• Journal of Sensor Science and Technology
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• v.10 no.6
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• pp.279-285
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• 2001

In this study, we fabricated the microlens array using very simple and economical method which used Si molds made by bulk etching in HNA and spreaded SU-8 on top of the Si mold. And, we developed fabrication conditions for high fill factor microlens array that is $45{\mu}m$ in height and $150{\mu}m$ in diameter. This microlens array can be used for imaging system like IR detector or projection display. It is expected that it can improve the characteristics of these devices.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.912-915
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• 2004

Inductors material utilized in the downsizing passive devices and Rf components requires the physical and electrical properties at given area such as inductors thickness reduction, inductance and q-factor increase, low leakage current and thermal stability. In this study, Spiral inductors on the $SiO_2/Si$(100) substrate were fabricated by the magnetron sputtering method. Cu thin film with the thickness of $2{\mu}m$ was deposited on the substrate. Also we fabricated square inductors through the wet chemical etching technique. The inductors are completely specified by the turn width and the spacing between spirals. Both the width and spacing between spirals were varied from 10 to $60{\mu}m$ and from 20 to $70{\mu}m$, respectively. Inductance and Q factor dependent on the RF frequency were investigated to analyze performance of inductor arrays

• Current Photovoltaic Research
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• v.6 no.1
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• pp.27-30
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• 2018

The dependency of the electrical characteristics of silicon solar-cells on the depth of damaged layer induced by wire-sawing process was investigated. To compare cell efficiency with residual sawing damage, silicon solar-cells were fabricated by using as-sawn wafers having different depth of saw damage without any damaged etching process. The damaged layer induced by wire-sawing process in silicon bulk intensely influenced the value of fill factor on solar cells, degrading fill factor to 57.20%. In addition, the photovoltaic characteristics of solar cells applying texturing process shows that although the initial depth of saw-damage induced by wire-sawing process was different, the value of short-circuit current, fill-factor, and power-conversion-efficiency have an almost same, showing ~17.4% of cell efficiency. It indicated that the degradation of solar-cell efficiency induced by wire-sawing process could be prevented by eliminating all damaged layer through sufficient pyramid-surface texturing process.

• Transactions of the Society of Information Storage Systems
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• v.2 no.3
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• pp.163-168
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• 2006

Small form factor optical pickup (SFFOP) corresponding to BD specifications is strongly proposed for the next-generation portable storage device. In order to generate SFFOP, small sized optical pickup has been fabricated. We have developed a small sited optical pickup that is called the integrated optical pickup (IOP). The fabrication method of this system is mainly dependant on the use of the wafer based micro fabrication technology, which has been used in MEMS process such as photolithography, reactive ion etching, wafer bonding, and packaging process. This approach has the merits for mass production and high assembling accuracy. In this study, to generate the small sized optical pickup for high recording capacity, IOP corresponding to BD specifications has been designed and developed, including three main parts, 1) design, fabrication and evaluation of objective lens unit, 2) design and fabrication of IOP and 3) evaluation process of FES and TES.

• Journal of IKEEE
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• v.12 no.3
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• pp.138-143
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• 2008

In this study, we propose that the structures of spiral inductors have the environment advantage utilizing direct-write and LAM(Laser Ablation of Microparticles) processes without process step of lithography and etching etc. of existing semiconductor process. The structures of inductors have Si thickness of 540${\mu}m$, $SiO_2$ thickness of 3${\mu}m$. The width of Cu coils and the space between segments have 30${\mu}m$, respectively, using for direct-write and LAM processes. The performance of spiral planar inductors was simulated to frequency characteristics for inductance, quality-factor, SRF(Self- Resonance Frequency) using HFSS. The inductors without underpass and via have inductance of 1.11nH over the frequency range of 300 to 800 MHz, quality-factor of maximum 38 at 5 GHz, SRF of 18 GHz. Otherwise, inductors with underpass and via have inductance of 1.12nH over the frequency range of 300 to 800 MHz, quality-factor of maximum 35 at 5 GHz, SRF of 16 GHz.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.20 no.11
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• pp.767-774
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• 2008

