• Journal of the Korean Society for Heat Treatment
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• v.15 no.6
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• pp.260-268
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• 2002

The effects of calcium and silicon on microstructure and aging characteristics of AZ91 magnesium alloy during T5 treatment was investigated. The addition of 0.88% calcium or 0.25% silicon to AZ91 alloy made dendrite cell smaller. Especially, silicon is more effectively acted as refinement of the dendrite cell than calcium. It is due to that $Mg_2Si$ precipitated at the dendrite cell boundary or in the matrix during T5 treatment of Si added AZ91 alloy retarded the growth of the secondary phase. In the mean while, without inducing the precipitates containing calcium, calcium was segregated mainly around secondary phase such as $Mg_{17}Al_{12}$ and partially dissolved in ternary eutectic (Mg-Al-Ca) structure. In the AZ91 alloy containing both silicon and calcium, more finely distributed $Mg_2Si$ in matrix homogeneously and much finer microstructure were obtained than those containing silicon or calcium. Hence, An AZ91 containing both silicon and calcium was more effective to retarding the growth of the secondary phase than the other AZ91 alloy such as AZ91 alloy containing silicon or AZ91 alloy containing calcium.

• Journal of Korea Foundry Society
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• v.27 no.5
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• pp.221-223
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• 2007

공구강은 C, Cr, V, Mo, W, Co 및 Si 과 같은 첨가원소를 함유한 복잡한 철계 합금으로 주요 특성인 경도, 부식저항성, 열 연화저항성 그리고 인성의 요구수준에 따라 화학성분이 결정된다. 본 연구에서는 1.0C, 0.2Mn, 3.8Cr, 1.5W, 8.5Co, 9.2Mo, 1.0V 조성의 M42 공구강의 미세조직과 열간가공성에 미치는 Si 함량의 효과를 체계적으로 조사하였다. 진공유도용해를 이용하여 Si 함량을 중량비로 0.33 에서 1.7% 까지 변화시켜 $140{\times}140{\times}330\;mm^{3}$ 크기의 잉곳으로 제조하였다. 이렇게 제조한 잉곳들은 $1150^{\circ}C$에서 1.5시간 동안 용체화처리한 후 노냉하였고, 이어 $1180^{\circ}C$에서 15mm 두께의 판재로 열간압연하였다. 공정 탄화물의 형상 및 분해 거동을 중심으로 미세조직을 관찰한 결과 Si 함량이 증가함에 따라 분해속도가 느려지는 것을 알 수 있었고 이로 인해 열간성형성이 급격히 저하되는 것으로 나타났다.

• Journal of Korea Foundry Society
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• v.17 no.4
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• pp.327-337
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• 1997

The current understanding of the mechanism of inoculation of the eutectic in commercial Fe-C-Si alloys using either silicon containing alloys or graphite has been discussed. The mechanism whereby inclusion formation within a cast iron melt is essential for inoculation effectiveness in ferro silicon inoculation has been reviewed. The role of graphitic inoculants has been presented, including the results of recent research that confirms the inoculating capability of graphite and demonstrates those factors which must be considered in evaluating inoculation effectiveness. Fading of inoculation, both ferro silicon and graphite, and the mechanism whereby this occurs, has also been discussed.

• Journal of the Korean Ceramic Society
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• v.26 no.1
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• pp.139-145
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• 1989

An eutectic melt in the system(Bi2O3)0.85·(Nb2O5)0.15-6Bi2O3·SiO2 was unidirectionally solidfield at a rate of 0.5mm/h under a thermal gradient of 100℃/cm. Double crucibles and seed crystal plate were used in order to botain the composite crystals which had uniform microstructure throughout the ingot. The obtained composite crystals showed uniform microstructure, in which needle-like δ-(Bi2O3)0.85·(Nb2O5)0.15 crystals were arrayed in parallel in a matrix of γ-6Bi2O3·SiO2 single crystal. It was found that the <110> direction of δ-(Bi2O3)0.85·(Nb2O5)0.15 crystal was essentially parallel to the <111> direction of γ-6Bi2O3·SiO2 crystal in the composite crystals. A transverse thin plate of the composite crystals showed a high resolution optical transmission like an optical fiber array, and sharp chatoyancy was observed in the cabochon shaped composite crystals. Then, this may be useful for applications such as screen of a cathode ray tube or artificial cat's eye gem stones.

• Transactions of Materials Processing
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• v.8 no.3
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• pp.233-233
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• 1999

To investigate the effect of tungsten addition on mechanical properties, we prepared refractory (62χ)Nb-18Si-l00Mo-l0Ti-χW (χ=0, 5, 10 and 15 mol.%) in-situ composites by the conventional arc-casting technique, and then explored the microstructure, hardness and elastic modulus at ambient temperature and tensile properties at 1670 K. The microstructure consists of relatively fine (Nb, Mo, W, Ti)/sub 5/Si₃, silicide and a Nb solid solution matrix, and the fine eutectic microstructure becomes predominant at a Si content of around 18 mol.%. The hardness of (Nb, Mo, W, Ti(/sub 5/Si₃, silicide in a W-free sample is 1680 GPa, and goes up to 1980 GPa in a W 15 mol.% sample. The hardness, however, of Nb solid solution does not exhibit a remarkable difference when the nominal W content is increased. The elastic modulus shows a similar tendency to the hardness. The optimum tensile properties of the composites investigated are achieved at W 5 mol.% sample, which exhibits a relatively good ultimate strength of 230 MPa and an excellent balance of yield strength of 215 MPa, and an elongation of 3.7%. The SEM fractography generally indicates a ductile fracture in the W-free sample, and a cleavage rupture in W-impregnated ones.

