• Title/Summary/Keyword: FR4 PCB

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Wideband Low-Reflection Transmission Lines for Bare Chip on Multilayer PCB

  • Ramzan, Rashad;Fritzin, Jonas;Dabrowski, Jerzy;Svensson, Christer
    • ETRI Journal
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    • v.33 no.3
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    • pp.335-343
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    • 2011
  • The pad pitch of modern radio frequency integrated circuits is in the order of few tens of micrometers. Connecting a large number of high-speed I/Os to the outside world with good signal fidelity at low cost is an extremely challenging task. To cope with this requirement, we need reflection-free transmission lines from an on-chip pad to on-board SMA connectors. Such a transmission line is very hard to design due to the difference in on-chip and on-board feature size and the requirement for extremely large bandwidth. In this paper, we propose the use of narrow tracks close to chip and wide tracks away from the chip. This narrow-to-wide transition in width results in impedance discontinuity. A step change in substrate thickness is utilized to cancel the effect of the width discontinuity, thus achieving a reflection-free microstrip. To verify the concept, several microstrips were designed on multilayer FR4 PCB without any additional manufacturing steps. The TDR measurements reveal that the impedance variation is less than 3 ${\Omega}$ for a 50 ${\Omega}$ microstrip and S11 better than -9 dB for the frequency range 1 GHz to 6 GHz when the width changes from 165 ${\mu}m$ to 940 ${\mu}m$, and substrate thickness changes from 100 ${\mu}m$ to 500 ${\mu}m$.

Effect of Heat Treatment on Mechanical Reliability of Solder Joints in LED Package (LED 패키지 솔더 접합부의 기계적 신뢰성에 미치는 열처리의 영향)

  • Ko, Min-Kwan;Ahn, Jee-Hyuk;Lee, Young-Chul;Kim, Kwang-Seok;Yoon, Jeong-Won;Jung, Seung-Boo
    • Korean Journal of Metals and Materials
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    • v.50 no.1
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    • pp.71-77
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    • 2012
  • We studied the effect of heat treatment on the microstructures and mechanical strength of the solder joints in the Light Emitting Diode (LED) packages. The commercial LED packages were mounted on the a flame resistance-4 (FR4) Printed Circuit Board (PCB) in the reflow process, and then the joints were aged at $125^{\circ}C$ for 100, 200, 300, 500 and 1000 hours, respectively. After the heat treatment, we measured the shear strength of the solder joints between the PCB and the LED packages to evaluate their mechanical property. We used Pb-free Sn-3.0Ag-0.5Cu solder to bond between the LED packages and the PCBs using two different surface finishes, Electroless Nickel-Immersion Gold (ENIG) and Electroless Nickel-Electroless Palladium-Immersion Gold (ENEPIG). The microstructure of the solder joints was observed by a scanning electron microscope (SEM). (Cu,Ni)6Sn5 intermetallic compounds (IMCs) formed between the solder and the PCB, and the thickness of the IMCs was increased with increasing aging time. The shear strength for the ENIG finished LED package increased until aging for 300 h and then decreased with increasing aging time. On the other hand, in the case of an ENEPIG finished LED package, the shear strength decreased after aging for 500 h.

2.4GHz BPF Integrated into Multi-layer PCB Using Combline Structures (다층 인쇄회로기판에 집적된 Combline 구조의 2,4GHz 대역통화필터)

  • Kim, Joon-Yeon;Son, Mi-Hyun;Lee, Seong-Soo;Kim, Yong-Jun
    • Proceedings of the KIEE Conference
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    • 2001.11a
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    • pp.35-37
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    • 2001
  • 다층 인쇄 회로 기판에 Combline 구조를 가진 스트립 라인 또는 마이크로 스트립 라인 대역통과 필터를 구현하였다. 저 비용 구현과 이동성과 휴대성을 강조하기 위해 기존의 세라믹 대신 FR4 와 에폭시를 기반으로 하는 다층 회로 기판의 도체 층에 집적화하였다. Combline 각 끝단에 커패시터를 부하 함으로써 전기적 길이를 화장하였고 전체적인 크기를 감소시킴으로서 적당한 필터 특성을 얻을 수 있었다. 구현된 필터는 마이크로파 대역에서 사용 가능하며 특히 Bluetooth나 Wireless LAN 과 같은 ISM 대역을 사용하는 무선통신소자로서 사용 가능하다.

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An 8-Gb/s Inductorless Adaptive Passive Equalizer in 0.18-㎛ CMOS Technology

  • Moon, Joung-Wook;Choi, Woo-Young
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.12 no.4
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    • pp.405-410
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    • 2012
  • This paper presents an inductorless 8-Gb/s adaptive passive equalizer with low-power consumption and small chip area. The equalizer has a tunable RC filter which provides high-frequency gain boosting and a limiting amplifier that restores the signal level from the filter output. It also includes a feedback loop which automatically adjusts the filter gain for the optimal frequency response. The equalizer fabricated in $0.18-{\mu}m$ CMOS technology can successfully equalize 8-Gb/s data transmitted through up to 50-cm FR4 PCB channels. It consumes 6.75 mW from 1.8-V supply voltage and occupies $0.021mm^2$ of chip area.

Design of a High Performance Patch Antenna for GPS Communication Systems

  • Hamedi-Hagh, Sotoudeh;Chung, Joseph;Oh, Soo-Seok;Jo, Ju-Ung;Park, Noh-Joon;Park, Dae-Hee
    • Journal of Electrical Engineering and Technology
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    • v.4 no.2
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    • pp.282-286
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    • 2009
  • This paper presents the design of a patch antenna for GPS portable devices. The antenna is designed to operate at Ll band on an FR4 PCB with a thickness of 1.6mm, a dielectric constant of 3.8 and two metallization layers. The antenna has a dimension of 49mm${\times}$36mm and operates at 1.5754GHz with a return loss of -36dB and a measured bandwidth of 250MHz.

