1 |
M. A. Green, Y. Hishikawa, W. Warta, E. D. Dunlop, D. H. Levi, J. Hohl-Ebinger, A. W. Y. Ho-Baillie, "Solar cell efficiency tables (version 50)", Progress in Photovoltaics: Research and Applications, Vol. 25, pp. 668-676, 2017.
|
2 |
H. J. Moller, C. Funke, M. Rinio, S. Scholz, "Multicrystalline silicon for solar cells", Thin Solid Films, Vol.487, pp. 179-187, 2005.
DOI
|
3 |
A. Louwen, W. van Sark, R. Schropp, A. Faaij, "A cost roadmap for silicon heterojunction solar cells", Sol. Energy Mater. Sol. Cells, Vol. 147, pp. 295-314, 2016.
DOI
|
4 |
B. Sopori, S. Devayajanam, S. Shet, D. Guhabiswas, P. Basnyat, H. Moutinho, L. Gedvilas, K. Jones, J. Binns, "Characterizing damage on si wafer surfaces cut by slurry and diamond wire sawing", J. Appel, Photovoltaic Specialists Conference (PVSC), pp. 0945-0950, 2013.
|
5 |
C. W. Hardin, J. Qu, J. Shih, "Fixed abrasive diamond wire saw slicing of single-crystal silicon carbide wafers", Mater. Manuf. Process. Vol. 19, No. 2, pp. 355-367, 2004.
DOI
|
6 |
K. Chen, Y. Liu, X. Wang, L. Zhang, X. Su, "Novel texturing process for diamond-wire-sawn single-crystalline silicon solar cell", Sol. Energy Mater. Sol. Cells Vol. 133, pp. 148-155, 2015.
DOI
|
7 |
N. Watanabe, Y. Kondo, D. Ide, T. Matsuki, H. Takato, I. Sakata, "Characterization of polycrystalline silicon wafers for solar cells sliced with novel fixed-abrasive wire", Prog. Photovolt: Res. Appl. Vol. 18, pp. 485-490, 2010.
DOI
|
8 |
X. Yu, P. Wang, X. Li, D. Yang, "Thin Czochralski silicon solar cells based on diamond wire sawing technology", Sol. Energy Mater. Sol. Cells Vol. 98, pp. 337-342, 2012.
DOI
|
9 |
A. Kumar, S. Kaminski, S. N. Melkote, C. Arcona, "Effect of wear of diamond wire on surface morphology, roughness and subsurface damage of silicon wafers", Wear, Vol. 364, pp. 163-168, 2016.
|
10 |
W. Chen, X. Liu, M. Li, C. Yin, L. Zhou, "On the nature and removal of saw marks on diamond wire sawn multicrystalline silicon wafers", Mater. Sci. Semicond. Process Vol. 27, pp. 220-227, 2014.
DOI
|
11 |
J. M. Kim, Y. K. Kim, "Saw-damage-induced structural defects on the surface of silicon crystals", J. Electrochem. Soc. Vol. 152, No. 3, pp. G189-G192, 2005.
DOI
|
12 |
P. Fath, G. Wileke, E. Bucher, J. Szlufcik, R. M. Murti, K. De Clercq, J. Nijs, R. Mertens, "Mechanical wafer engineering for high efficiency solar cells: an investigation of the induced surface damage", Proc. 24th IEEE Photovoltaic Specialists Conf., Vol. 2, pp. 1347-1350, 1994.
|
13 |
B. Sopori, S. Devayajanam, P. Basnyat, "Surface characteristics and damage distributions of diamond wire sawn wafers for silicon solar cells", AIMS Materials Science Vol. 3, No. 2, pp. 669-685, 2016.
DOI
|
14 |
H. Seogneur, E. J. Schneller, N. S. Shiradkar, W. V. Schoenfeld, "Effect of diamond wire saw marks on solar cell performance", Energy Procedia Vol. 92, pp. 386-391, 2016.
DOI
|