• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.5
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• pp.300-305
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• 2015

$WO_3$, $SiO_2$, and $TiO_2$ films with hydrophilic property are deposited by rf-magnetron sputtering. Their wettability is strongly depends on the presence or absence of the oxygen plasma etching on the glass substrates. The $TiO_2$ film of 50 nm-thick on the plasma etched glass shows a water contact angle (WCA) below $5^{\circ}$ which means a super-hydrophilic surface. However, WCA values are gradually degraded when the films are exposed under atmosphere, especially $WO_3$. In order to improve hydrophilic property, the degraded films can be again recovered by UV illumination for 10 sec using UV-light and the $TiO_2$ film shows a super-hydrophilic surface about $3^{\circ}$.

• Restorative Dentistry and Endodontics
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• v.29 no.4
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• pp.353-364
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• 2004

The purpose of this study was to compare and to evaluate the combination use of 5 kinds of dentin adhesive systems and 5 kinds of composite resins using micro-shear bond test. Five adhesive systems (Prime & Bond NT (PBN). Onecoat bond (OC), Excite (EX), Syntac (SY), Clearfil SE bond (CS)) and five composite resins (Spectrum (SP), Synergy Compact (SC), Tetric Ceram (TC), Clearfil AP-X (CA), Z100 (Z1)) were used for this study ($5{\;}{\times}{\;}5{\;}={\;}25group$, n =14/group). The slices of horizontally sectioned human tooth were bonded with each bonding system and each composite resin, and tested by a micro-shear bond strength test. These results were analyzed statistically. The mean micro-shear bond strength of dentin adhesive systems were in order of CS (22.642 MPa), SY (18.368 MPa), EX (14.599 MPa). OC (13.702 MPa). PBN (12.762 MPa). The mean bond strength of self-etching primer system group (CS, SY) in dentin was higher than that of self-priming adhesive system groups (PBN, EX, OC) significantly (P<0.05). The mean bond strength of composite resins was in order of SP (19.008 MPa), CA (17.532 MPa). SC (15.787 MPa), TC (15.068 MPa). Z1 (14.678 MPa). Micro-shear bond strength of SP was stronger than those of other composite resins significantly (P < 0.05). And those of TC and Z1 were weaker than other composite resins significantly (P < 0.05). No difference was found in micro-shear bond strength of composite resin in self-etching primer adhesive system groups (CS, SY) statistically. However, there was significant difference of micro-shear bond strength of composite resin groups in self-priming adhesive systems group (PBN, EX, OC). The combination of composite resin and dentin adhesive system recommended by manufacturer did not represent positive correlation. It didn't seem to be a significant factor.

• Journal of the Korean Magnetics Society
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• v.6 no.6
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• pp.367-374
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• 1996

The developmement of electronic machine industries requires miniature of size as well as increasement of driving frequency in electronic parts, recently. To realize micro-struture of magnetic devices, in this study, we fabricated thin film inductors by using thin film manufacturing techniques such as photolithography and wet etching process, and these devices are measured at high frequency range of 1 MHz~1 GHz. The results are as follows. The accurate measuring technique by using network analyzer system having microstrip line was established. The manufactured inductors are fabricated with several ten micrometers by means of wet etching process known as easier and more economic than dry etching process. VVhen the device size of two types (spiral, meander) is the same, inductance value L and quality factor Q of spiral type devices are larger than those of meander type, but driving frequency of spiral type is lower than that of meander type due to increasement of inductance L. It is necessary to decrease resistance value R by increasing cross section of the conductor film coil. Thus high frequency measuring method would be a very useful for another measuring fields of the range over several hundreds MHz.

• Journal of the Semiconductor & Display Technology
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• v.22 no.3
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• pp.130-135
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• 2023

Plasma-resistant ceramic (PRC) is a material used to prevent internal damage in plasma processing equipment for semiconductors and displays. The challenge is to suppress particles falling off from damaged surfaces and increase retention time in order to improve productivity and introduce the latest miniaturization process. Here, we confirmed the effect of suppressing plasma deterioration and reducing the etch rate through surface treatment of existing PRC with an initial illumination level of 200 nm. In particular, quartz glass showed a decrease in etch rate of up to 10%. Furthermore, it is believed that micro-scale secondary particles formed on the microstructure of each material grow as crystals during the fluoridation process. This is a factor that can act as a killer defect when dropped, and is an essential consideration when analyzing plasma resistance. The plasma etching suppression effect of the initial illumination is thought to be due to partial over etching at the dihedral angle of the material due to the sputtering of re-emission of Ar+-based cations. This means that plasma damage due to densification can also be interpreted in existing PRC studies. The research results are significant in that they present surface treatment conditions that can be directly applied to existing PRC for mass production and a new perspective to analyze plasma resistance in addition to simple etching rates.

• Journal of ILASS-Korea
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• v.16 no.1
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• pp.27-36
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• 2011

The impact force on the single and overlap region of twin spray was experimentally evaluated using visualization method in full cone type swirl nozzle spray. Visualization of spray was conducted to obtain the spray angle and breakup process. The photography/imaging technique, based on Particle Image Velocimetry (PIV) using high-speed camera, was adopted for the direct observation of droplet motion and axial velocity measurement, respectively. Droplet size was measured by Particle Motion Analyze System (PMAS). The purpose of this study is to provide fundamental information of spray characteristics, such as impact force, for higher etching factor in the practical wet etching system. It was found that the spray angle, axial velocity and impact force were increased with increasing the nozzle pressure while droplet size decreased with increasing the nozzle pressure. Droplet size increased as the distance from nozzle tip was decreased. The impact force of twin spray in the overlap region was about 63.29, 67.02, 52.41% higher than that of single spray at 40, 50 and 60 mm of nozzle pitch, respectively. Also, the nozzle pitch was one of the important factors in the twin spray characteristics.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.6
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• pp.458-464
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• 1998