L-shaped Slot Antenna for WLAN MIMO Application (무선랜 MIMO용 L-형 슬롯 안테나)

  • Song, Won-Ho;Nam, Ju-Yeol;Lee, Ki-Yong;Lee, Young-soon
    • Journal of Advanced Navigation Technology
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    • v.20 no.4
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    • pp.344-351
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    • 2016
  • In the present study, a dual-band multiple-input-multiple-output (MIMO) antenna covering WLAN frequency bands of 2.4 GHz (2.4 ~ 2.484 GHz) and 5 GHz (5.15 ~ 5.825 GHz) is newly presented to avoid use of decoupling structure for increasing isolation. The antenna consists of two L-shaped slots with n-shaped slots etched on the floating ground plane surrounded by open ended L-shaped slots which are placed in the left and right corner of PCB respectively. The proposed antenna is designed and fabricated on one side of FR4 substrate with dielectric constant of 4.3, thickness of 1.6 mm, and size of $50{\times}50mm2$. It has been observed that the measured impedance bandwidths ($S_{11}{\leq}-10dB$) are 0.3 GHz (2.28 ~ 2.58 GHz) in 2.4 GHz frequency band and 0.89 GHz (5.11 ~ 6 GHz) in 5 GHz frequency band respectively. In addition, It has been observed that the whole efficiency are more than 80 % in the whole operating frequency band and envelope correlation coefficient of the antenna is less than 0.05 as a very small value in spite of nothing of the decoupling structure.

Design of an extremely miniaturized planar ring hybrid

  • Kang, In Ho;Sun, Shu Zhong
    • Journal of Advanced Marine Engineering and Technology
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    • v.37 no.7
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    • pp.752-759
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    • 2013
  • This paper presents a method for analyzing and designing an extremely miniaturized planar ring hybrid, using the combination of parallel and diagonally shorted coupled lines. In contrast to conventional miniaturized coupled line filters, it is proven that the required electrical length of transmission line can be largely reduced to even a few degrees, not only effectively suppressing the spurious passband but also approximately maintaining the same characteristic around the stable center frequency. A ring hybrid filter at center frequency of 1 GHz was fabricated on the FR4 epoxy glass cloth copper-clad plat (CCL) PCB substrate. The insertion loss of a ring hybrid filter with the die area of $30mm{\times}30mm$ is -4.68 dB. Simulated results are well agreed with the measurements.

Design of an extremely miniaturized branch-line coupler

  • Kang, In Ho;Li, Xi Qiang
    • Journal of Advanced Marine Engineering and Technology
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    • v.38 no.8
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    • pp.995-999
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    • 2014
  • In this paper, a new size-reduction approach for branch-line coupler is introduced which uses parallel end-shorted coupled lines with lumped capacitors. The characteristic of the new design was analyzed using even-odd mode method, and simulated on HFSS before fabricated on the FR4 epoxy glass cloth copper-clad plat (CCL) PCB substrate at center frequency of 1 GHz. The electrical length of transmission line was reduced to 15 degrees, therefore the size of branch-line coupler was largely reduced approximately maintaining the same characteristic around the stable center frequency. The insertion loss of the branch-line coupler filter was -4.39 dB. The size of the overall hybrid is $20mm{\times}20mm$. Measurements results were well agreed with the simulated ones.

Micro Balanced Filter in Magnetically Coupled LC Resonators (자기유도 결합 LC 공진기를 이용한 초소형 평형신호 여파기)

  • Park, Jong-Cheol;Park, Jae-Yeong
    • Proceedings of the KIEE Conference
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    • 2008.07a
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    • pp.1406-1407
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    • 2008
  • In this paper, a micro balanced filter in magnetically coupled LC resonators is proposed, designed, simulated by using FR-4 PCB substrate for low cost, small volume IEEE 802. 11a wireless LAN application. Two pair of coupled LC resonators using magnetic coupling of embedded inductors are applied to obtain bandpass transmission response and improve their phase and magnitude imbalance characteristics. In addition, high dielectric composite film is applied to fabricate the high Q MIM capacitors with small size and high capacitance density. It has an insertion loss of 1.4 dB, a return loss of 10 dB, a phase imbalance of 0.25 degree, and magnitude imbalance of 0.17 dB at frequency bandwidth of 200 MHz ranged from 5.15 GHz to 5.35 GHz, respectively. The proposed balanced filter has a small volume of $1.1mm{\times}1.3mm{\times}0.6mm$ (height).

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Design of CPW-Fed Small Multi-Band Antenna by Using Band Rejection Semicircle Slot

  • Li, Xiao;Lee, Seung-Woo;Kim, Nam;Kim, Chul-Ho
    • Journal of electromagnetic engineering and science
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    • v.11 no.3
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    • pp.207-212
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    • 2011
  • This paper presents a CPW-fed antenna with three slots. The proposed antenna can operate at 1.9~2.1 GHz and 2.9~3.3 GHz which are generated by the two rectangular slots, and 4.5~11.6 GHz which is generated by the main patch. The semicircle-slot is used as a band-notched filter to stop at a desired band (5.150~5.825 GHz) limited by IEEE 802.11a or HIPERLAN/2 applications. The currents concentrate around corresponding slots at the desired band. The proposed antenna is very small in size, with overall dimensions of $27{\times}32{\times}1\;mm^3$ etched onto an FR4-printed circuit board (PCB).