$ at oxygen gas flow. But, after RTA treatment, IZO films have the value of lowest resistivity at the lower oxygen gas ratio in compare with before RTA treatment. The resistivity of IZO films is $7.29\times10^{-4}[\Omega{\cdot}cm]$ at pure argon atmosphere.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.151-154
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• 2003

AlN/Al/SiO$_2$/Si thin films for application to FBAR(Film Bulk Acoustic Resonator) devices were prepared by FTS(Facing Targets sputtering system) apparatus which provides a stable discharge at low gas pressures and can deposit high quality thin films because of the substrate located apart from the plasma. The AlN thin films were deposited on a $SiO_2(1{\mu}m)/Si(100)$ substrate using an Al bottom electrode. The process parameters were fixed such as sputering power of 200W, working pressures of 1mTorr and AlN thin film thickness of 800nm, respectively and crytallographic characteristics of AlN thin films were investigated as a function of $N_2$ gas flow rate$[N_2/(N_2+Ar)]$. Thickness of AlN thin films were measured by $\alpha$-step, the crystallographic characteristics and c-axis preferred orientation were evaluated by XRD.

• Journal of the Korean Vacuum Society
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• v.12 no.4
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• pp.214-217
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• 2003

In this study, we prepared ZnO thin film on $SiO_2$/Si substrate by FTS (Facing Targets Sputtering) apparatus which can reduce damage on the thin film because the bombardment of high-energy Particles such as ${\gamma}$-electron can be restrained. And, properties of thin filnl grown with ZnO buffer-layer which can be suppress initial growth layer was investigated. The crystalline and the c-axis preferred orientation of ZnO thin film was also investigated by XRD. As a result, we noticed that the ZnO thin film has a good crystallographic characteristic at thickness of ZnO buffer layer 10, 20 nm and working pressure 1 mTorr.