This paper gives characterization of substrate and PZT(53/47) thin film deposited by metalorganic decomposition, which is concerned in deposition process and device fabrication process, to fabricate micro electro mechanical system (MEMS) device with piezoelectric material. The PZT thin films deposited by MOD at 700^{\circ}C$ for 30 minutes had a polycrystallinity, that is, no substrate dependence, while different interface were developed depending on the bottom electrodes. Such a structural variation could influence on not only the properties of the PZT film but also etching process for fabricating MEMS devices. Therefore the electrode structure is a very important factor in the deposition of the PZT film during etching process by HF acid for MEMS device with piezoelectric material. Piezoelectric coefficients of the PZT films on the different substrates were 40 and 80 pm/V at an applied voltage of 4V. Based in these results, it was possible for deposition of the PZT film by MOD to apply MEMS device fabrication process based on piezoelectricity after selection of proper bottom electrode.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.263-263
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• 2011

본 연구에서는 DBD (Dielectric Barrier Discharge)방식의 상압 플라즈마를 이용하여 FPD (flat panel display) 공정에 사용되는 a-Si, Si3N4의 식각 공정 특성을 평가하였다. 사용된 DBD 반응기는 기존의 blank planar plate 형태의 Power가 인가되는 anode 부분과 Dielectric Barrier 사이 공간을 액상의 도전체로 채워 넣은 형태의 전극이 사용 하였으며, 인가 Power는 40kHz AC 최대인가 전압 15 kVp를 사용 하였다. 방전 가스는 N2, 반응가스로는 CDA (Clean Dry Air)와 NF3, 액상의 Etchant를 사용 하였으며 모든 공정은 In-line type으로 시편을 처리 하였다. NF3의 경우 30 mm/sec 이송속도 1회 처리 기준 a-Si 1300${\AA}$, Si3N4 1900${\AA}$의 식각 두께를 보였으며 a-Si : Si3N4 선택비는 N2, CDA의 조절을 통하여 최대 1:2에서 4:1 정도까지 변화가 가능하였다. 균일도는 G2 (370 mm${\times}$470 mm)의 경우 5.8 %의 균일도를 보이고 있다. 이외에도 NF3 공정의 경우 실제 TFT-LCD 공정 중 n+ channel (n+ a-Si:H)식각 공정에 적용하여 5.5 inch LCD panel feasibility를 확인 할 수 있었다. 액상 Etchant (HF수용액, NH4HF2)는 버블러를 사용하여 기화 시켜 플라즈마 소스를 통해 1차적으로 활성화 시키고 기존 DBD 반응기에 공급해 주는 형태로 평가를 진행하였다. 식각 특성은 30mm/sec 이송속도에서 a-Si $25{\AA}$ 정도로 가스 형태의 Etchant에 비해 매우 낮은 수준이나 Etching rate 향상을 위한 factor 파악 및 개선을 위한 연구를 진행 하였다.

• Journal of Electrical Engineering and information Science
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• v.2 no.6
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• pp.212-216
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• 1997

A new metal tip fabrication process for low voltage operation is reported in this paper. The key element of the fabrication process is that isotropic silicon etching and oxidation process used in silicon tip fabrication is utilized for gate hole size reduction and gate oxide layer. A metal FEA with 625 tips was fabricated in order to demonstrate the validity of the new process and submicron gate apertures were successfully obtained from originally 1.7$\mu\textrm{m}$ diameter mask. The emission current above noise level was observed at the gate bias of 50V. The required gate voltage to obtain the anode current of 0.1${\mu}\textrm{A}$/tip was 74V and the emission current was stable above 2${\mu}\textrm{A}$/tip without any disruption. The local field conversion factor and the emitting area were calculated as 7.981${\times}$10\ulcornercm\ulcorner and 3.2${\times}$10\ulcorner$\textrm{cm}^2$/tip, respectively.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.32 no.12
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• pp.915-923
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• 2008

The performance experiments for a microchannel printed circuit heat exchanger (PCHE) of high-performance and high-efficiency on the two technologies of micro photo-etching and diffusion bonding were performed in this study. The microchannel PCHE were experimentally investigated for Reynolds number in ranges of 100 $\sim$ 700 under various flow conditions in the hot side and the cold side. The inlet temperatures of the hot side were conducted in range of $40^{\circ}C\;{\sim}\;50^{\circ}C$ while that of the cold-side were fixed at $20^{\circ}C$. In the flow pattern, the counter flow was provided 6.8% and 10 $\sim$ 15% higher average heat transfer rate and heat transfer performance than the parallel flow, respectively. The average heat transfer rate, heat transfer performance and pressure drop increases with increasing Reynolds number in all the experiment. The increasing of inlet temperature in the experiment range has not an effect on the heat transfer performance while the pressure drop decrease slightly with that of inlet temperature. The experimental correlations to the heat transfer coefficient and pressure drop factor as a function of the Reynolds number have been suggested for the microchannel PCHE.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.890-893
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• 2004

In this study, Spiral inductors on the $SiO_2/Si$(100) substrate were fabricated by the magnetron sputtering method. Cu thin film with the thickness of 2 ${\mu}m$ was deposited on the substrate. Also we fabricated square inductors through the wet chemical etching technique. The inductors are completely specified by the turn width and the spacing between spirals. Both the width and spacing between spirals were varied from 10 to 60${\mu}m$ and from 20 to 70 ${\mu}m$, respectively. Inductance and Q factor dependent on the frequency were investigated to analyze performance of spiral inductors.