This paper presented the heat transfer and pressure drop characteristics for micro plate heat exchanger with straight channel. The metal sheets for straight channel are manufactured by chemical etching and fabricated micro plate heat exchangers by using the vacuum brazing of bonding technology. The performance experiments are performed within the Reynolds numbers range of 15$\sim$250 under the same flow rate conditions for hot and cold sides. The inlet temperature of hot and cold water are conducted in the range of $30^{\circ}C{\sim}50^{\circ}C$ and $15^{\circ}C{\sim}25^{\circ}C$, respectively. Heat transfer rate and pressure drop are evaluated by the Reynolds numbers and mass flow rates as the inlet temperature variations of the hot and cold sides. Correlations of Nusselt number and friction factor are suggested for micro plate heat exchanger with straight channel using the results of performance experiment.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.60 no.2
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• pp.362-369
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• 2011

In this paper, optimal deep reactive ion etching (DRIE) process conditions for fused quartz were experimentally determined by Taguchi method, and fused quartz-based micro cantilevers were fabricated. In addition, comparative study on Q-factors of fused quartz and silicon micro cantilevers was performed. Using a silicon layer as an etch mask for fused quartz DRIE process, different 9 flow rate conditions of $C_4F_8$, $O_2$ and He gases were tested and the optimum combination of these factors was estimated. Micro cantilevers based on fused quartz were fabricated from this optimal DRIE condition. Through conventional silicon DRIE process, single-crystalline silicon micro cantilevers whose dimensions were similar to those of quartz cantilevers were also fabricated. Mechanical Q-factors were calculated to compare intrinsic damping properties of those two materials. Resonant frequencies and Q-factors were measured for the cantilevers having fixed widths and thicknesses and different lengths. The Q-factors were in a range of 64,000 - 108,000 for fused quartz cantilevers and 31,000 - 35,000 for silicon cantilevers. The experimental results supported that fused quartz had a good intrinsic damping property compared to that of single crystalline silicon.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.31-34
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• 2016

System In Package (SiP) is getting popular and momentum for the recent wearable, IoT and connectivity application apart from mobile phone. This is driven by market demands of cost competitive, lighter and smaller/thinner and higher performance. As one of many semiconducting assembly products, Leadframe product has been widely used for low cost solution, light/ small and thin form factor. But It has not been applied for SiP although Leadframe product has many advantages in cost, size and reliability performance. SiP is mostly based on laminate substrate and technically difficult on Leadframe substrate because of a limitation in SMT performance. In this paper, Leadframe based SiP product has been evaluated about key technical challenges in SMT performance and electrical shield technology. Mostly Leadframe is considered not available to apply EMI shield because of tie-bar around package edge. In order to overcome two major challenges, connection bars were deployed properly for SMT pad to pad and additional back-side etching was implemented after molding process to achieve electrical isolation from outer shield coating. This product was confirmed assembly workability as well as reliability.

• Journal of the Korean Society for Precision Engineering
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• v.25 no.11
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• pp.90-94
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• 2008

Recently, a great deal of research is focused on the printed electronics. One of their mainly concerned products is printed RFID tag. RFID technology has attracted researchers and enterprises as a promising method for automatic identification, and they are expected to replace conventional bar codes in inventory tracking and management. The key to successful RFID technology lies in developing low-cost RFID tags and the first step in applying printing technology to RFID systems is to replace antennas that are conventionally produced by etching copper or aluminum. However, due to the printing quality variations, errors, and lower conductivity, the performance of the printed RFID antennas is lower than that of antennas manufactured by conventional etching methods. In this paper, the effect of variations in the printing conditions on the antenna performance is investigated. Three levels for each condition parameter is assumed and effect on the resonant frequency are examined experimentally based on orthogonal array. The most serious factor that affects the resonant frequency of the antenna is the non-uniformity of the edge and the resonant frequency is found to be lower as the non-uniformity increases.

• Journal of Radiation Protection and Research
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• v.13 no.2
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• pp.57-66
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• 1988

A series of experiments is performed to measure radon concentration in the near-surface soil gas at the four locations (Cheju-Si, Seoguipo-Si, Taejeong-eup, Seongsan-eup) in Cheju Island, using CR-39 detectors placed inside radon cups. Two types of radon cups are installed in shallow holes of about 15 cm in diameter and 50cm in depth. The optimum etching conditions, i.e., the concentration of NaOH solution, etchant temperature and etching time, are found to be 625N, $70^{\circ}C$ and 5.5 hours for CR-39 detectors. A typical conversion factor of radon cup is calculated as $$1track/mm^3{\cdot}30day=0.059Bq/{\ell}$$. Average radon concentrations over 30 days measured in Cheju Island from May 1, 1987 to April 23, 1988 are $3.1{\pm}0.3Bq/{\ell}$ for open radon cups and $1.7{\pm}0.2Bq/{\ell}$ for closed radon cups.