• Korean Journal of Metals and Materials
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• v.48 no.3
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• pp.248-255
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• 2010

The effect of various alloying elements and melt treatment on the microstructural control of Al-Sn metallic bearing alloy was investigated. The thickness of tin film crystallized around primary aluminum decreased with the addition of 5% Cu in Al-Sn alloy, with tin particles being reduced in size by intervening the Ostwald ripening. With the addition of Si in Al-10%Sn alloy, the tin particles were crystallized with eutectic silicon, resulting in uniform distribution of tin particles. With the addition of Cu and Si in Al-Sn alloy, both the tensile strength and yield strength increased, with the increasing rate of yield strength being less than that of tensile strength. Although the Al-10%Sn-7%Si alloy has similar tensile strength compared with Al-10%Sn-5%Cu, the former showed superior abrasion resistance, resulting from preventing the tin particles from movement to the abrasion surface.

• Journal of the Korean Society for Heat Treatment
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• v.35 no.1
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• pp.1-7
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• 2022

In this study, dissolution and melting phenomenon of the Al₂Cu was studied for the high-strength Al-Si-Cu aluminum alloy in automobile component. The Solution heat treatment was performed at 480℃ and 510℃ for 4hours. Microstructure analysis of the specimen was performed using the optical micrograph and scanning electron microscope for qualitative and quantitative analysis of various phases, the chemical composition of secondary phases was achieved by energy dispersive spectroscopy (EDS) and electron probe micro analysis (EPMA). As a result of the electron probe micro analysis, a plate like Al₂Cu phase was observed, and eutectic Si phase was observed of a coarsen plate shape. At a temperature of 510, necking phenomenon occurs in a specific part of plate like Al₂Cu, and it is segmented and dissolved in the Al matrix. When the temperature of the alloy exceeds the melting point of Al₂Cu, incipient melting occurs at the grain boundary of undissolved Cu particles

• Journal of Welding and Joining
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• v.15 no.5
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• pp.134-143
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• 1997

The formation of thick alloyed layer with high Si content have been investigated on the surface of Al alloy (A5083) plate by PTA process with Si powder. Hardening characteristics and wear resistance of alloyed layer was examined in relation to the microstructure of alloyed layer. Thick hardened layer in mm-order thickness on the surface of A5083 plate can be formed by PTA process with wide range of process condition by using Si powder as alloying element because of eutectic reaction of Al-Si binary alloy. High temperature and rapid solidification rate of molten pool, which are features of PTA process, enable the formation of high Si content alloyed layer with uniform distribution of fine primary Si paticle. High plasma arc current was beneficial to make the alloyed layer with smooth surface appearance in wide range of powder feeding rate, because enough volume of molten pool was necessary make alloyed layer. Uniform dispersion of fine primary Si particle with about 30${\mu}{\textrm}{m}$ in particle size can be obtained in layer with Si content ranging from 30 to 50 mass %. Hardness of alloyed layer increased with increasing Si content, but increasing rate of hardness differed with macrostructure of alloyed layer. Wear resistance of alloyed layer depended on $V_{si}$(volume fraction of primary Si) and was remarkably improved to two times of base metal at 20-30% $V_{si}$ without cracking, but no more improvement was obtained at larger $V_{si}$.

• Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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• v.16 no.3
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• pp.309-313
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• 2018

In this study, we prepared Li-K-Cd alloy, which meets the requirement of eutectic ratio of Li:K, to maintain the operating temperature of the drawdown process at $500^{\circ}C$ and to achieve the reuse of LiCl-KCl molten salt. The prepared Li-K-Cd alloys were added to LiCl-KCl salt bearing U and Nd at $500^{\circ}C$ to investigate the removal of $UCl_3$ in the salt. The reduction of $UCl_3$ in the salt was examined by measuring the OCP value of salt and analyzing the salt composition by ICP-OES. Reduction was also visually confirmed by change of salt color from dark purple to white. The experimental results reveal that the prepared Li-K-Cd alloy has reductive extractability for $UCl_3$ in salt. By improving the preparation method, the Li-K-Cd alloy can be applied to the drawdown process.

• Korean Journal of Metals and Materials
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• v.49 no.5
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• pp.411-418
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• 2011

The current study investigates the electroplating characteristics of Sn-Cu eutectic micro-bumps electroplated on a Si chip for flip chip application. Under bump metallization (UBM) layers consisting of Cr, Cu, Ni and Au sequentially from bottom to top with the aim of achieving Sn-Cu bumps $10\times10\times6$ ${\mu}m$ in size, with 20${\mu}m$ pitch. In order to determine optimal plating parameters, the polarization curve, current density and plating time were analyzed. Experimental results showed the equilibrium potential from the Sn-Cu polarization curve is -0.465 V, which is attained when Sn-Cu electro-deposition occurred. The thickness of the electroplated bumps increased with rising current density and plating time up to 20 mA/$cm^2$ and 30 min respectively. The near eutectic composition of the Sn-0.72wt%Cu bump was obtained by plating at 10 mA/$cm^2$ for 20 min, and the bump size at these conditions was $10\times10\times6$ ${\mu}m$. The shear strength of the eutectic Sn-Cu bump was 9.0 gf when the shearing tip height was 50% of the bump height.